High-power chip module and electronic device

Abstract

The application relates to the field of high-power chips, in particular to a high-power chip module and electronic equipment, which comprises a PCBA, one side of the PCBA is provided with a chip, the chip is provided with a thermal via hole corresponding to a mounting position on the PCBA, the upper surface of the chip is attached with a first heat conduction piece, and the other side of the PCBA is attached with a second heat conduction piece corresponding to the mounting position of the chip; an upper mounting cover is arranged above the PCBA; a lower mounting cover is arranged below the PCBA; and a first fixing piece is used for fixedly connecting the upper mounting cover, the PCBA and the lower mounting cover to form an integrated module. Compared with the prior art, the bidirectional heat conduction path breaks through the limitation of the unidirectional heat dissipation of the traditional closed shielding cover, so that the chip heat can be diffused in the upward and downward directions at the same time, and the risk of heat accumulation is obviously reduced.

Description

Technical Field

[0001] This application relates to the field of high-power chip technology, and in particular to a high-power chip module and electronic device. Background Technology

[0002] With the advancement of technology, the functional requirements of electronic products are increasing day by day. As a result, electromagnetic interference between internal components and heat dissipation problems caused by increased power consumption of internal chips are becoming increasingly prominent. Under the trend of product miniaturization design, how to effectively solve the heat dissipation problem in limited internal space while taking into account electromagnetic compatibility has placed higher design requirements on electronic products.

[0003] Existing technologies typically address electromagnetic compatibility issues between devices by isolating them with sheet metal shields. However, if a high-power chip is isolated inside a sheet metal shield, its heat dissipation cannot be conducted away through heat conduction. Especially when operating at full power, the chip faces a greater risk of high temperatures. Prolonged exposure to temperatures near the chip junction temperature may damage the chip and even affect product performance and lifespan. Utility Model Content

[0004] This application provides a high-power chip module and electronic device to solve the problem that the existing technology, which uses sheet metal shielding for isolation, can only solve the electromagnetic compatibility between devices, but cannot solve the heat dissipation problem of high-power chips inside the sheet metal shielding.

[0005] In a first aspect, this application provides a high-power chip module, including:

[0006] PCBA, one side of the PCBA has a chip, the chip has a thermal via corresponding to the mounting position on the PCBA, the upper surface of the chip is covered with a first thermal conductive element, and the other side of the PCBA is covered with a second thermal conductive element corresponding to the mounting position of the chip.

[0007] A top mounting cover is provided on top of the PCBA;

[0008] The lower mounting cover is located below the PCBA;

[0009] The first fastener is used to fix the upper mounting cover, PCBA and lower mounting cover to form an integral module.

[0010] Furthermore, the PCBA has a positioning hole, and the upper mounting cover and the lower mounting cover have upper mounting holes and lower mounting holes respectively corresponding to the positioning holes. The first fixing member passes through the upper mounting hole, the positioning hole and the lower mounting hole in sequence to fix the upper mounting cover, the PCBA and the lower mounting cover.

[0011] Furthermore, during the installation of the first fastener, the outer edge of the upper mounting cover and the outer edge of the lower mounting cover are engaged and connected to each other.

[0012] Furthermore, both the first and second thermal conductive components are made of thermally conductive silicone. The size of the first thermal conductive component is the same as the size of the chip, and the size of the second thermal conductive component is between the top edge of the PCBA and the positioning hole.

[0013] Furthermore, both the upper mounting cover and the lower mounting cover are heat-dissipating metal shielding covers.

[0014] Furthermore, the first fixing member is a screw, and the lower mounting hole is a threaded hole. The first fixing member is screwed into the threaded hole from the upper mounting hole and the positioning hole to complete the threaded locking.

[0015] Secondly, this application also provides an electronic device, including a mid-frame, a bottom shell, and a high-power chip module as described in the first aspect;

[0016] The high-power chip module is provided with a number of second fasteners, and the middle frame is fixedly installed to the high-power chip module through the number of second fasteners. The middle frame is installed on the bottom shell.

