Light emitting component and backlight panel
By filling the reflector cup with thermally expanding adhesive and thermally conductive material, the problem of reduced phosphor excitation efficiency at high temperatures in LED light sources is solved, achieving stability of white light color and uniformity of light-emitting components, and extending service life.
CN224503884UActive Publication Date: 2026-07-14MIANYANG HKC OPTOELECTRONICS TECH CO LTD +1
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MIANYANG HKC OPTOELECTRONICS TECH CO LTD
- Filing Date
- 2025-07-30
- Publication Date
- 2026-07-14
Smart Images
Figure CN224503884U_ABST
Abstract
The embodiment of the present application relates to a kind of light-emitting assembly and backlight panel, the light-emitting assembly includes: light-emitting chip, reflecting cup body, substrate and fluorescent glue, light-emitting chip and reflecting cup body are fixedly arranged on substrate, and light-emitting chip is located at the bottom of reflecting cup body;Reflecting cup body is filled with fluorescent glue, and light-emitting chip is covered by fluorescent glue;Reflecting surface of reflecting cup body is provided with glue containing groove, and heat expansion glue is filled in glue containing groove, and heat expansion glue contains fluorescent powder.This embodiment of the present application can compensate the attenuation of fluorescent powder in fluorescent glue caused by long time high temperature, reduce the risk of color deviation of white light emitted by light-emitting assembly, improve the range of light-emitting angle of light-emitting assembly, and improve light-emitting uniformity.
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