Composite heat-conducting gasket

By using a composite structure of alternating layers of artificial graphite sheets and thermally conductive silicone, the problems of low thermal conductivity and fragility of graphite sheets are solved, resulting in faster heat conduction and dissipation, and enhancing the compressibility and service life of the gasket.

CN224503814UActive Publication Date: 2026-07-14DONGGUAN HANPIN ELECTRONIC CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DONGGUAN HANPIN ELECTRONIC CO LTD
Filing Date
2025-08-15
Publication Date
2026-07-14

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Abstract

The utility model discloses a composite heat conduction gasket, including a plurality of artificial graphite sheet layer, a plurality of heat conduction silica gel layer, artificial graphite sheet layer and heat conduction silica gel layer are alternately stacked connection, the last layer and the most lower layer are all heat conduction silica gel layer. Advantage: through multilayer artificial graphite sheet layer and multilayer heat conduction silica gel layer alternate setting, through the compressibility characteristics of heat conduction silica gel layer to artificial graphite sheet, realize the shock attenuation of whole gasket, avoid the fragmentation of artificial graphite sheet under the pressure of heat dissipation module and heat dissipation equipment in use. Compared with the mode that the working surface of the existing heat dissipation equipment and a layer of graphite sheet are pasted, the working surface of the heat conduction equipment and the side of the several layers of artificial graphite sheet and the side of the heat conduction silica gel layer are pasted in the application, so that the contact area of the pasting surface of the equipment and the side of the graphite sheet is increased, and after pasting, the heat is dissipated to the side of the heat dissipation module along the planar direction of the artificial graphite sheet in the heat conduction direction of the artificial graphite sheet layer, realizing more rapid heat conduction and heat dissipation.
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Description

Technical Field

[0001] This utility model relates to the field of gaskets, specifically a composite thermally conductive gasket. Background Technology

[0002] Graphite sheets are commonly used in thermal pads, but due to their anisotropic nature, they primarily conduct heat in the planar direction, with poor thermal conductivity in the perpendicular direction. Synthetic graphite sheets can achieve an in-plane thermal conductivity of 1500–1800 W / m·K, but their conductivity perpendicular to the plane is significantly lower, typically only 20–30 W / m·K. Furthermore, graphite sheets are brittle and lack compression and shock absorption. While thermally conductive silicone pads are compressible, their thermal conductivity generally does not exceed 15 W / mK, much lower than the in-plane thermal conductivity of graphite sheets, failing to meet the demands of more demanding thermal applications. Current pad designs involve placing the graphite sheet parallel to the contact surface of the device. After contact, the graphite sheet primarily relies on vertical heat conduction, requiring extremely flat surfaces on the device to prevent low thermal conductivity.

[0003] For example, Chinese patent CN206446204U discloses a high thermal conductivity graphene composite insulating gasket, comprising a phase change thermally conductive material layer, a graphene high thermal conductivity layer, and an insulating thermally conductive layer. The graphene high thermal conductivity layer is disposed on one side of the phase change thermally conductive material layer, and the insulating thermally conductive layer is disposed on the other side. The graphene high thermal conductivity layer comprises a first silicone matrix material and graphene filled therein; the insulating thermally conductive layer comprises a second silicone matrix material and filled high thermal conductivity solid particles. In application, the plane of the graphene in this high thermal conductivity graphene composite insulating gasket is directly parallel to the contact surface of the heat-conducting device, which is detrimental to heat conduction.

[0004] Therefore, it is necessary to provide a composite thermally conductive pad. Utility Model Content

[0005] The present invention provides a composite thermally conductive pad that effectively solves the problems of poor thermal conductivity and easy breakage of graphite pads.

[0006] The technical solution adopted by this utility model is: a composite thermally conductive pad, comprising several artificial graphite sheet layers and several thermally conductive silicone layers, wherein the artificial graphite sheet layers and the thermally conductive silicone layers are alternately stacked and connected, and the uppermost and lowermost layers are both thermally conductive silicone layers.

[0007] Furthermore, the thickness of the artificial graphite sheet is 0.05mm to 0.1mm, and the length and width of the artificial graphite sheet are both greater than 50mm.

[0008] Furthermore, the thickness of the thermally conductive silicone layer is 0.2mm to 0.4mm, the length of the thermally conductive silicone layer is equal to the length of the artificial graphite sheet layer, and the width of the thermally conductive silicone layer is equal to the width of the artificial graphite sheet layer.

[0009] Furthermore, a treatment agent is also coated between the adjacent thermally conductive silicone layer and the artificial graphite sheet layer.

[0010] Furthermore, the thickness of the treatment agent is 3µm to 10µm.

[0011] The beneficial effects of this utility model are as follows: By alternating layers of artificial graphite sheets and multiple layers of thermally conductive silicone, the compressibility of the thermally conductive silicone layers shapes the artificial graphite sheets, achieving shock absorption and cushioning for the entire pad and preventing the artificial graphite sheets from breaking under the pressure of the device to be cooled and the heat dissipation module during use. Compared to the existing method of bonding the working surface of the device to be cooled with a single layer of graphite sheet, in this application, the working surface of the device to be cooled is bonded to the sides of several layers of artificial graphite sheets and the sides of the thermally conductive silicone layers. This increases the contact area between the bonding surface of the device and the sides of the graphite sheets. After bonding, heat is dissipated along the plane of the artificial graphite sheets towards the heat dissipation module in the thermal conduction direction of the artificial graphite sheets, achieving faster heat conduction and dissipation. Attached Figure Description

[0012] Figure 1 This is an overall schematic diagram of the composite thermal pad provided in the embodiments of this application.

