Display substrate and display device

Abstract

This disclosure provides a display substrate and a display device, belonging to the field of display technology. The display substrate of this disclosure has an opening area, a display area located on at least one side of the opening area, and a peripheral area surrounding the display area and the opening area; wherein, the display substrate includes: a substrate; a driving circuit layer disposed on the substrate and at least located in the display area; a display device disposed on the side of the driving circuit layer facing away from the substrate and located in the display area; an encapsulation layer including a first inorganic layer, a first organic layer, and a second inorganic layer sequentially disposed on the side of the display device facing away from the driving circuit layer, the first inorganic layer and the second inorganic layer being located in the display area, the opening area, and the peripheral area; the first organic layer being located in the display area and the peripheral area; and a second organic layer disposed on the side of the second inorganic layer facing away from the layer containing the display device and located in the display area, the opening area, and the peripheral area.

Description

Technical Field

[0001] This disclosure belongs to the field of display technology, specifically relating to a display substrate and a display device. Background Technology

[0002] With the advancement of technology, notched and full-screen displays have gradually come into view in recent years. Both notched and full-screen displays aim to increase the screen-to-body ratio of display devices. Therefore, to achieve a higher screen-to-body ratio, some openings (such as apertures) need to be reserved in certain locations on the display screen to accommodate additional components (such as cameras, sensors, etc.).

[0003] With the development and upgrading of display technology, organic electroluminescence display devices (OLEDs) have gradually become the mainstream products in the display field due to their characteristics such as self-illumination, high brightness, high contrast, low operating voltage, and the ability to be made into flexible displays.

[0004] However, for OLED display panels, the presence of the opening area results in insufficient strength at the opening area. Therefore, how to improve the strength of the display panel in the opening area is a technical problem that urgently needs to be solved. Utility Model Content

[0005] The present invention aims to solve at least one of the technical problems existing in the prior art, and to provide a display substrate and a display device.

[0006] This disclosure provides a display substrate having an opening area, a display area located on at least one side of the opening area, and a peripheral area surrounding the display area and the opening area; wherein, the display substrate includes:

[0007] Substrate;

[0008] A driving circuit layer is disposed on the substrate and is located at least in the display area;

[0009] The display device is disposed on the side of the driving circuit layer away from the substrate and located in the display area;

[0010] The encapsulation layer includes a first inorganic layer, a first organic layer, and a second inorganic layer sequentially disposed on the side of the display device opposite to the driving circuit layer, wherein the first inorganic layer and the second inorganic layer are located in the display area, the opening area, and the peripheral area; and the first organic layer is located in the display area and the peripheral area.

[0011] The second organic layer is disposed on the side of the second inorganic layer away from the layer where the display device is located, and is located in the display area, the opening area and the peripheral area.

[0012] The display substrate further includes a touch component disposed between the encapsulation layer and the second organic layer, and a touch protection layer located on the side of the touch component closer to the second organic layer.

[0013] The touch protection layer includes a limiting groove located in the peripheral area and extending through it along its thickness direction; the edge of the second organic layer is located within the limiting groove.

[0014] The display substrate further includes a peripheral encapsulation dam disposed on the substrate and located in the peripheral area;

[0015] The orthogonal projections of the layer containing the touch component and the touch protective layer on the substrate both cover the orthogonal projection of the peripheral encapsulation dam on the substrate.

[0016] The orthographic projection of the limiting groove on the substrate is located on the side of the orthographic projection of the peripheral encapsulation dam on the substrate that is closer to the display area.

[0017] The display substrate further includes a peripheral encapsulation dam disposed on the substrate and located in the peripheral area;

[0018] The orthographic projections of the second organic layer, the layer containing the touch component, and the touch protective layer on the substrate all cover the orthographic projection of the peripheral encapsulation dam on the substrate.

[0019] The display substrate further includes an auxiliary encapsulation dam disposed on the substrate and located in the peripheral area;

[0020] The orthographic projection of the second organic layer on the substrate covers the orthographic projections of the layer containing the touch component and the touch protection layer on the substrate, and is located within the area defined by the orthographic projection of the auxiliary encapsulation dam on the substrate.

[0021] The orthographic projection of the auxiliary encapsulation dam on the substrate is located on the side of the orthographic projection of the peripheral encapsulation dam on the substrate that is away from the display area.

[0022] The peripheral encapsulation dam includes multiple first substructures arranged sequentially along the direction away from the substrate; the auxiliary encapsulation dam includes multiple second substructures arranged sequentially along the direction away from the substrate, and at least a portion of the multiple second substructures is arranged in the same layer as at least a portion of the first substructure.

[0023] The display substrate further includes a touch component disposed on the side of the second organic layer away from the encapsulation layer, and a touch protective layer located on the side of the touch component away from the second organic layer.

[0024] The display substrate further includes a peripheral encapsulation dam disposed on the substrate and located in the peripheral area;

[0025] The orthographic projections of the second organic layer, the layer containing the touch component, and the touch protective layer on the substrate all cover the orthographic projection of the peripheral encapsulation dam on the substrate.

[0026] The display substrate further includes an auxiliary encapsulation dam disposed on the substrate and located in the peripheral area;

[0027] The orthographic projection of the second organic layer on the substrate is covered by the orthographic projections of the touch component layer and the touch protection layer on the substrate, and is located within the area defined by the orthographic projection of the auxiliary encapsulation dam on the substrate.

[0028] The orthographic projection of the auxiliary encapsulation dam on the substrate is located on the side of the orthographic projection of the peripheral encapsulation dam on the substrate that is away from the display area.

[0029] The peripheral encapsulation dam includes multiple first substructures arranged sequentially along the direction away from the substrate; the auxiliary encapsulation dam includes multiple second substructures arranged sequentially along the direction away from the substrate, and at least a portion of the multiple second substructures is arranged in the same layer as at least a portion of the first substructure.

[0030] The auxiliary encapsulation dam is disposed in the same layer as the touch protection layer.

[0031] A color filter layer is also provided on the side of the second organic layer that is opposite to the encapsulation layer.

[0032] A polarizer is provided on the side of the second organic layer away from the encapsulation layer, and an adhesive layer is provided on the side of the polarizer close to the second organic layer.

[0033] This disclosure provides a display device comprising any of the display substrates described above. Attached Figure Description

[0034] Figure 1 This is a plan view of the display substrate according to an embodiment of the present disclosure.

[0035] Figure 2 This is a schematic diagram of the substrate of an embodiment of the present disclosure.

[0036] Figure 3 for Figure 1 The diagram shows a cross-sectional view of the display substrate along the AA direction.

[0037] Figure 4 for Figure 1 The image shows a cross-sectional view of another display substrate along the AA direction.

[0038] Figure 5 for Figure 1 The diagram shows a cross-sectional view of the display substrate along the BB direction.

