A waterproof circuit board

Abstract

The utility model discloses a waterproof circuit board, it includes the casing, the inside of casing is equipped with silica gel water absorption layer, the surface crimping of silica gel water absorption layer has waterproof and ventilative layer, the inside of casing is equipped with the inner chamber, the inner wall solid of inner chamber is equipped with the heat conduction plate, the top of heat conduction plate is equipped with the circuit board body, the bottom solid of heat conduction plate is equipped with the fin, the below of fin is equipped with the fan, the bottom of inner chamber is connected with the heat dissipation plate through bolt, the surface of heat dissipation plate is equipped with the heat dissipation groove, the bottom of heat dissipation plate is connected with the clamping plate through the damping bearing, the bottom of clamping plate is equipped with the ventilation groove, this kind of waterproof circuit board, through the structural design cooperation of heat conduction plate and fin, thereby the heat dissipation effect of device whole is improved better, second, through the structural design of spring and damper push plate, the service life of circuit board body is maintained better.

Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit board technical field, concretely is a waterproof circuit board. BACKGROUND

[0002] Circuit board is also called printed circuit board, and it is the support body of electronic components, and electrical interconnection is realized through prepositioned copper foil conductor, so that the circuit is miniaturized and intuitive, and the circuit board is used in the environment with heavy water vapor for a long time, and is prone to damp, and there is a risk of deformation in the use process, so a waterproof circuit board is needed.

[0003] Although the waterproof circuit board in the prior art has many beneficial effects, the following problems still exist: the current circuit board is prone to generate a large amount of heat in the use process, and the circuit board is damaged due to high temperature, secondly, the installation and fixing steps of the circuit board are complicated in the traditional use process, and it is difficult to buffer the external impact. SUMMARY

[0004] The purpose of this section is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the utility model name to avoid obscuring the purpose of this section, the abstract of the specification and the utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] 1. Technical problem to be solved:

[0006] In order to solve the above-mentioned problems that the current circuit board is prone to generate a large amount of heat in the use process, and the circuit board is damaged due to high temperature, and the installation and fixing steps of the circuit board are complicated, and it is difficult to buffer the external impact, the utility model is proposed.

[0007] Therefore, the utility model aims at solving the problem that the current circuit board is prone to generate a large amount of heat in the use process, and the circuit board is damaged due to high temperature, and the installation and fixing steps of the circuit board are complicated, and it is difficult to buffer the external impact as much as possible.

[0008] 2. Technical scheme:

[0009] In order to solve the above-mentioned technical problems, according to one aspect of the utility model, the utility model provides the following technical scheme:

[0010] The utility model provides a waterproof circuit board, it includes the casing, the inside of casing is equipped with silica gel water absorption layer, the surface of silica gel water absorption layer is pressed and is connected with waterproof air permeable layer, the inside of casing is equipped with the inner chamber, the inner wall of inner chamber is equipped with the heat conduction plate, the top of heat conduction plate is equipped with circuit board body, the bottom of heat conduction plate is equipped with the cooling fin, the below of cooling fin is equipped with the fan, the bottom of inner chamber is connected with the heat dissipation plate through bolt, the surface of heat dissipation plate is equipped with the heat dissipation groove, the bottom of heat dissipation plate is connected with the clamping plate through damping bearing, the bottom of clamping plate is equipped with the ventilation groove, through the structural design of fixed pin screw connection fixed groove and fixed hole, the cover plate is installed in the top of casing better, and through the structural design of rubber ring, it is favorable to better keep the sealing effect of device whole, thereby it is convenient to the circuit board body better waterproof effect.

[0011] As a preferred scheme of the waterproof circuit board of the utility model, the inner wall of the inner chamber is connected with a damper through a bolt, the circumferential outer wall of the damper is sleeved with a spring, one end of the spring is welded with a push plate, and the surface of the push plate is bonded with a rubber pad. Through the structural design of the spring and the damper pushing the push plate, it is convenient to buffer while fixing circuit boards of various sizes, thereby conveniently better increasing the service life of the device as a whole; it is convenient to keep a good buffering and fixing effect on the circuit board during the process of fixing the circuit board.

