A conduction emission simulation device and detection equipment

Abstract

The application relates to the technical field of detection devices, and provides a conduction emission simulation device and a detection equipment, the conduction emission simulation device comprises an insulating part, a shielding assembly, a power supply assembly and a signal assembly, the shielding assembly is arranged on the insulating part, the shielding assembly has a shielding cavity and an opening in communication with the shielding cavity, the shielding cavity is used for containing a domain controller, a power supply connector and a signal connector of the domain controller are respectively arranged in the opening, the power supply assembly is electrically connected with the power supply connector of the domain controller, the signal assembly is electrically connected with the signal connector of the domain controller, a gap is formed between the inner wall of the opening and the outer wall of the power supply connector, and a gap is formed between the inner wall of the opening and the outer wall of the signal connector. The application can solve the problem that it is difficult to test the domain controller.

Description

Technical Field

[0001] This application relates to the field of detection device technology, and in particular to a conduction emission simulation device and detection equipment. Background Technology

[0002] A domain controller is an integrated product that is a highly embedded controller within a specified functional domain. Alternatively, it can be a centralized product that centralizes vehicle-level software functions within a specific functional domain.

[0003] In related technologies, the Ethernet conducted transmission performance of domain controller products cannot be evaluated during the design phase and must rely on later physical testing.

[0004] Furthermore, there is a significant challenge in testing domain controllers. Utility Model Content

[0005] This application provides a conducted emission simulation device and testing equipment, which can solve the problem of high testing difficulty when testing domain controllers.

[0006] To achieve the above objectives, this application adopts the following technical solution:

[0007] In a first aspect, this application provides a conducted emission simulation device, comprising:

[0008] Insulating components;

[0009] A shielding assembly is provided on an insulating component. The shielding assembly has a shielding cavity and an opening communicating with the shielding cavity. The shielding cavity is used to accommodate a domain controller, and the power connector and signal connector of the domain controller are respectively provided through the opening.

[0010] Power supply components, power connectors for conductive connections to the domain controller;

[0011] Signal components, conductive connection signal connectors for domain controllers;

[0012] There is a gap between the inner wall of the opening and the outer wall of the power connector;

[0013] There is a gap between the inner wall of the opening and the outer wall of the signal connector.

[0014] In some embodiments, two openings are provided, spaced apart along the height direction intersecting the shielding component;

[0015] The two openings are respectively set to correspond one-to-one with the power connector and the signal connector.

[0016] In some implementations, the shielding component includes:

[0017] The first shielding element is disposed on the insulating element, and a first notch is provided on the side wall of the first shielding element;

[0018] The second shielding component is fastened to the first shielding component, and a second notch is provided on the side wall of the second shielding component;

[0019] The domain controller is detachably mounted in at least one of the first shielding and / or the second shielding;

[0020] The first shielding element and the second shielding element together form a shielding cavity, and the first notch and the second notch together form an opening.

[0021] In some embodiments, two first notches are provided, spaced apart along the height direction intersecting the shielding component;

[0022] There are two second notches, spaced apart along the height direction intersecting the shielding component.

[0023] The two first gaps and the two second gaps are set to correspond one-to-one.

[0024] In some embodiments, the first shield has a groove and a slot communicating with the groove, the groove extending toward one end closer to the domain controller;

[0025] Along the height direction of the shielding component, the slots are spaced apart from the domain controller;

[0026] Alternatively, the slot can be insulated from the domain controller;

[0027] At least one of the following is disposed in the recess via a slot: a power connector, a signal connector, a component area of ​​the domain controller, or a blank area of ​​the domain controller.

[0028] In some implementations, the shielding component includes:

[0029] The first shielding strip is disposed on the upper surface of the domain controller and connected to the first shielding component. The first shielding strip is spaced around the outer peripheral wall of the groove.

[0030] The second shielding strip is located on the lower surface of the domain controller, and the first and second shielding strips are spaced apart along the height direction of the shielding assembly.

[0031] In some embodiments, the power supply component includes:

[0032] Power supply components;

[0033] The first wire has one end conductively connected to the power supply component and the other end conductively connected to the power connector.

[0034] The second conductor has one end electrically connected to the power connector and the other end used as an external grounding wire.

[0035] In some implementations, the signal component includes:

[0036] resistance;

[0037] The first signal line has one end conductively connected to the resistor and the other end conductively connected to the signal connector.

[0038] The second signal line has one end electrically connected to the signal connector and the other end used as an external grounding wire.