[0039] Figure 6 for Figure 1 The image shows a cross-sectional view of another display substrate in the BB direction.

[0040] Figure 7 for Figure 6 The diagram shows a cross-sectional view of the barrier wall of the display substrate.

[0041] Figure 8 This is a cross-sectional view of the isolation pillars in the isolation region of the display substrate according to an embodiment of this disclosure.

[0042] Figure 9 for Figure 1 The image shows a cross-sectional view of the display substrate in the CC direction.

[0043] Figure 10 This is a plan view of another display substrate according to an embodiment of the present disclosure.

[0044] Figure 11 This is a schematic diagram of the film layer of a display substrate according to an embodiment of the present disclosure.

[0045] Figure 12 This is a schematic diagram of the film layer of another display substrate according to an embodiment of the present disclosure.

[0046] Figure 13 This is a schematic diagram of the film layer of another display substrate according to an embodiment of the present disclosure.

[0047] Figure 14 This is a schematic diagram of the film layer of another display substrate according to an embodiment of the present disclosure.

[0048] Figure 15 for Figure 10 The image shows a cross-sectional view of the display substrate in the DD direction.

[0049] Figure 16 for Figure 15 The diagram shows a partial top view of the limiting groove and the outer packaging dam of the display substrate.

[0050] Figure 17 for Figure 10 Another cross-sectional view of the display substrate shown in the DD direction.

[0051] Figure 18 for Figure 17 A partial top view of the auxiliary encapsulation dam and the peripheral encapsulation dam of the display substrate shown.

[0052] Figure 19 for Figure 10 The diagram shows another cross-sectional view of the display substrate in the DD direction.

[0053] Figure 20 for Figure 10 The diagram shows another cross-sectional view of the display substrate in the DD direction.

[0054] Figure 21 for Figure 10 The diagram shows another cross-sectional view of the display substrate in the DD direction. Detailed Implementation

[0055] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0056] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0057] In this disclosure, unless otherwise stated, the term "same-layer arrangement" means that two layers, components, elements, or portions can be formed by the same patterning process, and that the two layers, components, elements, or portions are generally formed of the same material.

[0058] In this disclosure, unless otherwise stated, the term "patterning process" generally includes steps such as photoresist coating, exposure, development, etching, and photoresist stripping. The term "one-step patterning process" refers to a process that uses a photomask to form patterned layers, components, or parts.

[0059] Embodiments of this disclosure provide a display substrate, which may be an OLED display substrate. For example... Figure 1 As shown, this display substrate may have a display area 10a, an aperture area 10b, and a peripheral area. The display area 10a is located on at least one side of the aperture area 10b, and the peripheral area surrounds the display area 10a and the aperture area 10b. Figure 1 The example shown is the display area 10a surrounding the opening area 10b.

[0060] Specifically, the display substrate in this embodiment may include a substrate, a driving circuit layer, a display device, and a packaging layer.

[0061] The substrate can be a flexible substrate to improve the flexibility of the display substrate, enabling it to have properties such as bendability and flexibility, thereby expanding the application range of the display substrate; however, it is not limited to this, the substrate can also be set to rigid, and the specific performance of the substrate can be determined according to the actual needs of the product.

[0062] Furthermore, the substrate can be a single-layer structure or a multi-layer structure. For example, such as Figure 2 As shown, the substrate may include a polyimide layer and a buffer layer stacked sequentially. In other embodiments, the substrate may include multiple polyimide layers and buffer layers stacked sequentially. The buffer layer may be made of materials such as silicon nitride and silicon oxide to achieve the effects of blocking water and oxygen and blocking alkaline ions. It should be noted that the structure of the substrate is not limited to this and may be determined according to actual needs.

[0063] It should be noted that, in order to facilitate the subsequent processing of the required components in each area of ​​the display substrate, each area can be defined in advance on the substrate. For example, the display area, the opening area, and the peripheral area can be divided on the substrate first.

[0064] The driving circuit layer can be formed on the substrate. For example, such as Figure 3 As shown, the driving circuit layer can be formed on the buffer layer. Specifically, the portion of the driving circuit layer located in the display area 10a may include thin-film transistors and capacitor structures.

[0065] like Figure 3As shown, the thin-film transistor can be a top-gate type. This thin-film transistor may include an active layer 104, a first gate insulating layer 105, a gate 106, a second gate insulating layer 108, an interlayer dielectric layer 103, a source 110, and a drain 111. Specifically, the active layer 104 may be formed on a buffer layer 102. The first gate insulating layer 105 covers the buffer layer 102 and the active layer 104. The gate 106 is formed on the side of the first gate insulating layer 105 away from the active layer 104. The second gate insulating layer 108 covers the gate 106 and the first gate insulating layer 105. The interlayer dielectric layer 103 covers the second gate insulating layer 108. The source 110 and the drain 111 are formed on the side of the interlayer dielectric layer 103 away from the substrate and are located on opposite sides of the gate 106, respectively. The source 110 and the drain 111 can contact the opposite sides of the active layer 104 through vias (e.g., metal vias). It should be understood that this thin-film transistor can also be a bottom-gate type.

[0066] like Figure 3 As shown, the capacitor structure may include a first electrode 130 and a second electrode 131. The first electrode 130 is disposed on the same layer as the gate 103, and the second electrode 131 is located between the second gate insulating layer 105 and the interlayer dielectric layer 103, and is disposed opposite to the first electrode 130.

[0067] For example, the materials of the gate 103, the first electrode 130, and the second electrode 131 may include metallic or alloy materials, such as molybdenum, aluminum, and titanium. The source 110 and the drain 111 may include metallic or alloy materials, such as a single-layer or multi-layer metal structure formed of molybdenum, aluminum, and titanium. For example, the multi-layer structure is a multi-metal stack, such as a titanium, aluminum, and titanium three-layer metal stack (Al / Ti / Al).

[0068] The first electrode 112 and pixel defining portion 113 on the interlayer dielectric layer 103. It should be understood that the display device may also include a light-emitting portion 114a and a second electrode 115.

[0069] In detail, when the thin-film transistor in display area 10a is a top-gate type, a planarization layer can be fabricated before fabricating the display device. This planarization layer can be a single-layer structure or a multi-layer structure; this planarization layer is usually made of organic materials, such as photoresist, acrylic polymers, silicon polymers, etc. Figure 3As shown, this planarization layer may include a planarization portion 116 located in the display area 10a, which is formed between the interlayer dielectric layer 103 and the first electrode 112. The first electrode 112 can be electrically connected to the drain electrode 111 via a metal via. The first electrode 112 can be an anode, made of materials such as ITO (indium tin oxide), indium zinc oxide (IZO), or zinc oxide (ZnO). A pixel defining portion 113 may cover the planarization portion 116. This pixel defining portion 113 can be made of organic materials, such as photoresist, and the portion of the pixel defining portion 113 located in the display area 10a may have a pixel opening exposing the first electrode 112. A light-emitting portion 114a is located within the pixel opening and formed on the first electrode 112. The light-emitting portion 114a may include small... The molecular organic material or polymeric molecular organic material can be a fluorescent luminescent material or a phosphorescent luminescent material, which can emit red, green, blue, or white light, etc.; and, depending on different actual needs, in different examples, the light-emitting part 114a can further include functional layers such as an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer; the second electrode 115 covers the light-emitting part 114a, and the polarity of the second electrode 115 is opposite to that of the first electrode 112; this second electrode 115 can be a cathode, which can be made of metal materials such as lithium (Li), aluminum (Al), magnesium (Mg), and silver (Ag).