[0013] Figure 2 This is a schematic diagram showing the composite thermally conductive pad provided in the embodiments of this application in a thermally conductive state after being bonded to the device to be cooled and the heat dissipation module 200.

[0014] The diagram is labeled as follows: 1. Artificial graphite sheet; 2. Thermally conductive silicone layer; 100. Device to be cooled; 200. Heat dissipation module. Detailed Implementation

[0015] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0016] like Figure 1 As shown in the illustration, an embodiment of this application provides a composite thermally conductive pad, the structure of which includes a plurality of artificial graphite sheet layers 1 and a plurality of thermally conductive silicone layers 2. The artificial graphite sheet layers 1 and the thermally conductive silicone layers 2 are alternately stacked and connected, with the uppermost and lowermost layers both being the thermally conductive silicone layers 2. This application is applicable to telecommunications, computer and peripheral equipment, electronic components, chips, or other types of heat dissipation devices. The thermally conductive silicone layers 2 have low hardness and high wettability, ensuring adhesion to the artificial graphite sheet layers 1.

[0017] In actual use, such as Figure 2 As shown, the heat dissipation device 100 and the heat dissipation module 200 are respectively attached to both sides of all the thermally conductive silicone layers 2 and the artificial graphite sheet layers 1 on opposite sides. The heat from the heat dissipation device 100 is conducted to the thermally conductive silicone layers 2 and the artificial graphite sheet layers 1 and then transferred to the heat dissipation module 200. The thermally conductive silicone layers 2 located on both sides of the artificial graphite sheet layers 1 can cover both sides of the artificial graphite sheet layers 1 to achieve shaping of the artificial graphite sheet layers 1.

[0018] In the above design, multiple layers of artificial graphite sheets 1 and multiple layers of thermally conductive silicone layers 2 are alternately arranged. The compressibility of the thermally conductive silicone layers 2 shapes the artificial graphite sheets 1, achieving shock absorption and cushioning for the entire pad, preventing the artificial graphite sheets 1 from breaking under the pressure of the heat dissipation device 100 and the heat dissipation module 200 during use. Compared with the existing method of bonding the working surface of the heat dissipation device 100 to a single layer of graphite sheet, in this application, the working surface of the heat dissipation device 100 is bonded to the sides of several layers of artificial graphite sheets 1 and the sides of the thermally conductive silicone layers 2. This increases the contact area between the bonding surface of the device and the sides of the graphite sheets. After bonding, heat is dissipated along the plane of the artificial graphite sheets 1 towards the heat dissipation module 200 in the thermal conduction direction of the artificial graphite sheets 1, achieving faster heat conduction and dissipation.

[0019] Specifically, the thickness of the artificial graphite sheet 1 is 0.05mm to 0.1mm, and the length and width of the artificial graphite sheet 1 are both greater than 50mm.

[0020] In the above design, when the length and width of the graphite sheet are both greater than 50mm, it is easy to place them during the manufacturing process, and the thickness is convenient to meet the requirements of product thinness.

[0021] Specifically: the thickness of the thermally conductive silicone layer 2 is 0.2mm to 0.4mm, the length of the thermally conductive silicone layer 2 is equal to the length of the artificial graphite sheet layer 1, and the width of the thermally conductive silicone layer 2 is equal to the width of the artificial graphite sheet layer 1.

[0022] In the above design, the thickness of the thermally conductive silicone layer 2 is sufficient to conduct heat and achieve interlayer heat transfer. The length and width dimensions of the thermally conductive silicone layer 2 facilitate its bonding with the artificial graphite sheet layer 1.

[0023] Specifically, the total thickness of the composite thermal pad ranges from 50mm to 400mm.

[0024] In the above design, the total thickness ranges from 50mm to 400mm, which ensures that the thickness of the entire gasket meets the requirements of both use and thinness.

[0025] Specifically, a treatment agent is also coated between the adjacent thermally conductive silicone layer 2 and the artificial graphite sheet layer 1. The treatment agent is an organic surface treatment agent, such as acrylic adhesive or silicone adhesive.

[0026] In the above design, the thermally conductive adhesive can enhance the bond between the thermally conductive silicone layer 2 and the artificial graphite sheet layer 1.

[0027] Specifically, the thickness of the treatment agent is 3µm to 10µm.

[0028] In the above design, the thickness of the treatment agent ensures that the thermally conductive silicone layer 2 can effectively bond the artificial graphite sheet layer 1.

[0029] In further detail, it should be understood that the above description is only a specific embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A composite thermally conductive pad, characterized in that: It includes several artificial graphite sheets (1) and several thermally conductive silicone layers (2), wherein the artificial graphite sheets (1) and the thermally conductive silicone layers (2) are stacked and connected alternately, and the uppermost and lowermost layers are both thermally conductive silicone layers (2).

2. The composite thermally conductive pad according to claim 1, characterized in that: The artificial graphite sheet (1) has a thickness of 0.05 mm to 0.1 mm, and the length and width of the artificial graphite sheet (1) are both greater than 50 mm.

3. The composite thermally conductive pad according to claim 1, characterized in that: The thickness of the thermally conductive silicone layer (2) is 0.2mm~0.4mm, the length of the thermally conductive silicone layer (2) is equal to the length of the artificial graphite sheet layer (1), and the width of the thermally conductive silicone layer (2) is equal to the width of the artificial graphite sheet layer (1).

4. The composite thermally conductive pad according to claim 1, characterized in that: A treatment agent is also coated between the adjacent thermally conductive silicone layer (2) and the artificial graphite sheet layer (1).

5. The composite thermally conductive pad according to claim 4, characterized in that: The thickness of the treatment agent is 3µm to 10µm.