A magnetic field cancellation device for semiconductor manufacturing

Abstract

This utility model discloses a magnetic field cancellation device for semiconductor manufacturing. The technical solution includes a manufacturing host and a cancellation host. The manufacturing host has an outer cover A installed at its top and bottom. Magnetic field sensors A are installed on the outer surface of each outer cover A, arranged along the X-axis. Outer covers B are installed on both sides of the manufacturing host, with magnetic field sensors B installed on one side of each outer cover B, arranged along the Z-axis. An outer cover C is installed on the rear surface of the manufacturing host. This magnetic field cancellation device for semiconductor manufacturing solves the problem that existing magnetic field interference in semiconductor manufacturing environments severely affects the performance of electron beam equipment, leading to decreased focusing accuracy and poor beam stability, which in turn affects the stability of the semiconductor manufacturing process, resulting in lower product yield and increased production costs. It reduces the impact of environmental magnetic fields on the performance of electron beam equipment, thereby improving the stability of the semiconductor manufacturing process.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a magnetic field cancellation device used in semiconductor manufacturing. Background Technology

[0002] Semiconductor manufacturing is a precise process of transforming silicon materials into integrated circuit chips. It is mainly divided into two major stages: wafer fabrication and packaging and testing. First, high-purity polycrystalline silicon is pulled and sliced ​​to form wafers. Nanoscale circuit patterns are formed on the surface through processes such as oxidation, photolithography, and etching. Then, transistor structures are built through ion implantation doping and thin film deposition. Photolithography technology determines the process precision. The next step is to cut the wafers into bare dies, and complete the packaging through steps such as wire bonding and molding. Finally, functional and reliability testing is carried out. The entire process must be carried out in an ultra-clean environment, involving thousands of processes. Temperature, cleanliness, and timing control requirements are extremely strict. Chip manufacturing embodies the pinnacle of materials science, physics, and precision engineering.

[0003] Magnetic field interference in existing semiconductor manufacturing environments can severely affect the performance of electron beam equipment, leading to decreased focusing accuracy and reduced beam stability, which in turn affects the stability of semiconductor manufacturing processes, resulting in lower product yield and increased production costs. To address this, we propose a magnetic field cancellation device for semiconductor manufacturing. Utility Model Content

[0004] The purpose of this invention is to provide a magnetic field cancellation device for semiconductor manufacturing, which can cancel the magnetic field in the manufacturing environment. This solves the problem that magnetic field interference in the semiconductor manufacturing environment can seriously affect the performance of electron beam equipment, leading to a decrease in electron beam focusing accuracy and a deterioration in beam current stability, which in turn affects the stability of the semiconductor manufacturing process, resulting in a decrease in product yield and an increase in production costs.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a magnetic field cancellation device for semiconductor manufacturing, comprising a manufacturing host and a cancellation host, wherein an outer cover A is installed on the top and bottom of the manufacturing host, and a magnetic field sensor A is installed on the outer surface of the outer cover A, the magnetic field sensor A being arranged along the X-axis; an outer cover B is installed on both sides of the manufacturing host, and a magnetic field sensor B is installed on one side of the outer cover B, the magnetic field sensor B being arranged along the Z-axis; an outer cover C is installed on the rear surface of the manufacturing host, and a magnetic field sensor C is installed in the middle of the rear surface of the outer cover C, the magnetic field sensor C being arranged along the Y-axis; and demagnetizing cables are installed inside the outer covers A, B, and C via snap-fit ​​connections.

[0006] Preferably, the cancellation host is equipped with a device platform at its bottom and a display is installed on the top of the device platform. The cancellation host is connected to the demagnetization cable via a connecting cable.

[0007] Preferably, a wire core is installed in the middle of the connecting wire, and the wire core is connected to the demagnetizing cable.

[0008] Preferably, a shielding layer is installed inside the connecting wire on the outer surface of the core, a nylon layer is installed inside the connecting wire on the outer surface of the shielding layer, and a steel wire braided layer is installed inside the connecting wire on the outer surface of the nylon layer.

[0009] Preferably, the outer surface of the manufacturing host is provided with connecting holes at the positions of outer cover A, outer cover B and outer cover C, and a connecting pin is installed inside the connecting hole on one side of outer cover A, outer cover B and outer cover C, and the connecting pin is engaged inside the connecting hole.

[0010] Preferably, the manufacturing host has spring holes on both sides of the connection hole, a positioning pin is installed inside the spring hole, and a spring is installed inside the spring hole on one side of the positioning pin.

[0011] Preferably, the connecting pin has positioning holes on both sides at the positioning pin position, and the positioning pin is fitted into the positioning holes.