[0070] It should be noted that, as Figure 3 As shown, the first electrode 112, the light-emitting portion 114a, and the second electrode 115 can constitute a light-emitting sub-pixel 1d. The portion of the display area 10a in this display device may include multiple light-emitting sub-pixels 1d arranged in an array. Furthermore, it should be noted that the first electrodes 112 of each light-emitting sub-pixel 1d are independent of each other, and the second electrodes 115 of each light-emitting sub-pixel 1d are connected across their entire surface; that is, the second electrode 115 is a full-surface structure disposed on the display substrate 10, serving as a common electrode for multiple display devices.

[0071] In some embodiments, such as Figure 3 As shown, a support portion 132 may be provided on the side of the pixel defining portion 113 facing away from the interlayer dielectric layer 103. This support portion 132 can support the protective film layer (not shown in the figure) to prevent the protective film layer from contacting the first electrode 112 or other traces, which could easily damage the first electrode 112 or other traces. It should be noted that this protective film layer mainly appears during the transfer of semi-finished products to prevent damage to the semi-finished products during the transfer process. Specifically, when transferring the substrate with the support portion 132 to the evaporation line, a protective film layer can be applied. When the evaporation of the light-emitting material is required, the protective film layer is removed.

[0072] For example, the material of the support portion 132 may be the same as the material of the pixel defining portion 113, and the support portion 132 and the pixel defining portion 113 may be formed using the same patterning process. However, it is not limited to this. The material of the support portion 132 may also be different from the material of the pixel defining portion 113, and the support portion 132 and the pixel defining portion 113 may also be formed using different patterning processes.

[0073] In some embodiments, such as Figure 4 As shown, the first electrode 112 can also be electrically connected to the drain electrode 111 via the transition electrode 133. When the first electrode 112 is electrically connected to the drain electrode 111 via the transition electrode 133, the planarization portion 116 can be a double-layer structure, specifically including a first planarization film (PLN1) layer 116a and a second planarization film (PLN2) layer 116b formed sequentially. In addition, a passivation film (PVX) layer 134 can be formed between the first planarization film layer 116a and the interlayer dielectric layer 103. The passivation film layer 134 can be made of silicon oxide, silicon nitride, or silicon oxynitride, etc. Material formation: The passivation film 134 covers the source electrode 110 and the drain electrode 111; the transition electrode 133 is formed between the first planarization film 116a and the second planarization film 116b, and is electrically connected to the drain electrode 111 through vias (e.g., metal vias) on the first planarization film 116a and the passivation film 134; and the first electrode 112 can be electrically connected to the transition electrode 133 through vias (e.g., metal vias) on the second planarization film 116b.

[0074] like Figure 3 and 4 As shown, the encapsulation layer 118 can be formed on the side of the layer where the light-emitting device is located, away from the driving circuit layer.

[0075] Detailed explanation, such as Figures 3 to 5 As shown, the encapsulation layer 118 of the display substrate 10 may include a first inorganic layer 118a, a first organic layer 118b, and a second inorganic layer 118c, which are sequentially stacked. The first inorganic layer 118a and the second inorganic layer 118c prevent water and oxygen from entering the light-emitting portion 114a of the display area 10a from the display side and the opening area 10b. The first inorganic layer 118a and the second inorganic layer 118c may be made of inorganic materials such as silicon nitride and silicon oxide. The first organic layer 118b is used for planarization to facilitate the fabrication of the second inorganic layer 118c. This first organic layer 118b may be made of materials such as acrylic polymers and silicon polymers.

[0076] The first inorganic layer 118a and the second inorganic layer 118c can be made by chemical vapor deposition, but are not limited to this, physical vapor deposition, etc. can also be used; while the first organic layer 118b is made by inkjet printing, but is not limited to this, spraying, etc. can also be used.

[0077] In some embodiments of this disclosure, the display substrate further includes a transition region located between the display area and the aperture area. The display substrate also includes a first encapsulation dam 1a formed on the side of the interlayer dielectric layer 103 facing away from the substrate and located in the transition region 10c. The first encapsulation dam 1a surrounds the aperture area 10b. In embodiments of this disclosure, the first encapsulation dam 1a may include a first barrier portion 117. When the display substrate 10 is encapsulated by the encapsulation layer 118, the first barrier portion 117 can restrict the flow of the first organic layer 118b material in the encapsulation layer 118, preventing the first organic layer 118b material in the encapsulation layer 118 from flowing to the aperture area 10b and causing encapsulation failure. In other words, the first barrier portion 117 of the first encapsulation dam 1a can cooperate with the encapsulation layer 118 to effectively block water and oxygen from entering the display area 10a through the aperture area 10b, thereby preventing the light-emitting portion 114a of the display area 10a from failing and resulting in poor display performance, and extending the product's lifespan.

[0078] In the embodiments of this disclosure, the first barrier portion 117 and the pixel defining portion 113 are disposed on the same layer, that is, the first barrier portion 117 and the pixel defining portion 113 can be formed simultaneously in a single patterning process, which can reduce processing steps and the use of photomasks, thereby reducing costs. Furthermore, it should be understood that the first barrier portion 117 and the pixel defining portion 113 should be disconnected from each other.

[0079] Furthermore, the first encapsulation dam 1a also includes a first protective portion 119 formed on the interlayer medium layer 103, and the first protective portion 119 has the aforementioned first barrier portion 117 disposed on the side opposite to the interlayer medium layer 103. In other words, in the embodiments of this disclosure, before fabricating the first encapsulation dam 1a, a first protective portion 119 can be formed on the surface of the interlayer dielectric layer 103 located in the transition region 10c, and then a first barrier portion 117 can be formed on the side of the first protective portion 119 away from the interlayer dielectric layer 103. By setting the first protective portion 119, the surface of the interlayer dielectric layer 103 located in the transition region 10c can be protected before fabricating the first barrier portion 117, thereby reducing the number of times the interlayer dielectric layer 103 located in the transition region 10c is cleaned by the etching solution, thereby improving the adhesion of the interlayer dielectric layer 103 located in the transition region 10c, ensuring the stable bonding between the first encapsulation dam 1a and the interlayer dielectric layer 103, effectively reducing the risk of the first encapsulation dam 1a falling off during the process, thereby reducing the risk of encapsulation failure, improving the encapsulation yield, and ensuring the display effect and product lifespan.