[0039] In some implementations, it also includes:

[0040] The third shielding component has an intersecting mounting end and a shielding end. The mounting end of the third shielding component is connected to the inner wall of the shielding cavity, and the shielding end has an opening.

[0041] The shielding ends are spaced apart on the outer periphery of the first signal line.

[0042] Secondly, this application provides a detection device, including a conducted emission simulation device.

[0043] This conducted emission simulation device, through the inclusion of insulating components, provides insulation support for the shielding assembly. The shielding assembly allows for the placement of the domain controller, forming a signal shielding field to electromagnetically shield the domain controller within the shielded cavity. The openings, and the gap between the inner wall of the opening and the outer wall of the power connector, allow noise or harmonics generated by the power components and connectors to be transmitted to the outside of the shielding assembly. Similarly, the gap between the inner wall of the opening and the outer wall of the signal connector allows noise or harmonics generated by the signal components and connectors to be transmitted to the outside of the shielding assembly. By capturing this noise or harmonics, it is easy to obtain information about noise or harmonics present in the domain controller design, enabling designers to optimize the domain controller based on this information. Compared to testing at the finished product stage of the domain controller, this testing method has the advantage of being simpler.

[0044] Therefore, the conducted emission simulation device provided in the embodiments of this application can solve the problem of high testing difficulty when testing domain controllers. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 One of the schematic diagrams of the main structure of the conducted emission simulation device provided in the embodiments of this application;

[0047] Figure 2 A second schematic diagram of the main structure of the conducted emission simulation device provided in the embodiments of this application;

[0048] Figure 3 The third schematic diagram of the main structure of the conducted emission simulation device provided in the embodiments of this application;

[0049] Figure 4 Fourth schematic diagram of the main structure of the conducted emission simulation device provided in the embodiments of this application;

[0050] Figure 5 For this application Figure 4 A magnified structural diagram of point A in the middle.

[0051] Explanation of reference numerals in the attached figures:

[0052] 10-Domain controller; 11-Power connector; 12-Signal connector;

[0053] 100 - Insulating parts;

[0054] 200 - Shielding assembly; 201 - Shielding cavity; 202 - Opening; 203 - First shielding component; 204 - Second shielding component; 205 - First shielding strip; 206 - Second shielding strip;

[0055] 300 - Power supply assembly; 301 - Power supply component; 302 - First wire; 303 - Second wire;

[0056] 400 - Signal component; 401 - Resistor; 402 - First signal line; 403 - Second signal line;

[0057] 500 - Third shielding component. Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0059] In the prior art, Ethernet conducted emission performance typically involves electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues generated by Ethernet devices when transmitting data.

[0060] Electromagnetic interference (EMI) refers to the electromagnetic radiation generated by Ethernet devices during operation, which may interfere with the normal operation of other electronic devices. Electromagnetic compatibility (EMC) means that Ethernet devices not only need to limit the interference they generate, but also need to be able to operate normally in environments where interference from other devices is present.

[0061] When designing a domain controller, it is necessary to consider switching power supply noise and digital signal harmonic interference. Therefore, it is necessary to verify the conducted interference generated by the domain controller through power lines (i.e., DC lines) and communication cables (i.e., signal lines).

[0062] To overcome the shortcomings of existing technologies, insulating components can be added to provide insulation support for the shielding assembly. The shielding assembly allows for the placement of the domain controller and forms a signal shielding field to electromagnetically shield the domain controller placed within the shielding cavity. The openings, and the gap between the inner wall of the opening and the outer wall of the power connector, allow noise or harmonics generated by the power components and connectors to be transmitted to the outside of the shielding assembly through the openings. Similarly, the gap between the inner wall of the opening and the outer wall of the signal connector allows noise or harmonics generated by the signal components and connectors to be transmitted to the outside of the shielding assembly through the openings. By capturing this noise or harmonics, it is convenient to obtain information about noise or harmonics present in the domain controller design, allowing designers to optimize the domain controller based on this information. Compared to testing at the finished product stage of the domain controller, the above testing method has the advantage of being simpler.

[0063] Therefore, the conducted emission simulation device provided in the embodiments of this application can solve the problem of high testing difficulty when testing domain controllers.

[0064] The contents of this application will now be described in detail with reference to the accompanying drawings, so that those skilled in the art can have a clearer and more detailed understanding of the contents of this application.