[0012] Preferably, the cancellation host is equipped with a signal processing module, a drive module, and a control module.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model achieves the effect of canceling the magnetic field of the manufacturing environment by setting up magnetic field sensor A, magnetic field sensor B, magnetic field sensor C, demagnetizing cable and canceling host. This solves the problem that the magnetic field interference in the semiconductor manufacturing environment will seriously affect the performance of electron beam equipment, resulting in a decrease in the focusing accuracy of the electron beam, a deterioration in the beam current stability, and thus affecting the stability of the semiconductor manufacturing process, resulting in a decrease in product yield and an increase in production costs. This reduces the impact of the environmental magnetic field on the performance of the electron beam equipment, thereby improving the stability of the semiconductor manufacturing process.

[0015] 2. This utility model achieves the effect of convenient maintenance of demagnetizing cable by setting connecting pins, connecting holes, positioning pins and positioning holes, so as to solve the problem that the existing demagnetizing cable is too complicated to install, which leads to increased disassembly and assembly time and affects the maintenance efficiency of the demagnetizing mechanism. It reduces the time required for disassembly and assembly of the demagnetizing mechanism, thereby improving the maintenance efficiency of the demagnetizing mechanism.

[0016] 3. This utility model achieves the effect of protecting the wire core by setting a shielding layer, a nylon layer and a steel wire braiding layer, thereby solving the problem that the wire core connected by the existing demagnetizing mechanism has poor protection performance and is easily damaged during use, thus affecting the normal use of the demagnetizing cable. It improves the protection effect of the wire core and ensures the normal use of the demagnetizing cable. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0018] Figure 2 This is a bottom view of the structure of this utility model;

[0019] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0020] Figure 4 for Figure 3 A magnified structural diagram of A;

[0021] Figure 5 for Figure 3 A magnified structural diagram of B in the diagram;

[0022] Figure 6 This is a partial cross-sectional view of the connecting wire of this utility model.

[0023] Reference numerals: 1. Manufacturing host; 2. Magnetic field sensor A; 3. Outer cover A; 4. Outer cover B; 5. Cancellation host; 6. Display; 7. Equipment platform; 8. Connecting cable; 9. Magnetic field sensor B; 10. Magnetic field sensor C; 11. Outer cover C; 12. Connecting pin; 13. Spring; 14. Demagnetizing cable; 15. Positioning hole; 16. Spring hole; 17. Connecting hole; 18. Positioning pin; 19. Buckle; 20. Shielding layer; 21. Nylon layer; 22. Steel wire braided layer; 23. Wire core. Detailed Implementation

[0024] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments. Example 1

[0025] like Figure 1-6As shown, to achieve the above objectives, this utility model provides the following technical solution: A magnetic field cancellation device for semiconductor manufacturing, comprising a manufacturing host 1 and a cancellation host 5, wherein the manufacturing host 1 is equipped with an outer cover A3 at both its top and bottom, and a magnetic field sensor A2 is installed on the outer surface of the outer cover A3, the magnetic field sensor A2 being arranged along the X-axis; an outer cover B4 is installed on both sides of the manufacturing host 1, and a magnetic field sensor B9 is installed on one side of the outer cover B4, the magnetic field sensor B9 being arranged along the Z-axis; an outer cover C11 is installed on the rear surface of the manufacturing host 1, and a magnetic field sensor C10 is installed in the middle of the rear surface of the outer cover C11, the magnetic field sensor C10 being arranged along the Y-axis; the magnetic field sensor A2 on the X-axis, the magnetic field sensor C10 on the Y-axis, and the magnetic field sensor B9 on the Z-axis cancel the magnetic field of the manufacturing host 1. The system accurately senses the magnetic field. Demagnetizing cables 14 are installed inside outer casings A3, B4, and C11 via clips 19. An equipment platform 7 is installed at the bottom of the cancellation host 5, and a display 6 is installed on top of the equipment platform 7. The cancellation host 5 is connected to the demagnetizing cable 14 via a connecting cable 8. A wire core 23 is installed in the middle of the connecting cable 8, and the wire core 23 is connected to the demagnetizing cable 14. A shielding layer 20 is installed on the outer surface of the wire core 23 inside the connecting cable 8. A nylon layer 21 is installed on the outer surface of the shielding layer 20 inside the connecting cable 8. A steel wire braided layer 22 is installed on the outer surface of the nylon layer 21 inside the connecting cable 8. The steel wire braided layer 22 protects the inside of the connecting cable 8. The cancellation host 5 contains a signal processing module, a drive module, and a control module.