[0080] Furthermore, the display substrate 10 also includes a second encapsulation dam 1b, which is formed on the side of the interlayer dielectric layer 103 away from the substrate and located in the transition region 10c. The second encapsulation dam 1b is located on the side of the first encapsulation dam 1a away from the display region 10a and surrounds the opening region 10b. The thickness of the second encapsulation dam 1b is greater than the thickness of the first encapsulation dam 1a. This further restricts the flow of the first organic layer 118b material of the encapsulation layer 118, preventing the material of the first organic layer 118b of the encapsulation layer 118 from flowing to the opening region 10b and causing encapsulation failure.

[0081] Specifically, such as Figure 5 As shown, the second encapsulation dam 1b may include a second protective portion 120 and a second barrier portion 121 formed on the side of the second protective portion 120 away from the interlayer dielectric layer 103. The second barrier portion 121 is disposed in the same layer as the first barrier portion 117. That is, the second barrier portion 121, the first barrier portion 117 and the pixel defining portion 113 can be formed simultaneously in one patterning process, which can reduce the number of processing steps and the use of mask, thereby reducing costs.

[0082] Furthermore, it should be understood that the first barrier portion 117 and the second barrier portion 121 should be disconnected from each other. This design can increase the barrier and encapsulation path, thereby further improving the encapsulation effect.

[0083] like Figure 5 As shown, at least one of the first encapsulation dam 1a and the second encapsulation dam 1b further includes a photospacer (PS). This photospacer can be formed on the side of the first barrier portion 117 or the second barrier portion 121 away from the interlayer dielectric layer 103. It can increase the thickness of the first encapsulation dam 1a and the second encapsulation dam 1b. The photospacer can block the flow of the first organic layer 118b material in the encapsulation layer 118 to the opening region 10b, further improving the restriction on the flow of the first organic layer 118b material in the encapsulation layer 118, and further improving the reliability of the display substrate 10 encapsulation.

[0084] For example, the aforementioned spacer portion can be disposed on the same layer as the support portion 132 of the display area 10a. The spacer portion formed on the first barrier portion 117 can be defined as the first spacer portion 122, and the spacer portion formed on the second barrier portion 121 can be defined as the second spacer portion 123. The first spacer portion 122 and the first barrier portion 117 can be made of the same material, and the first spacer portion 122 and the first barrier portion 117 can be formed using the same patterning process (e.g., grayscale masking process) to improve the structural stability of each layer in the first encapsulation dam 1a; however, this is not limited to this, the materials of the first spacer portion 122 and the first barrier portion 117 can also be different, and... The first spacer portion 122 and the first barrier portion 117 can be formed using different patterning processes; similarly, the second spacer portion 123 and the second barrier portion 121 can be made of the same material, and the second spacer portion 123 and the second barrier portion 121 can be formed using the same patterning process (e.g., grayscale masking process) to improve the structural stability of each layer in the first encapsulation dam 1a; however, it is not limited to this, the second spacer portion 123 and the second barrier portion 121 can also be made of different materials, and the second spacer portion 123 and the second barrier portion 121 can be formed using different patterning processes.

[0085] It should be noted that the thickness mentioned in the embodiments of this disclosure refers to the thickness in the following situations: Figures 3 to 5 The dimensions in the Z direction are shown.

[0086] In some embodiments, such as Figure 6 and Figure 7 As shown, the transition zone 10c may also include a third encapsulation dam 1c, a barrier wall 135, and an organic insulating encapsulation part 139.

[0087] The third encapsulation dam 1c is disposed around the opening region 10a and located on the side of the second encapsulation dam 1b closest to the opening region 10a; the third encapsulation dam 1c and the second encapsulation dam 1b have the same structure and include the same material. Thus, the third encapsulation dam 1c and the second encapsulation dam 1b can be formed using the same material layer and the same patterning process.

[0088] A barrier wall 135 is located between the second encapsulation dam 1b and the third encapsulation dam 1c, and this barrier wall 135 is disposed around the third encapsulation dam 1c. For example, this barrier wall 135 may include a first film layer 136 disposed in the same layer as the gate 106 and the first electrode 130, a second film layer 137 disposed in the same layer as the second electrode 131, a third film layer 138 disposed in the same layer as the source 110 and the drain 111, a second gate insulating layer 108 disposed between the first film layer 136 and the second film layer 137, and an interlayer dielectric layer 103 disposed between the third film layer 138 and the second film layer 137. That is, the first film layer 136, the gate 106, and the first electrode 130 have the same structure and include the same material; the second film layer 137 and the second electrode 131 have the same structure and include the same material; the third film layer 137 has the same structure as the source 110 and the drain 111 and includes the same material. Thus, the first film layer 136, the gate 106, and the first electrode 130 can be formed using the same material layer and the same patterning process; the second film layer 137 and the second electrode 131 can be formed using the same material layer and the same patterning process; the third film layer 137, the source electrode 110, and the drain electrode 111 can be formed using the same material layer and the same patterning process.

[0089] The organic insulating encapsulation portion 139 is located between the third encapsulation dam 1c and the second encapsulation dam 1b and covers the barrier wall 135. The organic insulating encapsulation portion 139 is made of the same material as the organic encapsulation film layer 118b of the encapsulation layer 118, for example, it can be formed by the same inkjet printing process.

[0090] In this embodiment, by setting the third encapsulation dam 1c, the barrier wall 135 and the organic insulating encapsulation part 139, a further barrier effect is provided, so that the transition zone 10c can fully isolate the opening zone 10b and the display zone 10a, prevent impurities such as water and oxygen from entering the display zone 10a from the opening zone 10b, and prevent cracks that may be formed when the opening zone 10b is formed from extending to the display zone 10a.

[0091] In the transition zone 10c, which includes the third encapsulation dam 1c, the barrier wall 135, and the organic insulating encapsulation part 139, the aforementioned first inorganic encapsulation film layer 118a also covers the third encapsulation dam 1c and the barrier wall 135; the organic encapsulation film layer 118b and the organic insulating encapsulation part 139 are formed by inkjet printing; the second inorganic encapsulation film layer 118c also covers the third encapsulation dam 1c, the barrier wall 135, and the organic insulating encapsulation part 139.

