LED support assembly with moisture protection

Abstract

The utility model discloses a LED support subassembly with moisture -proof function, include: the loading belt and the unloading belt, the loading belt and the unloading belt adopt a integral forming and have a plurality of groups of shelves, the loading belt one side is provided with a plurality of groups of clamping grooves, the shelf is including two groups of parallelly arranged electrode support no.

Description

Technical Field

[0001] This utility model relates to the field of LED bracket equipment technology, specifically an LED bracket assembly with moisture-proof function. Background Technology

[0002] A through-hole LED bracket is a structural component used to fix and support through-hole LED chips. It is usually made of materials such as plastic or metal and has a specific pin layout and mounting holes. It allows LED chips to be soldered onto the circuit board by through-hole method, serving the dual purpose of electrical connection and mechanical fixation. It is widely used in various LED lighting, display and indicator equipment. Its structural design needs to be adapted to the size of the LED chips and meet the requirements of the soldering process.

[0003] Existing Chinese patent document CN214542277U discloses a through-hole LED bracket, a through-hole LED bracket array, and LED chips. The through-hole LED bracket includes a first leg and a second leg spaced apart. The top of the first leg has a wire bonding portion, and the top of the second leg has a die-bonding cup. The side wall of the die-bonding cup has a through hole extending from the inside to the outside of the cup. After encapsulation into LED chips, encapsulating colloid fills the through hole of the die-bonding cup. The encapsulating colloid portion inside the cup and the encapsulating colloid portion outside the die-bonding cup are connected by the encapsulating colloid portion filling the through hole in the die-bonding cup, which suppresses unidirectional pull-out force, improves internal stress, and reduces the risk of the encapsulating colloid detaching from the die-bonding cup; however, this LED bracket still has shortcomings: its LED beads pass directly through the die-bonding cup, and during the encapsulation process, it is necessary to manually and continuously press or pull the pins to keep the LED beads in an accurate position and make close contact during the encapsulation process in the die-bonding cup. The operation is time-consuming, labor-intensive, and inconvenient. Utility Model Content

[0004] The purpose of this utility model is to solve the problem that in the above-mentioned LED bracket, where the LED beads are directly inserted through the die bond cup, the pins need to be manually and continuously pressed or pulled during the encapsulation process to ensure that the LED beads are accurately positioned and in close contact during the encapsulation process in the die bond cup. This process is time-consuming, labor-intensive, and inconvenient. The present invention provides an LED bracket assembly with a moisture-proof function.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an LED bracket assembly with moisture-proof function, comprising: a feeding strip and a discharging strip, wherein the feeding strip and the discharging strip are integrally formed and fixedly connected with several sets of sheet frames, and several sets of slots are opened on one side of the feeding strip. The sheet frame includes two sets of parallel electrode brackets, a first electrode bracket and a second electrode bracket. A first bonding wire part is fixedly connected to the top of the first electrode bracket, and a second bonding wire part is fixedly connected to the top of the second electrode bracket. The back sides of both the first electrode bracket and the second electrode bracket are wrapped with a graphene silicone composite film cover. A die-bonding cup is fixedly connected to the top of the second bonding wire part. An LED chip substrate is embedded inside the die-bonding cup, and an iron-nickel alloy solder sheet is embedded outside the LED chip substrate. Several sets of neodymium iron boron magnetic strips are fixedly arranged in a ring on the inner side of the die-bonding cup. Several sets of neodymium iron boron magnetic strips are spaced apart in the die-bonding cup to form several sets of heat dissipation and drainage grooves. A through hole is opened through the bottom end of the die-bonding cup.

[0006] As a further embodiment of this utility model: the feeding belt and the unloading belt are arranged parallel to each other, and several sets of sheet frames are arranged perpendicular to each other. The unloading belt can be cut along with the sheet frame and is provided with a corresponding number of positioning holes.

[0007] As a further improvement of this utility model: the number of slots is set in several groups, and is adapted to the number of combinations of electrode support one and electrode support two, and the specifications of the slots are adapted to the specifications of electrode support one or electrode support two covered with graphene silicone composite film.

[0008] As a further embodiment of this utility model: the graphene-silicone composite film cover is disposed on the back side and adjacent sides of electrode support one and electrode support two of each set of sheet holders. The bottom ends of the bonding wire part one and bonding wire part two are provided with fitting grooves for fixing and snapping the graphene-silicone composite film cover. The graphene-silicone composite film cover is a composite film structure made of graphene and silicone materials. The graphene material conducts heat to assist in heat dissipation, and the silicone material absorbs water, thus playing a comprehensive function of moisture prevention and heat dissipation.