[0012] As a preferred scheme of the waterproof circuit board of the utility model, the top of the casing is provided with a clamping groove, the inner wall of the clamping groove is bonded with a rubber ring, the top of the casing is provided with a cover plate, the surface of the cover plate is provided with a ventilation opening, the bottom of the cover plate is connected with a clamping block through a bolt, and the clamping block is clamped to the clamping groove.

[0013] As a preferred scheme of the waterproof circuit board of the utility model, the number of the spring and the damper is multiple, and the spring and the damper are symmetrically distributed.

[0014] As a preferred scheme of the waterproof circuit board of the utility model, the top of the cover plate is provided with a fixed hole, the inner wall of the clamping groove is provided with a fixed groove, the circumferential inner wall of the fixed hole and the circumferential inner wall of the fixed groove are consistent, and the circumferential inner wall of the fixed hole is connected with a fixed pin through screw threads.

[0015] As a preferred scheme of the waterproof circuit board of the utility model, the number of the fixed pin is multiple, and the fixed pin is linearly and symmetrically distributed.

[0016] 3. Beneficial effects:

[0017] Compared with the prior art, the utility model has the beneficial effects that:

[0018] The waterproof circuit board has the advantages that heat of the circuit board body is transmitted out through the heat-conducting plate and the heat-dissipating fin, the heat-dissipating groove on the surface of the heat-dissipating plate is leaked out by rotating the clamping plate, the fan is driven to discharge the heat, the heat-dissipating effect of the whole device is improved, the clamping plate and the heat-dissipating plate connected through the damping bearing are used to protect the whole device when the heat-dissipating is not needed, and the service life of the whole device is maintained.

[0019] The waterproof circuit board has the advantages that the spring and the damper are used to push the push plate, the impact of the external environment is buffered when the circuit board body is fixed, the service life of the circuit board body is maintained, the structure of the silica gel water absorption layer and the waterproof and breathable layer is arranged in the shell, and the waterproof effect of the shell body is maintained. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to make the technical scheme of the embodiments of the present application clearer, the present application will be described in detail below with reference to the drawings and specific embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor. Among them:

[0021] Figure 1 It is a whole structure schematic view of the waterproof circuit board of the present application;

[0022] Figure 2 It is a whole structure cross-sectional schematic view of the waterproof circuit board of the present application;

[0023] Figure 3 It is a heat-dissipating fin structure schematic view of the waterproof circuit board of the present application;

[0024] Figure 4 It is a push plate structure schematic view of the waterproof circuit board of the present application;

[0025] Figure 5 It is a rubber ring structure schematic view of the waterproof circuit board of the present application.

[0026] Explanation of reference numerals in the drawings: 1, shell; 2, circuit board body; 3, heat-conducting plate; 4, heat-dissipating fin; 5, fan; 6, heat-dissipating plate; 7, heat-dissipating groove; 8, clamping plate; 9, ventilation groove; 10, push plate; 11, damper; 12, inner cavity; 13, spring; 14, rubber pad; 15, cover plate; 16, clamping block; 17, clamping groove; 18, fixing groove; 19, fixing hole; 20, fixing pin; 21, rubber ring; 22, silica gel water absorption layer; 23, waterproof and breathable layer; 24, ventilation hole. DETAILED DESCRIPTION

[0027] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0028] The present application will be described in detail with reference to the accompanying drawings. In order to facilitate the description, the sectional view of the device structure will be partially enlarged without the general proportion when the embodiments of the present application are described in detail, and the schematic diagram is only an example, which should not limit the scope of the present application. In addition, the three-dimensional spatial dimensions of length, width and depth should be included in the actual manufacture.

[0029] The orientation or position relationship indicated in the term is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0030] The connection mode in the term should be understood broadly, for example, "connection" can be fixed connection, can also be detachable connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the communication inside two elements. For those skilled in the art, the specific meaning of the above-mentioned term in the present application can be understood according to the specific circumstances.

[0031] The embodiments of the present application will be further described in detail below with reference to the accompanying drawings.