[0092] It should be noted that, in the embodiments of this disclosure, as... Figure 1As shown, when the opening area 10b is circular, the orthographic projection of the first encapsulation dam 1a, the second encapsulation dam 1b, the second encapsulation dam 1c, and the barrier wall 135 on the substrate can also be an annulus; when the opening area 10b is rectangular, the orthographic projection of the first encapsulation dam 1a, the second encapsulation dam 1b, the second encapsulation dam 1c, and the barrier wall 135 on the substrate can also be a rectangular annulus; however, it is not limited to this, the opening area 10b can also be other regular or irregular shapes, and the first encapsulation dam 1a, the second encapsulation dam 1b, the second encapsulation dam 1c, and the barrier wall 135 can be adapted to it.

[0093] In some embodiments, the display substrate of this disclosure further includes an isolation region 10d located on the side of the display area 10a near the transition region 10c. The display substrate 10 also includes an isolation pillar 124 located in the isolation region 10d. This isolation pillar 124 is formed on the side of the interlayer dielectric layer 103 away from the substrate and surrounds the first encapsulation dam 1a. The sidewall of the isolation pillar 124 is provided with a groove 124a. When depositing the light-emitting material or the cathode material, the light-emitting material layer 114 and the cathode (i.e., the second electrode 115) are interrupted at this groove 124a. This can block the path of water and oxygen in the opening region 10b to erode the display area 10a, thereby further preventing the light-emitting part 114a of the display area 10a from being eroded, improving the display effect of the display substrate 10 and extending the product life.

[0094] It should be noted that the number of isolation columns 124 is not limited to one, and there may be multiple ones.

[0095] In some embodiments, the isolation pillar 124 may be disposed on the same layer as the source 110 and drain 111 of the thin-film transistor, that is, the isolation pillar 124 and the source 110 and drain 111 are formed using the same patterning process. This design can also reduce the number of processing steps and the use of photomasks, thereby reducing costs. Furthermore, it should be understood that the isolation pillar 124 should be disconnected from the source 110 and drain 111 of the thin-film transistor to prevent the isolation pillar 124 from being powered on during display.

[0096] Since the aforementioned isolation pillar 124 can be disposed on the same layer as the source 110 and drain 111 of the thin-film transistor in the display area 11a, the structure and material of the isolation pillar 124 can be the same as the structure and material of the source 110 and drain 111. For example, when the source 110 and drain 111 are three-layer metal structures, the isolation pillar 124 can also be a three-layer metal structure. Specifically, as... Figure 8As shown, the isolation pillar 124 may include a first metal layer 124b, a second metal layer 124c, and a third metal layer 124d stacked sequentially on the interlayer dielectric layer 103. The outer boundary of the orthographic projection of the second metal layer 124c on the interlayer dielectric layer 103 is located inside the outer boundary of the orthographic projection of the first metal layer 124b and the third metal layer 124d on the interlayer dielectric layer 103, so as to form a groove 124a on the side wall of the isolation pillar 124, so that the longitudinal section of the isolation pillar 124 is an "I" shaped structure.

[0097] The first metal layer 124b and the third metal layer 124d can be titanium layers, i.e., they can be made of titanium (Ti). The second metal layer 124c can be an aluminum layer, i.e., it can be made of aluminum (Al). This ensures that the first metal layer 124b and the third metal layer 124d are not affected by etching when the second metal layer 124c is laterally etched. However, this is not a limitation; the first metal layer 124b, the second metal layer 124c, and the third metal layer 124d can also be made of other materials, such as molybdenum, aluminum, or alloys, as long as the above-mentioned technical effects can be achieved. This disclosure does not impose any restrictions on this. In some examples, the display substrate also has an inner ring routing area 10e located between the isolation area and the display area 11a. The driving circuit layer also includes inner ring signal lines located in the inner ring routing area 10e, which can be electrically connected to the signal lines of the display area. For example, multiple inner ring signal lines may be provided, including at least a first inner ring signal line 129a disposed on the same layer as the source 110 / drain 111 of the thin film transistor, a second inner ring signal line 129b disposed on the same layer as the gate 106 / first electrode 130 of the thin film transistor, and a third inner ring signal line 129c disposed on the same layer as the second electrode 131.

[0098] It should be understood that there may be multiple inner ring signal lines 129a, 129b, and 129c.

[0099] In some embodiments, the first inner ring signal line 129a may include data signal lines, but is not limited thereto, and may also include other signal lines, as long as the signal lines of the conductive layer can be arranged as required; the second inner ring signal line 129b may include gate signal lines, but is not limited thereto, and may also include other signal lines, as long as the signal lines of the conductive layer can be arranged as required; the third inner ring signal line 129c may include reset signal lines and initialization lines, but is not limited thereto, and may also include other signal lines, as long as the signal lines of the conductive layer can be arranged as required.

[0100] In some embodiments, the first inner ring signal line 129a may include a gate signal line, but is not limited thereto, and may also include other signal lines, such as a reset signal line or an initialization line, as long as the signal lines of the conductive layer can be arranged as required; the second inner ring signal line 129b may be a data signal line, but is not limited thereto, and may also include other signal lines, as long as the signal lines of the conductive layer can be arranged as required; the third inner ring signal line 129c may include a data signal line, but is not limited thereto, and may also include other signal lines, as long as the signal lines of the conductive layer can be arranged as required.

[0101] It should be noted that, after the opening area 10b in the display substrate 10 of this embodiment is processed, it is used to assemble devices such as cameras, sensors, HOME buttons, earpieces, or speakers. It should also be noted that, for the display substrate 10 of this embodiment, it can be as follows... Figure 5 and Figure 6 As shown, the opening area 10b is not processed by opening. The opening can be processed before assembling devices such as cameras. Furthermore, the display substrate 10 of this embodiment can also be as follows... Figure 10 As shown, the opening area 10b has been opened, and under these conditions, the display substrate 10 can be directly used for subsequent assembly. Furthermore, it should be noted that after opening the display area 10a of the display substrate 10 of this disclosure, the resulting opening includes, but is not limited to, the following forms: through holes, grooves, and openings.

[0102] In some examples, the peripheral region of the display substrate in embodiments of this disclosure may include a peripheral encapsulation region surrounding the display area; such as Figure 9 As shown, the peripheral encapsulation area 10g may also be provided with a peripheral encapsulation dam. Specifically, the peripheral encapsulation dam may include a first peripheral encapsulation dam 127 and a second peripheral encapsulation dam 128. The second peripheral encapsulation dam 128 is disposed on the side of the first peripheral encapsulation dam 127 away from the display area 10a, and the thickness of the second peripheral encapsulation dam 128 is greater than the thickness of the first peripheral encapsulation dam 127. The first peripheral encapsulation dam 127 may include a first peripheral barrier portion 127a and a first peripheral spacer portion 127b sequentially formed on the interlayer dielectric layer 103. The second peripheral encapsulation dam 128 may include a third protective portion 128a, a second peripheral barrier portion 128b, and a second peripheral spacer portion 128c sequentially formed on the interlayer dielectric layer 103.