[0065] like Figure 1 As shown, this application provides a conducted emission simulation device, including: an insulating component 100, a shielding component 200, a power supply component 300, and a signal component 400. The shielding component 200 is disposed on the insulating component 100 and has a shielding cavity 201 and an opening 202 communicating with the shielding cavity 201. The shielding cavity 201 is used to accommodate a domain controller 10. The power connector 11 and the signal connector 12 of the domain controller 10 are respectively disposed through the opening 202. The power supply component 300 is conductively connected to the power connector 11 of the domain controller 10, and the signal component 400 is conductively connected to the signal connector 12 of the domain controller 10. There is a gap between the inner wall of the opening 202 and the outer wall of the power connector 11, and there is a gap between the inner wall of the opening 202 and the outer wall of the signal connector 12.

[0066] The following sections provide a detailed description of the specific structure of the conducted emission simulation device and the testing equipment, as well as various possible implementation methods.

[0067] It should be noted that the insulating component 100 can be made of polyethylene, polypropylene, rubber, glass, ceramic or other materials that can prevent the flow of current. There are no restrictions on the materials used, and the appropriate material can be selected based on the actual application requirements.

[0068] It should be noted that the number of openings 202 can be one or two, and there is no limit. The selection can be made according to the actual usage requirements.

[0069] In one embodiment, an opening 202 is provided, through which a power connector 11 and a signal connector 12 pass.

[0070] It is understood that, through the above-described embodiments, an opening 202 can accommodate the power connector 11 and the signal connector 12.

[0071] The embodiments of this application provide two openings 202, which are spaced apart along the height direction intersecting the shielding component 200, and the two openings 202 are respectively configured to correspond one-to-one with the power connector 11 and the signal connector 12.

[0072] It is understood that, through the above implementation method, the power connector 11 and the signal connector 12 can be respectively associated with two different openings 202.

[0073] like Figure 2 and Figure 3As shown, the shielding component 200 provided in the embodiments of this application includes: a first shielding member 203 and a second shielding member 204. The first shielding member 203 is disposed on the insulating member 100, and a first notch is formed on the side wall of the first shielding member 203. The second shielding member 204 is fastened to the first shielding member 203, and a second notch is formed on the side wall of the second shielding member 204. The domain controller 10 is detachably installed in at least one of the first shielding member 203 and / or the second shielding member 204. The first shielding member 203 and the second shielding member 204 enclose a shielding cavity 201, and the first notch and the second notch enclose an opening 202.

[0074] It is understood that, through the above-described embodiments, the domain controller 10 can be easily installed between the first shield 203 and the second shield 204, thereby allowing the domain controller 10 to be placed in the shielding cavity 201. By providing the first notch and the second notch, the power connector 11 and the signal connector 12 can be accommodated. The opening 202 is formed by the first notch and the second notch, which facilitates the power connector 11 and the signal connector 12 to pass through the opening 202.

[0075] It should be noted that the first shielding component 203 can be a layered structure of highly conductive material, highly magnetic material, or a combination of highly conductive and highly magnetic materials. There are no restrictions here, and it can be selected according to actual usage requirements.

[0076] It should be noted that the second shielding component 204 can be a layered structure of highly conductive material, highly magnetic material, or a combination of highly conductive and highly magnetic materials. There are no restrictions here, and it can be selected according to actual usage requirements.

[0077] Furthermore, the highly conductive material can be copper or aluminum; there are no restrictions, and it can be selected according to the actual application requirements.

[0078] Furthermore, the high magnetic permeability material can be permalloy or silicon steel; there are no restrictions, and the material can be selected according to the actual application requirements.

[0079] Furthermore, the layered structure of highly conductive and highly magnetic materials can be arranged as one layer of highly conductive material and one layer of highly magnetic material stacked together, or multiple layers of highly conductive material and multiple layers of highly magnetic material stacked together. There are no restrictions here, and the choice can be made according to the actual application requirements.

[0080] It should be noted that the domain controller 10 has several different installation locations, and the following examples illustrate the installation locations of the domain controller 10.

[0081] In one embodiment, the domain controller 10 is detachably mounted in the first shield 203. Furthermore, the detachable connection can be achieved by the domain controller 10 being snapped onto the first shield 203, or by the domain controller 10 being bolted to the first shield 203; no limitation is made here, and the choice can be made according to actual usage requirements.

[0082] It is understood that the above-described embodiments facilitate the installation and removal of the domain controller 10 and the first shield 203, and also reduce the difficulty of installation and removal between the domain controller 10 and the shield 200.