[0009] As a further improvement of this utility model: an LED bead is provided at the top of the LED chip base block, the LED chip base block is embedded in the die bonding cup, and there is a magnetic attraction between the iron-nickel alloy solder sheet on its outer side and the neodymium iron boron magnetic strip, which can assist in rapid magnetic positioning and automatically correct the position of the LED bead.

[0010] As a further improvement of this utility model, the heat dissipation drainage groove is formed by several sets of spaced neodymium iron boron magnetic strips, which are connected to the through holes at the bottom to allow water vapor to accumulate and be automatically discharged, thus forming a natural heat dissipation channel.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This utility model uses a graphene-silicone composite film cover, which utilizes the excellent thermal conductivity of graphene and the water absorption properties of silicone to achieve the dual functions of moisture protection and heat dissipation. At the same time, the neodymium iron boron magnetic strip on the inner side of the die-bonding cup forms a heat dissipation and drainage groove, which is connected to the through hole to build an efficient heat dissipation and drainage system. It can quickly dissipate heat and remove water vapor, greatly improving the stability and service life of the component in a humid environment.

[0013] 2. In this utility model, the magnetic attraction between the iron-nickel alloy solder sheet on the outside of the LED chip substrate and the neodymium iron boron magnetic strip on the inside of the die-bonding cup is used to achieve rapid magnetic positioning and automatic correction of the LED chip substrate. This innovative design simplifies the production process, significantly improves installation efficiency, ensures accurate LED chip position, effectively reduces uneven light emission, and ensures product quality while improving production efficiency. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of an LED bracket assembly with moisture-proof function as described in this utility model;

[0015] Figure 2 This is a schematic diagram of the structure of the LED support frame in the moisture-proof LED bracket assembly described in this utility model;

[0016] Figure 3 This is a schematic diagram of the graphene-silicone composite film cover in an LED bracket assembly with moisture-proof function as described in this utility model;

[0017] Figure 4 This is a magnified structural diagram of point A in the moisture-proof LED bracket assembly described in this utility model;

[0018] Figure 5 This is a schematic diagram of the second bonding section in an LED bracket assembly with moisture-proof function according to this utility model;

[0019] Figure 6 This is a magnified structural diagram of point B in the LED bracket assembly with moisture-proof function described in this utility model;

[0020] Figure 7 This is a schematic diagram of the through hole structure in an LED bracket assembly with moisture-proof function as described in this utility model.

[0021] In the diagram: 1. Feeding belt; 2. Unloading belt; 3. Sheet holder; 4. Slot; 5. Electrode holder one; 6. Electrode holder two; 7. Wire bonding section one; 8. Wire bonding section two; 9. Graphene silicone composite film cover; 10. Fitting groove; 11. LED lamp bead; 12. Die-bonding cup; 13. Lamp bead chip substrate; 14. Iron-nickel alloy solder sheet; 15. Neodymium iron boron magnetic strip; 16. Heat dissipation and drainage groove; 17. Through hole; 18. Positioning hole. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, it should be noted that unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. The embodiments of this utility model will be described below based on its overall structure.

[0024] Reference Figures 1 to 7 In this embodiment of the present invention, an LED bracket assembly with moisture-proof function includes: a feeding belt 1 and a discharging belt 2. The feeding belt 1 and the discharging belt 2 are integrally formed and fixedly connected with several sets of sheet holders 3. Several sets of slots 4 are opened on one side of the feeding belt 1. The sheet holder 3 includes two sets of parallel electrode holders 1 5 and electrode holders 2 6. The top of the electrode holder 1 5 is fixedly connected with a bonding wire part 1 7, and the top of the electrode holder 2 6 is fixedly connected with a bonding wire part 2 8. The electrode holder 1 5 and the electrode holder 2 6 are... The back side of part 26 is covered with a graphene silicone composite film cover 9. The top of part 28 is fixed with a die bonding cup 12. The die bonding cup 12 is embedded with a lamp chip substrate 13. The outside of the lamp chip substrate 13 is embedded with an iron-nickel alloy solder sheet 14. Several sets of neodymium iron boron magnetic strips 15 are fixed in a ring on the inner side of the die bonding cup 12. Several sets of neodymium iron boron magnetic strips 15 are arranged at intervals in the die bonding cup 12 to form several sets of heat dissipation and drainage grooves 16. The bottom of the die bonding cup 12 is opened with a through hole 17.

[0025] Reference Figures 1 to 7 The feeding belt 1 and the unloading belt 2 are arranged parallel to each other, and several sets of sheet frames 3 are arranged perpendicular to each other. The unloading belt 2 can be cut along with the sheet frame 3, and a corresponding number of positioning holes 18 are opened.