[0103] In some embodiments, the third protective portion 128a may be disposed on the same layer as the planarization portion 116 of the display area 10a, the first peripheral barrier portion 127a and the second peripheral barrier portion 128b may be disposed on the same layer as the pixel defining portion 113 of the display area 10a, and the first peripheral spacer portion 127b and the second peripheral spacer portion 128c may be disposed on the same layer as the support portion of the display area 10a.

[0104] It should be noted that the first peripheral encapsulation dam 127 may also include a protective part located between the interlayer dielectric layer 103 and the first peripheral barrier part 127a, and disposed in the same layer as the planarization part 116, depending on the specific circumstances.

[0105] In some embodiments, the thickness difference between the second peripheral encapsulation dam 128 and the first peripheral encapsulation dam 127 is greater than the thickness difference between the second encapsulation dam 1b and the first encapsulation dam 1a.

[0106] In some examples, the peripheral region of the display substrate in this embodiment may include a peripheral trace region 10f surrounding the display area and located on the side of the peripheral packaging region closer to the display area. The driving circuit layer also includes a peripheral trace 107 and a peripheral adapter line 109 located in the peripheral trace region 10f. The peripheral trace 107 may have its source 110 and drain 111 disposed on the same layer, and the peripheral adapter line 109 may be disposed on the same layer as the first electrode 112. A portion of the peripheral trace 107 may extend below the first peripheral packaging dam 127 and the second peripheral packaging dam 128. The peripheral adapter line 109 is electrically connected to a portion of the peripheral trace 107 located in the peripheral trace region 10f via a via, and the peripheral adapter line 109 may also be electrically connected to the second electrode 115 located in the peripheral trace region 10f. Furthermore, the peripheral trace 107 may be a VSS power line, but is not limited thereto.

[0107] It should be noted that the peripheral routing area 10f can be provided not only with peripheral routing 107 and peripheral adapter 109, but also with other routing (not shown in the figure). It should be understood that other routing can include not only routing that is set on the same layer as the source 110 and drain 111, and routing that is set on the same layer as the first electrode 112, but also routing that is set on the same layer as the first electrode plate 130, the second electrode plate 131, or the adapter electrode 133.

[0108] In some embodiments, such as Figure 5 and Figure 6 As shown, the driving circuit layer also includes inner ring signal lines located in the inner ring trace area 10e, which can be electrically connected to the signal traces of the display area. For example, multiple inner ring signal lines can be provided, including at least a first inner ring signal line 129a disposed on the same layer as the source 110 / drain 111 of the thin-film transistor, a second inner ring signal line 129b disposed on the same layer as the gate 106 / first electrode 130 of the thin-film transistor, and a third inner ring signal line 129c disposed on the same layer as the second electrode 131.

[0109] It should be understood that there may be multiple inner ring signal lines 129a, 129b, and 129c.

[0110] In some embodiments, the first inner ring signal line 129a may include data signal lines, but is not limited thereto, and may also include other signal lines, as long as the signal lines of the conductive layer can be arranged as required; the second inner ring signal line 129b may include gate signal lines, but is not limited thereto, and may also include other signal lines, as long as the signal lines of the conductive layer can be arranged as required; the third inner ring signal line 129c may include reset signal lines and initialization lines, but is not limited thereto, and may also include other signal lines, as long as the signal lines of the conductive layer can be arranged as required.

[0111] In some embodiments, the first inner ring signal line 129a may include a gate signal line, but is not limited thereto, and may also include other signal lines, such as a reset signal line or an initialization line, as long as the signal lines of the conductive layer can be arranged as required; the second inner ring signal line 129b may be a data signal line, but is not limited thereto, and may also include other signal lines, as long as the signal lines of the conductive layer can be arranged as required; the third inner ring signal line 129c may include a data signal line, but is not limited thereto, and may also include other signal lines, as long as the signal lines of the conductive layer can be arranged as required.

[0112] This disclosure provides a display substrate 10, which has an opening region 10b, a display region 10a located on at least one side of the opening region 10b, and a peripheral region 10h surrounding the display region 10a and the opening region 10b. Figure 10 This example only uses the display area 10a surrounding the opening area 10b as an example. Additionally, the display substrate 10 in this example can also have... Figure 1 The transition area, isolation area, and inner ring routing area shown in the diagram, as well as the peripheral area 10h, can also include the outer routing area and outer encapsulation area. This is only for ease of understanding and description in the following content. Figure 10 The image only shows the display area 10a, the opening area 10b, and the surrounding area 10h. For example... Figure 11 and 12 As shown, the display substrate 10 in this example includes not only the aforementioned structures, namely the substrate 101, driving circuit layer 200, display device 100, and encapsulation layer 118, but also, in this embodiment, a second organic layer 300 disposed on the side of the second inorganic encapsulation layer 118 facing away from the substrate. This second organic layer 300 covers at least a portion of the display area 10a and the peripheral area 10h, and also covers the opening area 10b, thereby solving the problem of low strength of the display substrate 10 due to the presence of openings in the opening area 10b. The strength of the display substrate 10 can be greatly improved by providing the second organic layer 300. Furthermore, the second organic layer 300 also provides a certain degree of flatness, improving the flatness of the display surface of the display substrate 10 and significantly reducing the risk of light leakage at the four corners of the display panel using this display substrate 10.

[0113] In some examples, the second organic layer 300 can be made of the same material as the first organic layer 118b, such as an acrylic polymer or a silicone polymer. The second organic layer 300 can be made using inkjet printing, but is not limited to this; it can also be made using spraying or other processes.

[0114] It should be noted that when the display substrate 10 of this embodiment has a similar structure to... Figure 1 When the same transition area, isolation area, inner ring wiring area, and outer ring wiring area are included, the second organic layer 300 can also cover the transition area, isolation area, inner ring wiring area, and outer ring wiring area.

[0115] In some embodiments, such as Figure 11 and 12 As shown, the display substrate 10 in this embodiment may include a touch component 400. In one example, the touch component 400 may include a first touch conductive layer and a second touch conductive layer, with an interlayer dielectric layer 401 disposed between the first and second touch conductive layers. For example, the first touch conductive layer includes a bridge electrode, and the second touch conductive layer includes a touch electrode (TX electrode) and a sensing electrode (RX electrode), wherein the RX electrode is electrically connected to the bridge electrode through a via disposed in the interlayer dielectric layer 401.

[0116] Furthermore, each of the first and second touch conductive layers may include a conductive material. The conductive material may include, for example, a metal, a metal alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, etc.

[0117] In some embodiments, such as Figure 11 and 12 As shown, a touch protection layer 500 is also provided on the side of the touch component 400 facing away from the substrate, and the touch protection layer 500 extends from the display area 10a to the peripheral area 10h. The material of the touch protection layer 500 may include inorganic insulating materials or organic insulating materials.