[0083] In one embodiment, the domain controller 10 is detachably mounted in the second shield 204. Furthermore, the detachable connection can be achieved by the domain controller 10 being snapped onto the second shield 204, or by the domain controller 10 being bolted to the second shield 204; no limitation is made here, and the choice can be made according to actual usage requirements.

[0084] It is understood that the above-described embodiments facilitate the installation and removal of the domain controller 10 and the second shield 204, and also reduce the difficulty of installation and removal between the domain controller 10 and the shield 200.

[0085] In one embodiment, the lower surface of the domain controller 10 is detachably connected to the first shield 203, and the upper surface of the domain controller 10 is detachably connected to the second shield 204. Furthermore, the detachable connection can be that the domain controller 10 is fastened between the first shield 203 and the second shield 204.

[0086] It is understood that the above-described implementation method facilitates the installation and removal of the domain controller 10 and the shielding component 200, and also reduces the difficulty of installation and removal between the domain controller 10 and the shielding component 200.

[0087] Understandably, there are no restrictions on the installation location of the domain controller 10; it can be selected according to actual usage needs.

[0088] The embodiments of this application provide two first notches, which are spaced apart along the height direction intersecting the shielding component 200. There are also two second notches, which are spaced apart along the height direction intersecting the shielding component 200. The two first notches and the two second notches are arranged in a one-to-one correspondence.

[0089] It is understood that, through the above implementation method, the two first notches and the two second notches can be enclosed to form two openings 202, so as to accommodate the power connector 11 and the signal connector 12 respectively.

[0090] The first shield 203 provided in the embodiments of this application has a groove and a slot communicating with the groove. The groove extends toward one end close to the domain controller 10. Along the height direction of the shielding assembly 200, the slot is spaced apart from the domain controller 10, or the slot is insulated from the domain controller 10. At least one of the power connector 11, signal connector 12, component area of ​​the domain controller 10, and blank area of ​​the domain controller 10 is disposed in the groove through the slot.

[0091] It is understood that, through the above implementation, the domain controller 10, except for the power connector 11 and the signal connector 12, can be electromagnetically shielded by the shielding cavity 201 or the groove, so that the noise or harmonics at the power connector 11 and the signal connector 12 can be transmitted to the outside of the shielding assembly 200, so as to facilitate the testing of the domain controller 10.

[0092] It should be noted that there are several different ways to connect the slot to the domain controller 10. Examples of the connection methods between the slot and the domain controller 10 will be given below.

[0093] In one embodiment, the slot is spaced apart from the domain controller 10 along the height direction of the shielding component 200.

[0094] It is understood that the above implementation method can reduce the occurrence of conductive connections between the slot and the domain controller 10, thereby protecting the domain controller 10.

[0095] In one implementation, the slot is insulated from the domain controller 10.

[0096] It is understood that the above implementation method can reduce the occurrence of conductive connections between the slot and the domain controller 10, thereby protecting the domain controller 10.

[0097] Understandably, there are no restrictions on the connection method between the slot and the domain controller 10, and it can be selected according to actual usage requirements.

[0098] In one embodiment, the power connector 11 is disposed in the groove through a slot, in which case the groove and the opening 202 are connected.

[0099] It is understood that, through the above-described embodiments, the power connector 11 can be located within the recess, so that only the noise or harmonics generated by the operation of the power assembly 300 and the power connector 11 can be transmitted to the outside of the shielding assembly 200 through the opening 202.

[0100] In one embodiment, the signal connector 12 is disposed in the groove through a slot, in which case the groove and the opening 202 are connected.

[0101] It is understood that, through the above-described embodiments, the signal connector 12 can be located within the groove, so that only the noise or harmonics generated by the operation of the signal component 400 and the signal connector 12 can be transmitted to the outside of the shielding component 200 through the opening 202.

[0102] In one embodiment, the component area of ​​the domain controller 10 is disposed in the groove through a slot.

[0103] It is understood that, through the above implementation method, the component area of ​​the domain controller 10 can be located in the groove, thereby enabling the groove to provide electromagnetic shielding for the component area of ​​the domain controller 10.

[0104] In one embodiment, the blank area of ​​the domain controller 10 is provided in the groove through a slot.

[0105] It is understood that, through the above implementation method, the blank area of ​​the domain controller 10 can be located in the groove, thereby enabling the groove to electromagnetically shield the blank area of ​​the domain controller 10.

