A radiator for a small household appliance

By using a rectangular heat dissipation hole and side wall groove structure design, combined with an aluminum alloy substrate and support structure, the problems of low heat conduction efficiency and poor air circulation in existing heat sinks are solved, achieving efficient heat dissipation and stable operation.

CN224503803UActive Publication Date: 2026-07-14FOSHAN CHANCHENG TONGCHENG METAL MATERIALS CO LTD
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Patent Information

Application Number
CN202521640938.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-01
Publication Date
2026-07-14
Estimated Expiration
2035-08-01

AI Technical Summary

Technical Problem

Existing radiators have low heat transfer efficiency and poor air circulation, making it difficult to meet the heat dissipation requirements under high load conditions, which affects the stability of equipment performance and service life.

Method used

It adopts a rectangular heat dissipation hole and side wall groove structure design. The groove cross-section is arc-shaped, V-shaped or rectangular and is evenly distributed on the substrate. Combined with an aluminum alloy integral molded substrate, mounting feet and bumps enhance the structural stability.

Benefits of technology

It improves heat transfer efficiency and airflow performance, reduces airflow resistance, enhances heat exchange effect, and ensures stable operation of the radiator under high load conditions.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of radiator production equipment provides a kind of radiator for small household appliance, including substrate, the substrate is provided with a plurality of uniformly distributed heat dissipation hole, the heat dissipation hole is similar rectangle, the side wall of each heat dissipation hole is along circumferential and is provided with several grooves. In the utility model, by adopting the structure design of similar rectangle heat dissipation hole and side wall setting groove, the heat transfer efficiency and air flow performance of radiator are effectively improved, the heat exchange effect is enhanced, the air resistance is reduced, the problem that existing radiator is low in heat transfer efficiency, air flow is not smooth is solved.
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Description

Technical Field

[0001] This utility model relates to the field of radiator manufacturing equipment technology, and in particular to a radiator for small household appliances. Background Technology

[0002] With the rapid development of the small household appliance market, consumers' demands for product performance are constantly increasing, especially in terms of the stability and durability of equipment during operation. As an indispensable part of electronic devices, the heat sink's main function is to maintain the normal operating temperature of the device by effectively dissipating internally generated heat, thereby extending the device's lifespan and improving operating efficiency. Traditional heat sink designs typically employ a simple substrate structure with several circular or square ventilation holes. While these holes can help dissipate heat to some extent, there is still room for improvement in terms of heat conduction efficiency and airflow.

[0003] However, existing heat sinks have some shortcomings. First, the design of traditional heat dissipation holes often fails to fully utilize space to optimize heat conduction paths, resulting in low heat dissipation efficiency. Second, due to the simple shape of the heat dissipation holes, airflow easily forms turbulence as it passes through, increasing air resistance and hindering rapid heat dissipation. Furthermore, under high-load operating conditions, traditional heat sinks struggle to meet efficient heat dissipation requirements, potentially leading to equipment overheating and affecting its performance stability and lifespan. Therefore, a novel heat sink design is urgently needed to address these issues and improve overall heat dissipation efficiency. Utility Model Content

[0004] The purpose of this invention is to solve the problems of low heat conduction efficiency and poor air circulation in existing radiators. The invention adopts the following technical solution:

[0005] A heat sink for small household appliances includes a substrate with a plurality of evenly distributed heat dissipation holes on the substrate. The heat dissipation holes are rectangular in shape, and each heat dissipation hole has a plurality of grooves formed on its sidewall along the circumferential direction.

[0006] As described above, in a heat sink for small household appliances, the cross-sectional shape of the groove is arc-shaped, V-shaped, or rectangular.

[0007] As described above, in a heat sink for small household appliances, a plurality of the grooves are evenly distributed along the sidewall of the heat dissipation holes.

[0008] As described above, a heat sink for a small household appliance has at least one mounting foot on one side of the substrate. The mounting foot is used to support the substrate and stably fix it above the heating element.

[0009] As described above, in a heat sink for a small household appliance, at least one protrusion is provided on one side of the substrate, the protrusion being used to enhance the local structural strength of the substrate.