[0118] When the display substrate 10 includes a touch component 400 and a touch protective layer 500, the second organic layer 300 can be formed on the side of the touch component 400 close to the substrate 101, or the touch protective layer 500 can be formed on the side away from the substrate 101. The specific structure will be described in detail with reference to the following specific examples.

[0119] In some examples, such as Figure 13As shown, the display substrate 10 in this embodiment can be applied to a COE display panel. In this case, the display substrate 10 not only includes the above-described structure, but also a colored green light layer can be disposed on the light-emitting surface side of the above structure. Taking the display substrate 10 including a touch component 400 and a touch protection layer 500 as an example, the color filter layer 700 is disposed on the side of the touch protection layer 500 facing away from the substrate. When the color filter layer 700 is disposed in the display substrate 10, the polarizer 800 can be omitted, thereby achieving a thinner and lighter design, improved light transmittance, and reduced power consumption.

[0120] Specifically, when the display devices 100 in the display substrate 10 include a red display device 100, a green display device 100, and a blue display device 100, the color filter layer 700 correspondingly includes a red filter, a green filter, and a blue filter. A black matrix is ​​provided between adjacent color filters to prevent light leakage. The red filter is disposed on the light-emitting side of the red display device 100, the green filter is disposed on the light-emitting side of the green display device 100, and the blue filter is disposed on the light-emitting side of the blue display device 100.

[0121] In some examples, such as Figure 14 As shown, the display substrate 10 may also include a polarizer 800, which is attached to the light-emitting surface of the display substrate 10 via an adhesive layer 900. When the display substrate 10 has a touch component 400 and a touch protective layer 500, the polarizer 800 can be attached to the touch protective layer 500 via the adhesive layer 900.

[0122] The specific structures of several display substrates 10 according to embodiments of this disclosure will be described below with reference to specific examples. It should be noted that the parts of the display substrate 10 that are the same as those described above will not be repeated.

[0123] First example: such as Figure 15 and 16 As shown, in this example, the second organic layer 300 is disposed on the side of the touch protection layer 500 facing away from the substrate. The touch protection layer 500 has a limiting groove 501 extending through its thickness direction, which is located in the peripheral area 10h and surrounds the display area 10a. The edge of the second organic layer 300 falls within the limiting groove 501, that is, the limiting groove 501 is used to prevent the second organic layer 300 from spreading outward.

[0124] In some examples, the limiting groove 501 can be specifically disposed within the peripheral packaging area of ​​the peripheral region 10h. The orthographic projection of the limiting groove 501 onto the substrate is located on the side of the peripheral packaging dam onto the substrate closer to the display area 10a. Specifically, the peripheral packaging dam may include the first peripheral packaging dam 127 and the second peripheral packaging dam 128 described above.

[0125] In some examples, such as Figure 15 and 16 As shown in the example, the number of limiting grooves 501 is one. Of course, the number of limiting grooves 501 can also be multiple, which can be specifically set according to the specific thickness of the second organic layer 300 and the material used.

[0126] In some examples, the orthographic projections of the touch interlayer dielectric layer 401 and the touch protective layer 500 in the touch component 400 onto the substrate cover the orthographic projection of the peripheral encapsulation dam onto the substrate. This arrangement can further seal the display device 100 located in the display area 10a of the display substrate 10 and also prevent the edge film layer of the display substrate 10 from separating.

[0127] The second example, such as Figure 17 He Ru Figure 18 As shown, this example has a structure largely the same as the first example, except that in this example, the orthographic projection of the second organic layer 300 on the substrate 101 covers the orthographic projection of the peripheral encapsulation dam on the substrate 101. Furthermore, an auxiliary encapsulation dam 600 is also provided on the substrate 101 to block the second organic layer 300.

[0128] Specifically, the orthographic projection of the auxiliary encapsulation dam 600 on the substrate is located on the side opposite to the display area 10a, and the orthographic projection of the second organic layer 300 on the substrate is located on the orthographic projection of the auxiliary encapsulation dam 600 on the substrate 101.

[0129] In some examples, the orthographic projection of the second organic layer 300 on the substrate covers the orthographic projection of the touch interlayer dielectric layer 401 and the touch protective layer 500 in the touch assembly 400 on the substrate 101. With this arrangement, the display device 100 located in the display area 10a of the display substrate 10 can be further sealed, and the edge film layer of the display substrate 10 can also be prevented from separating.

[0130] In some examples, the peripheral encapsulation dam may specifically include the first peripheral encapsulation dam 127 and the second peripheral encapsulation dam 128 described above. Both the first peripheral encapsulation dam 127 and the second peripheral encapsulation dam 128 include multiple layers of first substructures sequentially arranged along the direction away from the substrate 101. That is, similar to the above structure, the first peripheral encapsulation dam 127 may include a first peripheral barrier portion 127a and a first peripheral spacer portion 127b sequentially formed on the interlayer dielectric layer 103; the second peripheral encapsulation dam 128 may include a third protective portion 128a, a second peripheral barrier portion 128b, and a second peripheral spacer portion 128c sequentially formed on the interlayer dielectric layer 103. The auxiliary encapsulation dam 600 may specifically include multiple layers of second substructures sequentially arranged along the direction away from the substrate 101, with at least a portion of the multiple layers of second substructures disposed on the same layer as at least a portion of the multiple layers of first substructures. In other words, the auxiliary encapsulation dam 600 may include two second substructures, each of which may be set on the same layer as the two-layer structure of the first peripheral encapsulation dam 127. Alternatively, the auxiliary encapsulation dam 600 may include three second substructures, each of which may be set on the same layer as the three-layer structure of the second peripheral encapsulation dam 128. In this way, the auxiliary encapsulation dam 600 can be formed at the same time as the peripheral encapsulation dam, without increasing the number of process steps or process costs.

[0131] In some examples, the auxiliary encapsulation dam 600 can also be set in the same layer as the touch protection layer 500, that is, the auxiliary encapsulation dam 600 is formed at the same time as the touch protection layer 500, which does not increase the process steps and process cost.

[0132] The third example: such as Figure 19 As shown, this example has a structure that is roughly the same as the second example, except that in this example, the second organic layer 300 is located on the side of the layer where the touch component 400 is located, close to the second inorganic layer.

[0133] In some examples, the orthographic projections of the touch interlayer dielectric layer 401 and the touch protective layer 500 in the touch component 400 onto the substrate 101 cover the orthographic projections of the second organic layer 300 and the auxiliary encapsulation dam 600 onto the substrate 101. With this arrangement, the display device 100 located in the display area 10a of the display substrate 10 can be further sealed.

[0134] In this example, similar to the second example above, the layer structure of the outer encapsulation dam and the auxiliary encapsulation dam 600 can be fabricated in a single process, which will not be described in detail here.