[0017] Furthermore, a third thermal conductive element is attached to one side of the high-power chip module assembled with the middle frame, and a fourth thermal conductive element is attached to the other side.

[0018] Furthermore, the middle frame and the bottom shell are respectively provided with a first tooth-like structure and a second tooth-like structure on the back side corresponding to the high-power chip module area.

[0019] Furthermore, both the first tooth-like structure and the second tooth-like structure are composed of a number of strip teeth, and the number of strip teeth in the first tooth-like structure is less than the number of strip teeth in the second tooth-like structure.

[0020] The technical solution provided in this application has the following advantages compared with the prior art:

[0021] This application splits the shielding cover into an upper mounting cover and a lower mounting cover, enabling it to simultaneously perform the dual functions of electromagnetic isolation and heat conduction, breaking the constraints of closed structures on heat conduction. Compared to existing technologies, this application overcomes the unidirectional heat dissipation limitations of traditional closed shielding covers through a bidirectional heat conduction path, allowing chip heat to diffuse simultaneously in both upward and downward directions, significantly reducing the risk of heat buildup. Simultaneously, the first fixing component presses the three-layer structure (upper mounting cover-PCBA-lower mounting cover) into a single unit, achieving mechanical fixation of multiple components to resist vibration, with tight interface contact, zero air gap in the heat conduction medium, continuous electromagnetic shielding, and elimination of gap leakage. Attached Figure Description

[0022] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0025] Figure 1 This is a schematic diagram of the structure of a high-power chip module provided in an embodiment of this application;

[0026] Figure 2 for Figure 1 Exploded view;

[0027] Figure 3 for Figure 2 A schematic diagram of the front structure of a PCBA;

[0028] Figure 4 for Figure 2 A schematic diagram of the back structure of a PCBA;

[0029] Figure 5 This is a schematic diagram of the assembly structure of a high-power chip module and a mid-frame in an electronic device, provided in an embodiment of this application.

[0030] Figure 6 for Figure 5 Exploded view;

[0031] Figure 7 An exploded view of an electronic device provided in an embodiment of this application;

[0032] Figure 8 for Figure 7 A schematic diagram of the middle frame structure;

[0033] Figure 9 for Figure 7 A schematic diagram of the bottom shell structure;

[0034] Figure 10 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. PCBA; 11. Positioning hole; 12. First heat-conducting component; 13. Second heat-conducting component; 2. Chip; 3. Upper mounting cover; 31. Upper mounting hole; 4. Lower mounting cover; 41. Lower mounting hole; 5. First fixing component;

[0037] 10. High-power chip module; 101. Second fixing component; 102. Third heat-conducting component; 103. Fourth heat-conducting component; 20. Middle frame; 201. First toothed structure; 30. Bottom shell; 301. Second toothed structure. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0040] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0041] To address the issue that existing sheet metal shielding methods can only solve electromagnetic compatibility issues between devices but cannot solve the heat dissipation problem of high-power chips inside the sheet metal shielding, this application provides a high-power chip module and electronic device. This application breaks through the unidirectional heat dissipation limitation of traditional closed shielding by using a bidirectional heat conduction path, allowing the chip's heat to diffuse simultaneously in both the upper and lower directions, significantly reducing the risk of heat accumulation. At the same time, the first fixing component presses the three-layer structure (upper mounting cover-PCBA-lower mounting cover) into a whole, achieving mechanical fixation of multiple parts to resist vibration, with tight contact at the interfaces, zero air gap in the heat conduction medium, continuous electromagnetic shielding, and elimination of gap leakage.