[0026] The above scheme, with the parallel arrangement of the feeding belt 1 and the unloading belt 2, and the perpendicular layout of the sheet holder 3, not only ensures the overall structural stability of the component, but also facilitates automated processing during production. The unloading belt 2 can be cut along with the sheet holder 3, and with the design of the positioning hole 18, it enables rapid and accurate positioning during subsequent processing or installation, effectively improving production efficiency and product consistency.

[0027] Reference Figures 1 to 7 The number of slots 4 is set in several groups, and is adapted to the number of combinations of electrode support 1 5 and electrode support 2 6. The specifications of slots 4 are adapted to the specifications of electrode support 1 5 or electrode support 2 6 wrapped with graphene silicone composite film cover 9.

[0028] The above solution ensures that the number of slots 4 is precisely matched with the number of electrode supports, and that their specifications match the electrode supports wrapped with graphene silicone composite film cover 9. This design not only ensures that the sheet holder 3 is tightly connected to the feed belt 1 and the unfeed belt 2, but more importantly, the wrapping and fixing of the electrode supports by the slots 4 further enhances the stability of the graphene silicone composite film cover 9 wrapping the electrode supports, effectively preventing external moisture from entering the support, thereby ensuring the stability and reliability of the circuit connection.

[0029] Reference Figures 1 to 7 The graphene-silicone composite film cover 9 is installed on the back side and adjacent sides of the electrode support 1 5 and electrode support 2 6 of each set of sheet holders 3. The bottom ends of the bonding wire part 1 7 and bonding wire part 2 8 are provided with fitting grooves 10 for fixing and snapping the graphene-silicone composite film cover 9. The graphene-silicone composite film cover 9 is a composite film structure made of graphene and silicone materials. The graphene material conducts heat to assist heat dissipation, and the silicone material absorbs water, playing a comprehensive function of moisture protection and heat dissipation.

[0030] The above-mentioned solution utilizes a unique method of covering the graphene-silicone composite film cover 9, which fully covers the back and adjacent sides of the electrode bracket. Without affecting the integral molding, it combines the snap-fit ​​design of the interlocking groove 10 to form a complete protective barrier. The graphene and silicone composite materials used fully leverage the advantages of both materials. Graphene has excellent thermal conductivity, which can quickly conduct away the heat generated by the electrode bracket and assist in heat dissipation, while silicone has good water absorption properties, which can effectively absorb moisture from the surrounding environment to achieve a moisture-proof effect. This comprehensive functional design significantly improves the service life and stability of the LED bracket in humid environments.

[0031] Reference Figures 1 to 7 LED chips 11 are provided on the top of the chip base 13. The chip base 13 is embedded in the die bonding cup 12, and there is a magnetic attraction between the iron-nickel alloy solder sheet 14 on its outer side and the neodymium iron boron magnetic strip 15, which can assist in rapid magnetic positioning and automatically correct the position of the LED chips 11.

[0032] Using the above solution: the LED chip substrate 13 achieves rapid magnetic positioning within the die-bonding cup 12 through the magnetic attraction between the iron-nickel alloy solder sheet 14 and the neodymium iron boron magnetic strip 15. This innovative design not only greatly simplifies the installation steps in the production process and improves production efficiency, but more importantly, through the automatic correction effect of the magnetic attraction, it can ensure the precise position of the LED chip 11, thereby ensuring the consistency and stability of the luminous effect and reducing problems such as uneven luminous emission caused by position deviation.

[0033] Reference Figures 1 to 7 The heat dissipation drainage groove 16 is formed by several sets of spaced neodymium iron boron magnetic strips 15 and is connected to the through hole 17 at the bottom to allow water vapor to accumulate and be automatically discharged, thus forming a natural heat dissipation channel.

[0034] The above solution is adopted: the heat dissipation and drainage groove 16 formed by the spaced ring of neodymium iron boron magnetic strips 15 is connected to the through hole 17 at the bottom, forming an efficient heat dissipation and drainage system. When the component generates heat during operation, the heat can be quickly dissipated through the heat dissipation and drainage groove 16. When there is water vapor in the environment, the accumulated water vapor can be naturally discharged through this channel, avoiding the accumulation of liquid water in the die bonding cup 12, thereby effectively protecting the lamp chip substrate 13 and LED lamp beads 11, extending their service life, and improving the reliability and stability of the entire LED bracket assembly in humid environments.

[0035] The working principle of this utility model is as follows: When in use, the component is based on the integrally formed feeding belt 1 and feeding belt 2 as the basic frame. Several sets of sheet frames 3 are fixedly connected to the two in parallel and perpendicularly. The feeding belt 2 can be cut and the design of the positioning hole 18 facilitates precise processing and installation. The slot 4 on one side of the feeding belt 1 is properly matched with the electrode bracket 1 5 and the electrode bracket 2 6. When fixed, the electrode bracket wrapped with graphene silicone composite film cover 9 is inserted. The slot 4 and the fitting groove 10 cooperate to achieve integral molding and tight connection. The graphene silicone composite film cover 9 ensures the bracket is moisture-proof and heat dissipation through graphene heat conduction and silicone water absorption.