[0032] The present application provides a kind of waterproof circuit board one embodiment of overall structure schematic diagram, including:

[0033] Please refer to Figures 1-5 The present application provides a kind of technical scheme:

[0034] The utility model provides a waterproof circuit board, including the casing 1, the inside of casing 1 is equipped with silica gel water absorption layer 22, the surface of silica gel water absorption layer 22 is crimped with waterproof air-permeable layer 23, through the structural design of silica gel water absorption layer 22 and waterproof air-permeable layer 23, the better waterproof effect of casing 1 body is kept, the inside of casing 1 is equipped with inner chamber 12, the inner wall of inner chamber 12 is fixed with heat conduction plate 3, the top of heat conduction plate 3 is equipped with circuit board body 2, the bottom of heat conduction plate 3 is fixed with cooling fin 4, the below of cooling fin 4 is equipped with fan 5, the bottom of inner chamber 12 is connected with radiating plate 6 through bolt, the surface of radiating plate 6 is equipped with radiating groove 7, the bottom of radiating plate 6 is connected with clamping plate 8 through damping bearing, the bottom of clamping plate 8 is equipped with ventilation slot 9, through heat conduction plate 3 and cooling fin 4, the heat of circuit board body 2 is transmitted, and clamping plate 8 is rotated, so that the radiating groove 7 on the surface of radiating plate 6 is leaked, drive fan 5, and the heat is discharged, so as to better improve the heat dissipation effect of the whole device, and through the damping bearing connection of clamping plate 8 and radiating plate 6, the device body is better protected when not needing heat dissipation, so as to better maintain the service life of the whole device.

[0035] It is worth mentioning that, in order to better maintain the service life of the circuit board body 2, the inner wall of the inner chamber 12 is connected with a damper 11 through a bolt, the circumferential outer wall of the damper 11 is sleeved with a spring 13, one end of the spring 13 is welded with a push plate 10, the surface of the push plate 10 is bonded with a rubber pad 14, and the structure of the spring 13 and the damper 11 pushing the push plate 10 is convenient for buffering the impact of the external environment during the fixation of the circuit board body 2, thereby better maintaining the service life of the circuit board body 2.

[0036] Then, in order to better waterproof the circuit board body 2, the top of the casing 1 is provided with a clamping groove 17, the inner wall of the clamping groove 17 is bonded with a rubber ring 21, the top of the casing 1 is provided with a cover plate 15, the surface of the cover plate 15 is provided with a ventilation opening 24, the bottom of the cover plate 15 is connected with a clamping block 16 through a bolt, the clamping block 16 is clamped with the clamping groove 17, and the ventilation opening 24 and the radiating groove 7 are designed in a vertical direction, so as to better circulate the air source of the fan 5 in the device, in addition, the clamping block 16 is clamped with the clamping groove 17 and cooperates with the structure of the rubber ring 21, which is conducive to better maintaining the sealing effect of the whole device, thereby better waterproofing the circuit board body 2.

[0037] At the same time, in order to better buffer and fix the circuit board body 2, the number of the spring 13 and the damper 11 is multiple, and the spring 13 and the damper 11 are symmetrically distributed, and the multiple spring 13 and the damper 11 are symmetrically distributed, which is convenient for better buffering and fixing the circuit board body 2.

[0038] It is worth noting that in order to better install the cover plate 15 on the top of the shell 1, specifically, the top of the cover plate 15 is provided with a fixing hole 19, the inner wall of the clamping groove 17 is provided with a fixing groove 18, the circumferential inner wall of the fixing hole 19 and the circumferential inner wall of the fixing groove 18 are matched, and the circumferential inner wall of the fixing hole 19 is threadedly connected with a fixing pin 20. Through the structure design of the threaded connection of the fixing pin 20 and the fixing groove 18 and the fixing hole 19, the cover plate 15 can be better installed on the top of the shell 1.

[0039] Finally, in order to facilitate the better installation effect of the circuit board body 2 in the inner cavity 12, specifically, the number of the fixing pin 20 is multiple, and the fixing pin 20 is in a symmetrical linear distribution form. Through the structure design of the multiple fixing pins 20 in a symmetrical linear distribution form, the better installation effect of the circuit board body 2 in the inner cavity 12 is facilitated.