[0042] Please see Figures 1 to 4 This application provides a high-power chip module 10, comprising: a PCBA1, a chip 2 on one side of the PCBA1, a thermal via on the chip 2 corresponding to the mounting position on the PCBA1, a first thermal conductive element 12 on the upper surface of the chip 2, and a second thermal conductive element 13 on the other side of the PCBA1 corresponding to the mounting position of the chip 2; an upper mounting cover 3, disposed above the PCBA1; a lower mounting cover 4, disposed below the PCBA1; and a first fixing member 5, used to fix the upper mounting cover 3, the PCBA1, and the lower mounting cover 4 to form an integral module.

[0043] Specifically, PCBA1 (Printed Circuit Board) serves as the base carrier, with a high-power chip 2 mounted on one side. Thermal vias are designed at the mounting positions of chip 2 to allow heat transfer in the vertical direction of PCBA1. A first thermal conductive element 12 is attached to the upper surface of chip 2 to promote upward heat conduction. On the other side of PCBA1 (corresponding to the chip 2 mounting position), a second thermal conductive element 13 is attached to form a downward heat transfer channel. An upper mounting cover 3 is placed above PCBA1, covering the chip 2 area and providing physical protection. A lower mounting cover 4 is placed below PCBA1, aligned with the second thermal conductive element 13 at the bottom of PCBA1, forming a complete enclosure structure and providing structural support. Finally, the upper mounting cover 3, PCBA1, and lower mounting cover 4 are sequentially connected and fixed using first fasteners 5 (such as screws). During the fixing process, the first fasteners 5 apply pressure to ensure tight adhesion between layers, eliminating gaps between components, ultimately forming an integrated module where each component (PCBA1, mounting cover, and thermal conductive element) is integrated into an inseparable unit through the fasteners.

[0044] Compared to existing technologies, this application constructs a vertical heat conduction path through thermal vias and bidirectional thermal conductive elements (first thermal conductive element 12 and second thermal conductive element 13), allowing heat to diffuse upwards and downwards simultaneously, avoiding localized heat accumulation. This reduces the temperature risk of chip 2 under high loads and improves system stability. Secondly, the first fixing element 5 presses the upper mounting cover 3, PCBA1, and lower mounting cover 4 into an integrated module, enhancing mechanical strength, resisting vibration and impact, preventing component displacement, and ensuring uniform heat distribution, thus extending the lifespan of electronic components. In addition, the mounting cover not only provides physical protection but also serves as a carrier for heat dissipation and shielding, improving electromagnetic compatibility and reducing external interference.

[0045] like Figure 2 As shown, PCBA1 has a positioning hole 11. The upper mounting cover 3 and the lower mounting cover 4 have upper mounting holes 31 and lower mounting holes 41 respectively corresponding to the positioning hole 11. The first fixing member 5 passes through the upper mounting hole 31, the positioning hole 11 and the lower mounting hole 41 in sequence to fix the upper mounting cover 3, PCBA1 and the lower mounting cover 4.

[0046] Specifically, at least one positioning hole 11 is formed on the surface of PCBA1. This hole maintains a preset spatial relationship with the position of chip 2 to ensure that thermal vias and heat-conducting components are not interfered with. An upper mounting hole 31, coaxial with the positioning hole 11 of PCBA1, is formed at the bottom of the upper mounting cover 3. A lower mounting hole 41, coaxial with the positioning hole 11 of PCBA1, is formed at the top of the lower mounting cover 4. The diameters of the three holes are matched to form a vertically penetrating concentric channel. Through the coaxial nesting relationship between the positioning hole 11 and the mounting hole, automatic alignment of the planar position of PCBA1 and the upper mounting cover 3, as well as the vertical position of PCBA1 and the lower mounting cover 4, can be achieved, thereby eliminating manual adjustment errors and ensuring that the layers are stacked without offset. During the locking process, the first fixing member 5 applies axial pressure, causing the upper mounting cover 3, PCBA1, and lower mounting cover 4 to be tightly pressed together, forming a rigid whole without relative displacement.