[0010] As described above, in a heat sink for a small household appliance, the cross-sectional shape of the protrusion is rectangular.

[0011] The heat sink for small household appliances described above has a substrate that is a one-piece molded aluminum alloy structure.

[0012] As described above, in a heat sink for small household appliances, the heat dissipation holes are distributed in a rectangular array on the substrate.

[0013] Implementing the embodiments of this utility model has the following beneficial effects:

[0014] 1. In this utility model, by adopting a structural design with rectangular heat dissipation holes and grooves on the side walls, the heat conduction efficiency and air circulation performance of the radiator are effectively improved, the heat exchange effect is enhanced, the airflow resistance is reduced, and the problems of low heat conduction efficiency and poor air circulation in existing radiators are solved. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of a heat sink for small household appliances according to this utility model.

[0017] As shown in the figure:

[0018] 1. Substrate; 2. Heat dissipation holes; 3. Groove; 4. Mounting feet; 5. Protrusions Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] like Figure 1As shown, this utility model proposes a heat sink for small household appliances, including a substrate 1. The substrate has multiple evenly distributed heat dissipation holes 2. The key feature is that the heat dissipation holes 2 are roughly rectangular, and each heat dissipation hole 2 has several grooves 3 formed along its circumferential direction on its sidewall. The roughly rectangular structure provides a large edge heat dissipation area, enhancing heat radiation efficiency. Simultaneously, the grooves 3 formed along the circumferential direction on the sidewall of each heat dissipation hole 2 increase the contact area between the heat sink and the air, thereby improving heat conduction efficiency. They also act as guides when airflow passes through, reducing air resistance and optimizing airflow performance. This solves the problems of low heat conduction efficiency and poor airflow in existing heat sinks.

[0021] Optionally, in some embodiments, the heat dissipation holes 2 are distributed in a rectangular array on the substrate 1. This arrangement, through regular rows and columns, ensures that the heat dissipation holes are evenly distributed across the entire substrate surface, thereby achieving uniform heat conduction and airflow. This not only improves the rationality of space utilization of the heat sink but also enhances the orderliness of airflow.

[0022] Furthermore, as a preferred embodiment of the invention and not a limitation thereof, the cross-sectional shape of the groove 3 is arc-shaped. During the operation of the small household appliance, the airflow mainly passes through the heat dissipation hole 2 along the axial direction. At this time, the arc-shaped structure of the groove 3 can guide and optimize the axial airflow, making the airflow, which is prone to forming a boundary layer stagnation at the straight wall, more active and enhancing the heat exchange efficiency between the air and the heat dissipation hole wall. At the same time, the arc-shaped structure has a larger surface area and curvature change, which helps to enhance the heat exchange effect between the radiator and the air, further improving the heat dissipation performance.

[0023] Optionally, in some embodiments, the cross-sectional shape of the groove 3 is V-shaped. When the airflow passes through the heat dissipation hole 2 axially, the V-shaped groove 3 can disturb the boundary layer airflow without changing the mainstream direction, promoting heat exchange between the air and the wall of the heat dissipation hole. Because the V-shaped structure has a sharp groove profile, it can effectively disrupt the stable state of the flow attached to the wall, enhance the local turbulence intensity, and thus improve the heat transfer efficiency.

[0024] Optionally, in some embodiments, the groove 3 has a rectangular cross-sectional shape. The rectangular cross-section of the groove 3 can form a regular groove structure on the inner wall of the heat dissipation hole, increasing the contact area between air and the wall surface.

[0025] Furthermore, as a preferred embodiment of the invention and not a limitation thereof, the plurality of grooves 3 are uniformly distributed along the sidewall of the heat dissipation hole 2. This arrangement enables the airflow to achieve balanced contact with the groove structure in all directions when passing through the heat dissipation hole 2, thereby improving the uniformity and efficiency of heat exchange. The uniformly distributed grooves 3 can enhance the disturbance effect on the boundary layer without changing the overall airflow direction, promoting the efficient transfer of heat from the substrate 1 to the air.