[0106] The shielding component 200 provided in the embodiments of this application includes: a first shielding strip 205 and a second shielding strip 206. The first shielding strip 205 is disposed on the upper surface of the domain controller 10 and connected to the first shielding member 203. The first shielding strip 205 is spaced around the outer peripheral wall of the groove. The second shielding strip 206 is disposed on the lower surface of the domain controller 10. The first shielding strip 205 and the second shielding strip 206 are spaced apart along the height direction of the shielding component 200.

[0107] It is understood that, through the above implementation method, the first shielding strip 205 and the second shielding strip 206 can cooperate to shield the electromagnetic radiation generated by the domain controller 10 during operation, and can also reduce the interference of external electromagnetic radiation on the domain controller 10.

[0108] It should be noted that the first shielding strip 205 can be a metallic conductive material, such as a copper foil strip or an aluminum foil strip. There are no restrictions here, and it can be selected according to the actual use requirements.

[0109] Furthermore, when the first shielding strip 205 is a copper foil strip, the copper foil strip is adhered to the upper surface of the domain controller 10 by adhesive backing; when the first shielding strip 205 is an aluminum foil strip, the aluminum foil strip is adhered to the upper surface of the domain controller 10 by adhesive backing.

[0110] It should be noted that the second shielding strip 206 can be a conductive metal material, such as copper foil or aluminum foil. There are no restrictions on this, and it can be selected according to the actual needs of use.

[0111] Furthermore, when the second shielding strip 206 is a copper foil strip, the copper foil strip is adhered to the lower surface of the domain controller 10 by adhesive backing; when the second shielding strip 206 is an aluminum foil strip, the aluminum foil strip is adhered to the lower surface of the domain controller 10 by adhesive backing.

[0112] The power supply assembly 300 provided in the embodiments of this application includes: a power supply component 301, a first wire 302 and a second wire 303. One end of the first wire 302 is conductively connected to the power supply component 301, and the other end of the first wire 302 is conductively connected to the power connector 11. One end of the second wire 303 is conductively connected to the power connector 11, and the other end of the second wire 303 is used as an external grounding wire.

[0113] It is understood that, through the above implementation method, the first conductive and power supply component 301 and the power connector 11 can cooperate to realize the simulation of the working state of the domain controller 10, and by setting the second wire 303, the domain controller 10 can be grounded for protection.

[0114] It should be noted that the power supply component 301 can be a power source or a battery, and there are no restrictions here. It can be selected according to the actual usage requirements.

[0115] The signal component 400 provided in the embodiments of this application includes: a resistor 401, a first signal line 402 and a second signal line 403. One end of the first signal line 402 is conductively connected to the resistor 401, and the other end of the first signal line 402 is conductively connected to the signal connector 12. One end of the second signal line 403 is conductively connected to the signal connector 12, and the other end of the second signal line 403 is used as an external grounding wire.

[0116] It is understood that, through the above implementation method, the impedance of the domain controller 10 can be simulated, and the characteristic impedance of the first signal line 402 and the impedance of the signal connector 12 can be matched to reduce the interference of reflected waves on the original signal during signal transmission.

[0117] In one implementation, resistor 401 has a resistance of 100 ohms.

[0118] It is understandable that the domain controller 10 can achieve better signal transmission performance through the above implementation method.

[0119] like Figure 4 and Figure 5 As shown, the conducted emission simulation device provided in the embodiments of this application further includes: a third shielding member 500, the third shielding member 500 having an intersecting mounting end and a shielding end, the mounting end of the third shielding member 500 being connected to the inner wall of the shielding cavity 201, the shielding end having an opening 202, and the shielding end being spaced apart on the outer periphery of the first signal line 402.

[0120] It is understood that, through the above implementation method, the third shielding member 500 can electromagnetically shield the first signal line 402, thereby reducing the mutual interference between the first signal line 402 and the second signal line 403.

[0121] It should be noted that the third shielding component 500 can be a metallic conductive material, such as copper or aluminum, without any restrictions, and can be selected according to actual usage requirements.

[0122] The embodiments of this application provide a detection device, including a conducted emission simulation device provided in any of the above embodiments.

[0123] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0124] Generally speaking, terms should be understood at least in part by their use in context. For example, at least in part by context, the term "one or more" as used in the text can be used to describe any feature, structure, or characteristic of the singular meaning, or a combination of features, structures, or characteristics of the plural meaning. Similarly, at least in part by context, terms such as "a" or "the" can also be understood to convey either singular or plural usage.