[0135] Fourth example: such as Figure 6 , 14As shown in Figures 20 and 21, the display substrate 10 of this example includes a polarizer 800, which is attached to the touch protection layer 500 via an adhesive layer 900. A second organic layer 300 is disposed on the side of the layer containing the touch component 400 near the second inorganic layer, or the second organic layer 300 is disposed on the side of the adhesive layer 900 near the touch protection layer 500.

[0136] The reason for this configuration is that the isolation zone 10e and the aperture zone 10b have isolation pillars 124, and the transition zone 10c has a first encapsulation dam 1a and a second encapsulation dam 1b. This results in a complex structure around the aperture zone 10b, and the first inorganic layer 118a and the second inorganic layer 118c cannot effectively cover the signal lines in the inner ring routing area, leading to local discontinuities. The discontinuities are filled by the material of the adhesive layer 900. However, the material of the adhesive layer 900 accumulates slightly, and the edges become misaligned and shrink, causing tension and a high risk of edge separation, which leads to poor reliability. In this embodiment, by setting the second organic layer 300, the discontinuities around the aperture zone 10b can be filled, effectively reducing the discontinuities between the film layers.

[0137] This disclosure also provides a display device, which may include the display substrate 10 described in the foregoing embodiments. The display substrate 10's opening area 10b may be processed to form an opening. The display device also includes functional devices such as a camera, sensor, HOME button, earpiece, or speaker mounted on the opening.

[0138] According to the embodiments of this application, the specific type of display device is not particularly limited, and any type of display device commonly used in the art is acceptable, such as OLED (Organic Light-Emitting Diode) displays, mobile devices such as mobile phones, wearable devices such as watches, VR devices, etc. Those skilled in the art can make appropriate selections according to the specific purpose of the display device, which will not be elaborated here.

[0139] It should be noted that, in addition to the display substrate 10 and devices such as the camera, sensor, HOME button, earpiece or speaker, the display device also includes other necessary components and parts. Taking the display as an example, these include, for instance, the casing, power cord, driver chip, etc. Those skilled in the art can make corresponding additions according to the specific usage requirements of the display device, which will not be elaborated here.

[0140] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of this utility model, and the utility model is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of this utility model, and these modifications and improvements are also considered to be within the protection scope of this utility model.

Claims

1. A display substrate having an opening area, a display area located on at least one side of the opening area, and a peripheral area surrounding the display area and the opening area; wherein, The display substrate includes: Substrate; A driving circuit layer is disposed on the substrate and is located at least in the display area; The display device is disposed on the side of the driving circuit layer away from the substrate and located in the display area; The encapsulation layer includes a first inorganic layer, a first organic layer, and a second inorganic layer sequentially disposed on the side of the display device opposite to the driving circuit layer, wherein the first inorganic layer and the second inorganic layer are located in the display area, the opening area, and the peripheral area; and the first organic layer is located in the display area and the peripheral area. The second organic layer is disposed on the side of the second inorganic layer away from the layer where the display device is located, and is located in the display area, the opening area and the peripheral area.

2. The display substrate according to claim 1, wherein, It also includes a touch component disposed between the encapsulation layer and the second organic layer, and a touch protection layer located on the side of the touch component closer to the second organic layer.

3. The display substrate according to claim 2, wherein, The touch protection layer includes a limiting groove located in the peripheral area and extending through it along its thickness direction; the edge of the second organic layer is located within the limiting groove.

4. The display substrate according to claim 3, wherein, The display substrate also includes a peripheral encapsulation dam disposed on the substrate and located in the peripheral region; The orthogonal projections of the layer containing the touch component and the touch protective layer on the substrate both cover the orthogonal projection of the peripheral encapsulation dam on the substrate. The orthographic projection of the limiting groove on the substrate is located on the side of the orthographic projection of the peripheral encapsulation dam on the substrate that is closer to the display area.

5. The display substrate according to claim 2, wherein, The display substrate also includes a peripheral encapsulation dam disposed on the substrate and located in the peripheral region; The orthographic projections of the second organic layer, the layer containing the touch component, and the touch protective layer on the substrate all cover the orthographic projection of the peripheral encapsulation dam on the substrate.

6. The display substrate according to claim 5, wherein, The display substrate also includes an auxiliary encapsulation dam disposed on the substrate and located in the peripheral region; The orthographic projection of the second organic layer on the substrate covers the orthographic projections of the layer containing the touch component and the touch protection layer on the substrate, and is located within the area defined by the orthographic projection of the auxiliary encapsulation dam on the substrate. The orthographic projection of the auxiliary encapsulation dam on the substrate is located on the side of the orthographic projection of the peripheral encapsulation dam on the substrate that is away from the display area.

7. The display substrate according to claim 6, wherein, The peripheral encapsulation dam includes multiple first substructures arranged sequentially along the direction away from the substrate; the auxiliary encapsulation dam includes multiple second substructures arranged sequentially along the direction away from the substrate, and at least a portion of the multiple second substructures is arranged in the same layer as at least a portion of the first substructure.

8. The display substrate according to claim 1, wherein, It also includes a touch component disposed on the side of the second organic layer opposite to the encapsulation layer, and a touch protective layer located on the side of the touch component opposite to the second organic layer.

9. The display substrate according to claim 8, wherein, The display substrate also includes a peripheral encapsulation dam disposed on the substrate and located in the peripheral region; The orthographic projections of the second organic layer, the layer containing the touch component, and the touch protective layer on the substrate all cover the orthographic projection of the peripheral encapsulation dam on the substrate.

10. The display substrate according to claim 9, wherein, The display substrate also includes an auxiliary encapsulation dam disposed on the substrate and located in the peripheral region; The orthographic projection of the second organic layer on the substrate is covered by the orthographic projections of the touch component layer and the touch protection layer on the substrate, and is located within the area defined by the orthographic projection of the auxiliary encapsulation dam on the substrate. The orthographic projection of the auxiliary encapsulation dam on the substrate is located on the side of the orthographic projection of the peripheral encapsulation dam on the substrate that is away from the display area.

11. The display substrate according to claim 10, wherein, The peripheral encapsulation dam includes multiple first substructures arranged sequentially along the direction away from the substrate; the auxiliary encapsulation dam includes multiple second substructures arranged sequentially along the direction away from the substrate, and at least a portion of the multiple second substructures is arranged in the same layer as at least a portion of the first substructure.

12. The display substrate according to claim 10, wherein, The auxiliary encapsulation dam is disposed on the same layer as the touch protection layer.

13. The display substrate according to any one of claims 1-12, wherein, A color filter layer is also provided on the side of the second organic layer that is opposite to the encapsulation layer.

14. The display substrate according to any one of claims 1-12, wherein, A polarizer is also provided on the side of the second organic layer away from the encapsulation layer, and an adhesive layer is provided on the side of the polarizer close to the second organic layer.

15. A display device comprising a display substrate according to any one of claims 1-14.

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