[0036] The bonding wire section 7 and bonding wire section 8 on electrode support 1 5 and electrode support 2 6 are used for circuit connection. Inside the die-bonding cup 12 at the top of bonding wire section 2 8, the iron-nickel alloy solder sheet 14 on the outside of the lamp chip substrate 13 and the neodymium iron boron magnetic strip 15 arranged in a ring on the inside generate magnetic attraction force, so as to realize the rapid magnetic positioning of the lamp chip substrate 13 and correct the position of the LED lamp 11, ensuring the light-emitting effect.

[0037] Meanwhile, the heat dissipation and drainage grooves 16 formed by the spaced neodymium iron boron magnetic strips 15 are connected to the through holes 17 at the bottom of the die-bonding cup 12. During operation, heat is dissipated through the heat dissipation and drainage grooves 16, and water vapor in the environment can also be automatically discharged through the through holes 17 after accumulation, avoiding the accumulation of liquid water that could damage the lamp chip base block 13 and the LED lamp beads 11. All structures work together to achieve stable operation of the components in a humid environment.

[0038] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An LED bracket assembly with moisture-proof function, comprising: The feeding belt (1) and the unloading belt (2) are characterized in that the feeding belt (1) and the unloading belt (2) are integrally formed and fixed with several sets of sheet holders (3). Several sets of slots (4) are opened on one side of the feeding belt (1). The sheet holder (3) includes two sets of parallel electrode supports one (5) and electrode supports two (6). The top of the electrode support one (5) is fixed with a wire bonding part one (7). The top of the electrode support two (6) is fixed with a wire bonding part two (8). The back sides of the electrode support one (5) and the electrode support two (6) are both wrapped with graphene. The silicone composite film cover (9) has a die bond cup (12) fixed to the top of the second bonding part (8). The die bond cup (12) has a lamp chip substrate (13) embedded inside. The lamp chip substrate (13) has an iron-nickel alloy solder sheet (14) embedded outside. The die bond cup (12) has several sets of neodymium iron boron magnetic strips (15) fixed in a ring on the inner side. The several sets of neodymium iron boron magnetic strips (15) are spaced apart in the die bond cup (12) to form several sets of heat dissipation and drainage grooves (16). The die bond cup (12) has a through hole (17) at the bottom.

2. The LED bracket assembly with moisture-proof function according to claim 1, characterized in that, The feeding belt (1) and the unloading belt (2) are arranged parallel to each other. Several sets of the sheet frame (3) are arranged perpendicular to each other with the feeding belt (1) and the unloading belt (2). The unloading belt (2) can be cut along with the sheet frame (3) and a corresponding number of positioning holes (18) are opened.

3. The LED bracket assembly with moisture-proof function according to claim 1, characterized in that, The number of slots (4) is set in several groups, and the number of combinations of electrode support one (5) and electrode support two (6) is adapted to each other. The specifications of the slots (4) are adapted to the specifications of electrode support one (5) or electrode support two (6) covered with graphene silicone composite film cover (9).

4. The LED bracket assembly with moisture-proof function according to claim 1, characterized in that, The graphene-silicone composite film cover (9) is installed on the back side and adjacent sides of the electrode support one (5) and electrode support two (6) of each set of sheet frames (3). The bottom ends of the bonding wire part one (7) and bonding wire part two (8) are provided with fitting grooves (10) for fixing and snapping the graphene-silicone composite film cover (9). The graphene-silicone composite film cover (9) is a composite film structure made of graphene and silicone materials. The graphene material conducts heat to assist in heat dissipation, and the silicone material absorbs water, thus playing a comprehensive function of moisture prevention and heat dissipation.

5. An LED bracket assembly with moisture-proof function according to claim 1, characterized in that, The top of the LED chip base (13) is provided with an LED chip (11). The LED chip base (13) is embedded in the die bond cup (12), and there is a magnetic attraction between the iron-nickel alloy solder sheet (14) on its outer side and the neodymium iron boron magnetic strip (15), which can assist in rapid magnetic positioning and automatically correct the position of the LED chip (11).

6. An LED bracket assembly with moisture-proof function according to claim 1, characterized in that, The heat dissipation drainage groove (16) is formed by several sets of spaced neodymium iron boron magnetic strips (15) and is connected to the through hole (17) at the bottom so that water vapor can be automatically discharged and a natural heat dissipation channel can be formed.

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