[0047] like Figure 2 As shown, when the first fastener 5 is installed, the outer edge of the upper mounting cover 3 and the outer edge of the lower mounting cover 4 are engaged and connected to each other.

[0048] Specifically, in this embodiment, the outer edges of the upper mounting cover 3 and the lower mounting cover 4 are geometrically matched. The outer edge of the upper mounting cover 3 is designed as a raised snap (such as a continuous tooth shape or a partial hook shape), and the outer edge of the lower mounting cover 4 is correspondingly provided with a recessed groove (the shape of which is complementary to the raised shape). When the two are vertically stacked, they achieve interlocking through deformation. During the screwing-in process of the first fixing member 5, axial pressure is generated. The pressure drives the raised and recessed parts of the outer edges of the upper mounting cover 3 and the lower mounting cover 4 to elastically deform until they are completely fitted.

[0049] like Figure 2-4As shown, both the first thermal conductive element 12 and the second thermal conductive element 13 are thermally conductive silicone. The size of the first thermal conductive element 12 is the same as that of the chip 2, and the size of the second thermal conductive element 13 is between the top edge of PCBA1 and the positioning hole 11.

[0050] Specifically, the first thermal conductive component 12 is made of thermally conductive silicone material, and its dimensions (such as length and width) are completely consistent with the surface dimensions of the chip 2. This means that the thermally conductive silicone is precisely cut or shaped to the same shape as the chip 2, directly covering the upper surface of the chip 2. During assembly, the thermally conductive silicone is attached to the upper surface of the chip 2, ensuring that the entire heat-generating area is completely covered, forming a continuous heat conduction interface. This size-matching design eliminates the gap between the thermally conductive silicone and the edge of the chip 2, preventing heat from accumulating at the interface. The second thermal conductive component 13 also uses thermally conductive silicone material, and its size is limited to the area between the top edge of the PCBA1 board (i.e., the upper edge of the PCBA1) and the positioning hole 11. During module assembly, the second thermal conductive component 13 is attached to the other side of the PCBA1 (corresponding to the chip 2 mounting position). Its size constraint ensures that it maintains a preset distance from the positioning hole 11, avoiding interference with the function of the positioning hole 11, preventing the thermally conductive silicone from overflowing into non-target areas, maintaining the focus of the heat conduction path, and reducing heat loss. During assembly, thermally conductive silicone is precisely placed to maintain the integrity of the PCBA1 structure and assembly accuracy.

[0051] In one available embodiment, both the upper mounting cover 3 and the lower mounting cover 4 are heat-dissipating metal shielding covers.

[0052] Specifically, both the upper mounting cover 3 and the lower mounting cover 4 are made from a single piece of metal sheet (e.g., by stamping or CNC machining), and the metal material possesses high thermal conductivity and electromagnetic shielding performance. The edges of the cover are bent to form vertical sidewalls, enclosing the lateral space of PCBA1; the flat surface area completely covers the projection range of chip 2, ensuring no exposed gaps. The metal cover and PCBA1 are in direct contact via thermally conductive silicone, allowing the heat from chip 2 to diffuse laterally across the entire surface of the cover, and then dissipate heat through heat exchange between the cover and the external environment. When the upper and lower covers are closed, the sidewalls form a continuous conductive closed cavity, confining the electromagnetic radiation of chip 2 within the cavity.

[0053] like Figure 2 As shown, the first fixing member 5 is a screw, and the lower mounting hole 41 is a threaded hole. The first fixing member 5 is screwed into the threaded hole from the upper mounting hole 31 and the positioning hole 11 to complete the threaded locking.

[0054] Specifically, in this embodiment, the screw is vertically inserted into the upper mounting hole 31; the screw shank passes through the positioning hole 11 and is screwed into the threaded hole; the screw is rotated until the head presses against the upper mounting cover 3, generating axial pressure, and the screw head is completely in contact with the surface of the upper mounting cover 3, and the threaded section forms a self-locking fit with the threaded hole of the lower mounting cover 4, and the three-layer assembly is pressed into a zero-clearance rigid body. In this way, the assembly efficiency is improved, and locking can be completed in a single action. The screwing action simultaneously realizes positioning (hole guidance), pressing (screw head pressure) and locking (thread self-locking), greatly shortening the assembly time.