[0026] Furthermore, as a preferred embodiment of the present invention and not a limitation thereof, at least one mounting foot 4 is provided on one side of the substrate 1. The mounting foot 4 is used to support the substrate 1 and stably fix it above the heating element. The mounting foot 4 cooperates with positioning holes, slots, etc. on the internal structure of the small household appliance or the circuit board to firmly fix the heat sink above the heating element, such as a power device or a motor. This connection method not only achieves effective support for the substrate 1, but also ensures that it will not shift or fall off during the operation of the device due to vibration, airflow impact, or assembly errors, thereby ensuring the continuous and effective operation of the heat dissipation structure.

[0027] Furthermore, as a preferred embodiment of the present invention and not a limitation thereof, at least one protrusion 5 is provided on one side of the substrate 1. The protrusion 5 is used to enhance the local structural strength of the substrate 1, and the cross-sectional shape of the protrusion 5 is rectangular. During the installation and use of the heat sink, the protrusion 5 can effectively improve the bending and pressure resistance of the local area of ​​the substrate 1, prevent deformation or damage caused by external forces or assembly pressure, thereby maintaining the stability and integrity of the overall structure of the substrate.

[0028] Furthermore, as a preferred embodiment of the present invention and not a limitation thereof, the substrate 1 is a one-piece aluminum alloy structure. It is manufactured using die casting or stamping processes, resulting in a high degree of uniformity and structural integrity of the substrate as a whole. Aluminum alloy material has excellent thermal conductivity, enabling rapid conduction of heat generated by the heating element to the entire substrate, and achieving efficient heat exchange through the rectangular heat dissipation holes 2 and sidewall grooves 3.

[0029] Example 1:

[0030] This utility model proposes a heat sink for small household appliances, including a substrate 1 with multiple evenly distributed heat dissipation holes 2. The heat dissipation holes 2 are rectangular in shape, and each hole 2 has several grooves 3 formed along its circumferential direction on its sidewall. The rectangular structure provides a large edge heat dissipation area, enhancing heat radiation efficiency. Simultaneously, the grooves 3 on the sidewall of each hole 2 increase the contact area between the heat sink and the air, thereby improving heat conduction efficiency and guiding airflow, reducing air resistance and optimizing air circulation performance. This solves the problems of low heat conduction efficiency and poor air circulation in existing heat sinks. The heat dissipation holes 2 are distributed in a rectangular array on the substrate 1. This arrangement, through regular rows and columns, ensures that the heat dissipation holes are evenly distributed across the entire substrate surface, achieving uniform heat conduction and air circulation. This not only improves the rationality of space utilization but also enhances the orderliness of airflow. The substrate 1 is a one-piece aluminum alloy structure. It is manufactured through die casting or stamping processes, ensuring high consistency and structural integrity of the substrate as a whole. Aluminum alloy material possesses excellent thermal conductivity, enabling rapid heat transfer from the heating element to the entire substrate. Efficient heat exchange is achieved through the rectangular heat dissipation holes 2 and sidewall grooves 3. Manufactured using die casting or stamping processes, the substrate exhibits high uniformity and structural integrity.

[0031] The cross-sectional shape of the groove 3 is arc-shaped. During the operation of the small appliance, the airflow mainly passes through the heat dissipation hole 2 along its axial direction. The arc-shaped structure of the groove 3 guides and optimizes the axial airflow, making the airflow, which would otherwise easily stagnate at the straight wall, more active and enhancing the heat exchange efficiency between the air and the heat dissipation hole wall. Simultaneously, the arc-shaped structure has a larger surface area and curvature variation, which helps enhance the heat exchange effect between the radiator and the air, further improving heat dissipation performance. Multiple grooves 3 are evenly distributed along the sidewall of the heat dissipation hole 2. This arrangement allows the airflow to achieve balanced contact with the groove structure in all directions as it passes through the heat dissipation hole 2, thereby improving the uniformity and efficiency of heat exchange. The evenly distributed grooves 3 can enhance the disturbance effect on the boundary layer without changing the overall airflow direction, promoting the efficient transfer of heat from the substrate 1 to the air.