[0040] In addition, the circuit, electronic components and modules involved in the utility model are all prior art, and those skilled in the art can realize them without further description. The content protected by the utility model does not involve improvement of internal structure and method.

[0041] In combination Figures 1-5 , the waterproof circuit board of the embodiment is used as follows:

[0042] 1: When the waterproof circuit board is used, the staff moves the shell 1 to a suitable position, removes the fixing pin 20 from the inner wall of the fixing groove 18 and the fixing hole 19 through rotation, takes down the cover plate 15, places the circuit board body 2 in the inner cavity 12, and fixes the push plate 10 according to the edge of the circuit board body 2 through the damper 11 and the spring 13, so as to facilitate the placement of the circuit board body 2 on the top of the heat-conducting plate 3.

[0043] 2: When the device needs to dissipate heat, the heat of the circuit board body 2 is transmitted out through the heat-conducting plate 3 and the heat sink 4, the clamping plate 8 is rotated, the heat dissipation groove 7 on the surface of the heat dissipation plate 6 is leaked out, the fan 5 is driven, and the heat is discharged through the heat dissipation groove 7 and the ventilation groove 9, so as to better improve the overall heat dissipation effect of the device, and the clamping plate 8 and the heat dissipation plate 6 connected through the damping bearing are used to better protect the device body when no heat dissipation is needed, so as to better maintain the service life of the device.

[0044] Although the utility model has been described above with reference to the embodiments, various modifications can be made thereto, and equivalent replacements can be made to the components thereof, without departing from the scope of the utility model. In particular, as long as there is no structural conflict, each feature in the embodiments disclosed by the utility model can be combined with each other in any manner, and the combinations are not exhaustively described in the specification merely for the purpose of omitting the length and saving the resources. Therefore, the utility model is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A waterproof circuit board, characterized in that, The device includes a housing (1), the interior of which is provided with a silicone absorbent layer (22), and a waterproof and breathable layer (23) is pressed onto the surface of the silicone absorbent layer (22). The interior of the housing (1) is provided with an inner cavity (12), and a heat-conducting plate (3) is fixedly provided on the inner wall of the inner cavity (12). A circuit board body (2) is provided on the top of the heat-conducting plate (3), and a heat sink (4) is fixedly provided on the bottom of the heat-conducting plate (3). A fan (5) is provided below the heat sink (4). A heat sink plate (6) is bolted to the bottom of the inner cavity (12), and a heat sink groove (7) is provided on the surface of the heat sink plate (6). A retaining plate (8) is connected to the bottom of the heat sink plate (6) through a damping bearing, and a ventilation groove (9) is provided on the bottom of the retaining plate (8).

2. The waterproof circuit board according to claim 1, characterized in that, The inner wall of the inner cavity (12) is connected to a damper (11) by bolts. A spring (13) is sleeved on the outer circumference of the damper (11). A push plate (10) is welded to one end of the spring (13). A rubber pad (14) is adhered to the surface of the push plate (10).

3. The waterproof circuit board according to claim 1, characterized in that, The top of the housing (1) is provided with a slot (17), and a rubber ring (21) is bonded to the inner wall of the slot (17). A cover plate (15) is provided on the top of the housing (1), and a vent (24) is provided on the surface of the cover plate (15). A locking block (16) is connected to the bottom of the cover plate (15) by bolts, and the locking block (16) engages with the slot (17).

4. The waterproof circuit board according to claim 2, characterized in that, There are multiple springs (13) and dampers (11), and the springs (13) and dampers (11) are symmetrically distributed.

5. The waterproof circuit board according to claim 3, characterized in that, The top of the cover plate (15) is provided with a fixing hole (19), and the inner wall of the slot (17) is provided with a fixing groove (18). The inner circumference of the fixing hole (19) and the inner circumference of the fixing groove (18) match each other. The inner circumference of the fixing hole (19) is threaded with a fixing pin (20).

6. The waterproof circuit board according to claim 5, characterized in that, There are multiple fixing pins (20), and the fixing pins (20) are distributed in a symmetrical linear form.

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