[0026] The working principle of a magnetic field cancellation device for semiconductor manufacturing based on Embodiment 1 is as follows: After the device is installed, during use, the magnetic field sensors A2, B9, and C10 sense the magnetic field of the environment surrounding the manufacturing host 1. After sensing the environmental magnetic field, the magnetic field sensors A2, B9, and C10 convert the environmental magnetic field into an electrical signal and transmit it to the cancellation host 5. The signal processing module inside the cancellation host 5 processes the signal and transmits the data to the control module. The control module and drive module inside the cancellation host 5 control the activation of the corresponding demagnetizing cable 14, thereby canceling the interfering magnetic field and ensuring the normal operation of the manufacturing host 1. Thus, the working process of this device is completed. Example 2

[0027] like Figure 3 and Figure 4As shown, the present invention proposes a magnetic field cancellation device for semiconductor manufacturing. Compared with Embodiment 1, this embodiment further includes: a connecting hole 17 on the outer surface of the manufacturing host 1 at the positions of outer cover A3, outer cover B4, and outer cover C11; a connecting pin 12 installed inside the connecting hole 17 on one side of outer cover A3, outer cover B4, and outer cover C11; the connecting pin 12 is engaged inside the connecting hole 17; spring holes 16 are provided on both sides of the connecting hole 17 inside the manufacturing host 1; a positioning pin 18 is installed inside the spring hole 16; a spring 13 is installed on one side of the positioning pin 18 inside the spring hole 16; the positioning pin 18 is pressed by the action of the spring 13, and is tightly pressed into the positioning hole 15, thereby positioning outer cover A3, outer cover B4, or outer cover C11; positioning holes 15 are provided on both sides of the connecting pin 12 at the positions of positioning pin 18, and the positioning pin 18 is engaged inside the positioning hole 15.

[0028] In this embodiment, when it is necessary to maintain the demagnetizing cable 14 inside the outer cover A3, outer cover B4, or outer cover C11, pull the outer cover A3, outer cover B4, or outer cover C11 to disengage the positioning pin 18 from the positioning hole 15, and at the same time pull the connecting pin 12 to disengage the connecting pin 12 from the connecting hole 17. This allows the outer cover A3, outer cover B4, or outer cover C11 to be disassembled, thereby enabling maintenance of the demagnetizing cable 14 inside the outer cover A3, outer cover B4, or outer cover C11.

[0029] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A magnetic field cancellation device for semiconductor manufacturing, comprising a manufacturing host (1) and a cancellation host (5), characterized in that: The manufacturing host (1) is equipped with an outer cover A (3) at both the top and bottom. A magnetic field sensor A (2) is installed on the outer surface of the outer cover A (3). The magnetic field sensor A (2) is arranged along the X-axis. An outer cover B (4) is installed on both sides of the manufacturing host (1). A magnetic field sensor B (9) is installed on one side of the outer cover B (4). The magnetic field sensor B (9) is arranged along the Z-axis. An outer cover C (11) is installed on the rear surface of the manufacturing host (1). A magnetic field sensor C (10) is installed in the middle of the rear surface of the outer cover C (11). The magnetic field sensor C (10) is arranged along the Y-axis. A demagnetizing cable (14) is installed inside the outer cover A (3), outer cover B (4) and outer cover C (11) through a buckle (19).

2. The magnetic field cancellation device for semiconductor manufacturing according to claim 1, characterized in that: The cancellation host (5) is equipped with a device platform (7) at the bottom and a display (6) is installed on the top of the device platform (7). The cancellation host (5) is connected to the demagnetizing cable (14) via a connecting line (8).

3. A magnetic field cancellation device for semiconductor manufacturing according to claim 2, characterized in that: The connecting line (8) has a core (23) installed in the middle, and the core (23) is connected to the demagnetizing cable (14).

4. A magnetic field cancellation device for semiconductor manufacturing according to claim 2, characterized in that: The connecting wire (8) has a shielding layer (20) installed on the outer surface of the core (23), a nylon layer (21) installed on the outer surface of the shielding layer (20), and a steel wire braided layer (22) installed on the outer surface of the nylon layer (21).

5. A magnetic field cancellation device for semiconductor manufacturing according to claim 1, characterized in that: The outer surface of the main manufacturing unit (1) is provided with a connecting hole (17) at the positions of outer cover A (3), outer cover B (4) and outer cover C (11). A connecting pin (12) is installed inside the connecting hole (17) on one side of outer cover A (3), outer cover B (4) and outer cover C (11). The connecting pin (12) is snapped into the connecting hole (17).

6. A magnetic field cancellation device for semiconductor manufacturing according to claim 5, characterized in that: The manufacturing host (1) has spring holes (16) on both sides of the connection hole (17). A positioning pin (18) is installed inside the spring hole (16), and a spring (13) is installed inside the spring hole (16) on one side of the positioning pin (18).

7. A magnetic field cancellation device for semiconductor manufacturing according to claim 6, characterized in that: The connecting pin (12) has positioning holes (15) on both sides at the position of the positioning pin (18), and the positioning pin (18) is fitted into the positioning hole (15).

8. A magnetic field cancellation device for semiconductor manufacturing according to claim 1, characterized in that: The cancellation host (5) is equipped with a signal processing module, a drive module and a control module.

Images