[0032] At least one mounting foot 4 is provided on one side of the substrate 1. The mounting foot 4 is used to support the substrate 1 and stably fix it above the heating element. The mounting foot 4 cooperates with positioning holes, slots, etc. on the internal structure of the small appliance or the circuit board to firmly fix the heat sink above the heating element, such as a power device or motor. This connection method not only achieves effective support for the substrate 1, but also ensures that it will not shift or fall off due to vibration, airflow impact, or assembly errors during equipment operation, thereby ensuring the continuous and effective operation of the heat dissipation structure. At least one protrusion 5 is provided on one side of the substrate 1. The protrusion 5 is used to enhance the local structural strength of the substrate 1. The cross-sectional shape of the protrusion 5 is rectangular. During the installation and use of the heat sink, the protrusion 5 can effectively improve the bending and pressure resistance of the local area of ​​the substrate 1, prevent deformation or damage caused by external forces or assembly pressure, thereby maintaining the stability and integrity of the overall structure of the substrate.

[0033] Specifically, the working principle of this invention is as follows:

[0034] During the operation of small household appliances, heating elements such as motors and power modules generate heat. This heat is first transferred to the aluminum alloy substrate 1 located above it through thermal conduction. Because substrate 1 is a one-piece molded structure with good thermal conductivity, the heat quickly diffuses within the substrate, preventing the formation of localized high-temperature areas.

[0035] Subsequently, heat is dissipated outward through the rectangular heat dissipation holes 2 on the substrate 1. The heat dissipation holes 2 are distributed in a rectangular array, uniformly covering the substrate surface, allowing heat to be efficiently transferred and released in various areas of the substrate. At the same time, the sidewalls of the heat dissipation holes 2 are provided with multiple grooves 3 evenly distributed circumferentially. Their cross-sections are arc-shaped, which can increase the contact area with air, enhance the heat exchange efficiency when airflow passes through, and create disturbance to the airflow, breaking the boundary layer and improving heat dissipation efficiency.

[0036] Finally, under the influence of the internal fan or natural convection of the small appliance, the airflow passes axially through the heat dissipation holes 2 and grooves 3, achieving continuous heat dissipation. The mounting feet 4 on the substrate 1 ensure the heat sink is stably fixed above the heat-generating element, forming a good airflow channel; while the bumps 5 enhance the local strength of the substrate, preventing deformation caused by stress during assembly or use, and ensuring the stable operation of the heat dissipation structure. The entire process achieves efficient and coordinated heat dissipation from heat conduction and convection to structural support.

[0037] In summary, this invention solves the problems of low heat conduction efficiency and poor air circulation in existing radiators.

[0038] It should be understood that the terms "first," "second," etc., are used in this utility model to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information. In addition, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0039] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

Claims

1. A heat sink for small household appliances, comprising a substrate (1) having a plurality of evenly distributed heat dissipation holes (2) on the substrate, characterized in that, The heat dissipation hole (2) is rectangular, and each heat dissipation hole (2) has several grooves (3) circumferentially formed on its sidewall.

2. A radiator for small household appliances according to claim 1, characterized in that, The cross-sectional shape of the groove (3) is arc-shaped, V-shaped, or rectangular.

3. A radiator for small household appliances according to claim 1, characterized in that, The plurality of grooves (3) are evenly distributed along the sidewall of the heat dissipation hole (2).

4. A radiator for small household appliances according to claim 1, characterized in that, At least one mounting foot (4) is provided on one side of the substrate (1), the mounting foot (4) is used to support the substrate (1) and fix it stably above the heating element.

5. A radiator for small household appliances according to claim 1, characterized in that, At least one bump (5) is provided on one side of the substrate (1), and the bump (5) is used to enhance the local structural strength of the substrate (1).

6. A radiator for small household appliances according to claim 5, characterized in that, The cross-sectional shape of the protrusion (5) is rectangular.

7. A radiator for small household appliances according to claim 1, characterized in that, The substrate (1) is an integral aluminum alloy structure.

8. A radiator for small household appliances according to claim 1, characterized in that, The heat dissipation holes (2) are distributed in a rectangular array on the substrate (1).