[0055] Please see Figures 5 to 10 An electronic device provided in this application includes a middle frame 20, a bottom shell 30, and a high-power chip module 10 as described in the above embodiment; the high-power chip module 10 is provided with a plurality of second fasteners 101, the middle frame 20 and the high-power chip module 10 are fixedly installed by the plurality of second fasteners 101, and the middle frame 20 is installed on the bottom shell 30.

[0056] Specifically, the module itself completes the screw fastening of the upper and lower mounting covers 4, the lower mounting cover 4, and the PCBA1, forming an independent functional unit. Four pre-set through holes are located at the four corners of the module's heat dissipation metal shielding cover. Four second fixing members 101 are installed at each of these pre-set through holes. Matching mounting holes are provided on the middle frame 20 corresponding to the positions of the second fixing members 101. The second fixing members 101, like the first fixing members 5, are screws, and their installation method is the same as that of the first fixing members 5. The screw end of the second fixing member 101 passes through the pre-set through hole and engages with the mounting hole on the middle frame 20, rigidly fixing the module to the back surface of the middle frame 20. The bottom shell 30 has pre-set positioning grooves or screw holes, and the middle frame 20 is fixed to the bottom shell 30 via a third connector (such as screws or welding), forming a complete equipment shell. The middle frame 20 serves as the upward path for module heat dissipation (absorbing upward heat from the module), while the bottom shell 30 serves as the downward path (absorbing downward heat from the module), forming an equipment-level heat dissipation network to improve the heat dissipation efficiency of the equipment.

[0057] like Figure 5 As shown, the high-power chip module 10 is assembled with the middle frame 20. One side is covered with a third heat-conducting component 102, and the other side is covered with a fourth heat-conducting component 103.

[0058] Specifically, the third heat-conducting component 102 is precisely attached to the top surface of the high-power chip module 10 and faces the back of the mid-frame 20, completely or partially covering the metal shielding cover on the module surface. The fourth heat-conducting component 103 is attached to the side of the module facing away from the mid-frame 20 (i.e., the side facing the internal space of the device), with its coverage area aligned with the projection area of ​​the high-power chip 2, extending to the edge positioning structure of the module. The third heat-conducting component 102 serves as the heat conduction medium at the module-mid-frame 20 interface, while the fourth heat-conducting component 103 serves as the heat transfer medium between the module and the device's internal cavity. Both exist simultaneously and do not interfere with each other's spatial layout.

[0059] like Figure 8-9 As shown, the middle frame 20 and the bottom shell 30 are respectively provided with a first tooth structure 201 and a second tooth structure 301 on the back of the corresponding high power chip module 10 area.

[0060] Specifically, the first tooth-like structure 201 is located on the back side of the middle frame 20 (i.e., the side away from the high-power chip module 10), and its shape consists of continuously arranged protrusions and depressions, forming a regularly undulating surface. This structure is formed directly on the metal substrate through stamping or casting processes, ensuring uniform distribution of the tooth-like units. The second tooth-like structure 301 is located on the back side of the bottom shell 30 (away from the module area), and adopts the same design. The positions of the tooth-like structures strictly correspond to the areas of the high-power chip module 10. The first tooth-like structure 201 of the middle frame 20 is located on the back side of the area directly above the module, and the second tooth-like structure 301 of the bottom shell 30 is located on the back side of the area directly below the module. During the device assembly stage, the middle frame 20 and the bottom shell 30 are fixed by simple fastening or bolts, and the tooth-like structures are automatically exposed to the external environment of the device without interfering with the internal components. Its design ensures seamless connection with the heat dissipation path of the module, thereby improving the heat dissipation efficiency of the device.