[0125] It should be readily understood that the terms “on,” “above,” and “on top of” in this application should be interpreted in the broadest possible sense, such that “on” means not only “directly on something” but also “on something” with an intermediate feature or layer therebetween, and that “above” or “on top of” means not only “on something” but also “on something” without an intermediate feature or layer therebetween (i.e., directly on something).

[0126] Furthermore, for ease of explanation, spatially relative terms such as "below," "below," "under," "above," and "above" may be used to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation other than those shown in the figures. The device may have other orientations (rotated 90° or in other orientations), and the spatially relative descriptive terms used herein may be interpreted accordingly.

[0127] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A conducted emission simulation device, characterized in that, include: Insulating component (100); A shielding assembly (200) is disposed on the insulating member (100). The shielding assembly (200) has a shielding cavity (201) and an opening (202) communicating with the shielding cavity (201). The shielding cavity (201) is used to accommodate a domain controller (10). The power connector (11) and signal connector (12) of the domain controller (10) are respectively disposed through the opening (202). Power supply assembly (300), electrically connected to the power connector (11) of the domain controller (10); Signal component (400), conductively connected to signal connector (12) of the domain controller (10); There is a gap between the inner wall of the opening (202) and the outer wall of the power connector (11); There is a gap between the inner wall of the opening (202) and the outer wall of the signal connector (12).

2. The conducted emission simulation device according to claim 1, characterized in that, Two openings (202) are provided, and the two openings (202) are spaced apart along the height direction intersecting the shielding component (200); The two openings (202) are respectively configured to correspond one-to-one with the power connector (11) and the signal connector (12).

3. The conducted emission simulation device according to claim 1, characterized in that, The shielding component (200) includes: A first shielding element (203) is disposed on the insulating element (100), and a first notch is provided on the side wall of the first shielding element (203); The second shielding member (204) is fastened to the first shielding member (203), and a second notch is provided on the side wall of the second shielding member (204); The domain controller (10) is detachably mounted on at least one of the first shield (203) and / or the second shield (204); The first shielding member (203) and the second shielding member (204) enclose the shielding cavity (201), and the first notch and the second notch enclose the opening (202).

4. The conducted emission simulation device according to claim 3, characterized in that, Two first notches are provided, and the two first notches are spaced apart along the height direction intersecting the shielding component (200); Two second notches are provided, and the two second notches are spaced apart along the height direction intersecting the shielding component (200); The two first notches and the two second notches are configured to correspond one-to-one.

5. The conducted emission simulation device according to claim 3, characterized in that, The first shield (203) has a groove and a slot communicating with the groove, the groove extending toward one end close to the domain controller (10); Along the height direction of the shielding component (200), the slot is spaced apart from the domain controller (10); Alternatively, the slot may be insulated from the domain controller (10); At least one of the power connector (11), the signal connector (12), the component area of ​​the domain controller (10), and the blank area of ​​the domain controller (10) is disposed in the groove through the slot.

6. The conducted emission simulation device according to claim 5, characterized in that, The shielding component (200) includes: The first shielding strip (205) is disposed on the upper surface of the domain controller (10) and connected to the first shielding member (203). The first shielding strip (205) is spaced around the outer peripheral wall of the groove. The second shielding strip (206) is disposed on the lower surface of the domain controller (10), and the first shielding strip (205) and the second shielding strip (206) are spaced apart along the height direction of the shielding assembly (200).

7. The conducted emission simulation device according to any one of claims 1-6, characterized in that, The power supply assembly (300) includes: Power supply component (301); The first wire (302) has one end conductively connected to the power supply component (301) and the other end conductively connected to the power connector (11). The second conductor (303) has one end electrically connected to the power connector (11) and the other end is used for an external grounding wire.

8. The conducted emission simulation device according to any one of claims 1-6, characterized in that, The signal component (400) includes: Resistor (401); The first signal line (402) has one end electrically connected to the resistor (401) and the other end electrically connected to the signal connector (12). The second signal line (403) has one end electrically connected to the signal connector (12) and the other end is used as an external grounding wire.

9. The conducted emission simulation device according to claim 8, characterized in that, Also includes: The third shielding component (500) has an intersecting mounting end and a shielding end. The mounting end of the third shielding component (500) is connected to the inner wall of the shielding cavity (201), and the shielding end passes through the opening (202). The shielding ends are spaced apart on the outer periphery of the first signal line (402).

10. A testing device, characterized in that, The conductive emission simulation device includes any one of claims 1-9.

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