[0061] like Figure 8-9 As shown, both the first tooth-shaped structure 201 and the second tooth-shaped structure 301 are composed of several strip teeth, and the number of strip teeth in the first tooth-shaped structure 201 is less than the number of strip teeth in the second tooth-shaped structure 301.

[0062] Specifically, the first toothed structure 201 employs a sparse strip-shaped tooth array with a relatively small number of teeth. The tooth units are arranged equidistantly laterally along the back of the middle frame 20, with the tooth length direction parallel to the module's heat flow path, forming a wide-spacing channel. The second toothed structure 301 employs a dense strip-shaped tooth array with a significantly larger number of teeth than the first structure, maximizing the bottom surface coverage. The sparse tooth array of the first toothed structure 201 forms a low-resistance channel, guiding airflow quickly through the high-temperature zone; the dense tooth array of the second toothed structure 301 enhances static heat dissipation by increasing the contact area, adapting to the environment without forced convection at the bottom. The middle frame 20 focuses on lateral heat dissipation (sparse teeth reduce heat accumulation), while the bottom shell 30 focuses on vertical heat dissipation.

[0063] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0064] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0065] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0066] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0067] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0068] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0069] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0070] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A high-power chip module, characterized in that, include: PCBA, one side of the PCBA has a chip, the chip has a thermal via corresponding to the mounting position on the PCBA, the upper surface of the chip is covered with a first thermal conductive element, and the other side of the PCBA is covered with a second thermal conductive element corresponding to the mounting position of the chip. A top mounting cover is provided on top of the PCBA; The lower mounting cover is located below the PCBA; The first fastener is used to fix the upper mounting cover, PCBA and lower mounting cover to form an integral module.

2. The high-power chip module according to claim 1, characterized in that, The PCBA has a positioning hole. The upper mounting cover and the lower mounting cover have upper mounting holes and lower mounting holes respectively corresponding to the positioning holes. The first fixing member passes through the upper mounting hole, the positioning hole and the lower mounting hole in sequence to fix the upper mounting cover, the PCBA and the lower mounting cover.

3. The high-power chip module according to claim 2, characterized in that, When the first fastener is installed, the outer edge of the upper mounting cover and the outer edge of the lower mounting cover are engaged and connected to each other.

4. The high-power chip module according to claim 2, characterized in that, Both the first and second thermal conductive components are made of thermally conductive silicone. The size of the first thermal conductive component is the same as the size of the chip, and the size of the second thermal conductive component is between the top edge of the PCBA and the positioning hole.

5. The high-power chip module according to claim 1, characterized in that, Both the upper mounting cover and the lower mounting cover are heat-dissipating metal shielding covers.

6. The high-power chip module according to claim 2, characterized in that, The first fastener is a screw, and the lower mounting hole is a threaded hole. The first fastener is screwed into the threaded hole from the upper mounting hole and the positioning hole to complete the threaded locking.

7. An electronic device, characterized in that, Includes a mid-frame, a bottom shell, and a high-power chip module as described in any one of claims 1-6; The high-power chip module is provided with a number of second fasteners, and the middle frame is fixedly installed to the high-power chip module through the number of second fasteners. The middle frame is installed on the bottom shell.

8. The electronic device according to claim 7, characterized in that, The high-power chip module is fitted with a third heat-conducting component on one side and a fourth heat-conducting component on the other side.

9. The electronic device according to claim 7, characterized in that, The middle frame and the bottom shell are respectively provided with a first tooth-like structure and a second tooth-like structure on the back side corresponding to the high-power chip module area.

10. The electronic device according to claim 9, characterized in that, Both the first tooth-like structure and the second tooth-like structure are composed of a number of strip teeth, and the number of strip teeth in the first tooth-like structure is less than the number of strip teeth in the second tooth-like structure.

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