A filter chip package stability enhancement device

Abstract

The utility model relates to the microelectronic packaging technical field especially, a kind of filter chip packaging stability reinforcing device, including damping component, packaging component and lifting assembly, damping component includes base, base top is provided with accommodating groove, symmetrically equipped with fixed block in accommodating groove, fixed block one end is equipped with connecting rod, fixed rod is equipped in connecting rod middle part, connecting rod outer end is symmetrically equipped with sliding sleeve, the utility model places the accurate lifting of plate one by screw rod drive, in combination with the cooperation of sliding block and guide rod, the packaging demand of different thickness chips can be adapted, the embedding design of sealing washer and groove makes the packaging air-tightness promotion, and the sealing effect of superior traditional gold tin bonding.

Description

Technical Field

[0001] This utility model relates to the field of microelectronic packaging technology, and in particular to a device for enhancing the stability of filter chip packaging. Technical Background

[0002] With the rapid development of technologies such as 5G communication and the Internet of Things, the performance requirements of radio frequency front-end modules for filter chips are becoming increasingly stringent. As a core component of radio frequency signal processing, the packaging stability of filters directly affects the signal integrity and reliability of communication equipment. In the prior art, the device disclosed in Chinese Patent Publication No. CN201410369785.X consists of a substrate and a chip disposed on the substrate; and a reinforcing member disposed on the substrate, wherein the thermal conductivity of the reinforcing member is higher than that of the substrate.

[0003] However, although the device has low thermal resistance, its vibration resistance is insufficient; although the injection-molded isolation structure can improve stability, its heat dissipation efficiency is limited. In addition, the device's packaging device adopts a fixed structure design, which cannot adapt to the assembly requirements of chips of different specifications, and it lacks comprehensive protection measures for combined temperature and vibration environments.

[0004] Therefore, developing a stability enhancement device that combines vibration damping, efficient heat dissipation, and adaptive packaging functions has become an urgent technical problem to be solved. Utility Model Content

[0005] This utility model discloses a device for enhancing the stability of filter chip packaging, including a vibration damping component, a packaging component, and a lifting component.

[0006] As a further description of the above technical solution:

[0007] The vibration damping component includes a base with a receiving groove on the top. Fixing blocks are symmetrically arranged inside the receiving groove. A connecting rod is provided at one end of the fixing block. A fixing rod is provided in the middle of the connecting rod. A sliding sleeve is symmetrically arranged at the outer end of the connecting rod. A spring is fitted at the outer end of the connecting rod near the sliding sleeve. One end of the spring is fixedly connected to one end of the sliding sleeve, and the other end of the spring is fixedly connected to one end of the fixing rod.

[0008] As a further description of the above technical solution:

[0009] The vibration damping assembly also includes a connecting rod and a support plate. The bottom end of the connecting rod is hinged to the top end of the sliding sleeve via a pivot seat, and the top end of the connecting rod is hinged to the bottom end of the support plate via a hinge seat. The overall size of the base is larger than the size of the support plate.

[0010] As a further description of the above technical solution:

[0011] The encapsulation component is located on top of the vibration damping component. The encapsulation component includes a placement plate one, a sealing ring at the bottom of the placement plate one, the sealing ring being rectangular, sliders symmetrically located at both ends of the placement plate one, a placement plate two located below the placement plate one, the bottom of the placement plate two being fixedly connected to the top of the support plate, several placement grooves symmetrically located at the top of the placement plate two, and a groove adapted to the sealing ring being opened at the top of the placement plate two.

[0012] The encapsulation component also includes a mounting slot, which is located at the top of the placement plate. A heat-conducting plate is provided inside the mounting slot, and several heat dissipation plates are symmetrically arranged at the top of the heat-conducting plate. A shell is provided at the outer end of the heat dissipation plate, and several ventilation holes are opened at the top of the shell.

[0013] As a further description of the above technical solution:

[0014] The lifting components are symmetrically arranged at both ends of the encapsulation component. The lifting components include bracket one and bracket two. Bracket one is located at the top of the support plate, and bracket two is located on one side of bracket one. A drive motor is located at the top of bracket one, and a housing is located at the outer end of the drive motor. A lead screw is located at the output end of the drive motor. A guide rod is located inside bracket two. The lead screw and the guide rod are respectively connected to the slider for transmission.

[0015] As a further description of the above technical solution:

[0016] The inner wall of the sliding sleeve is provided with a wear-resistant coating made of ceramic material, and the inner wall of the placement groove is provided with a buffer pad made of silicone material.

[0017] The present invention has the following advantages: 1. The present invention uses an elastic support structure composed of a spring and a sliding sleeve, combined with the hinged transmission of the connecting rod, to convert vertical vibration impact into horizontal spring deformation energy, thus solving the problem of mechanical wear caused by long-term vibration.

[0018] 2. This utility model achieves precise lifting and lowering of the placement plate by means of a lead screw drive. Combined with the cooperation of the slider and the guide rod, it can adapt to the packaging requirements of chips of different thicknesses. The fitting design of the sealing ring and the groove improves the airtightness of the packaging, which is superior to the sealing effect of traditional gold-solder bonding.

[0019] 3. This utility model uses a composite heat dissipation structure composed of a heat-conducting plate and a heat dissipation plate, combined with a convection channel formed by the ventilation holes in the outer shell, to avoid the problem of contact thermal resistance fluctuation in a single heat dissipation structure under vibration.

[0020] Figure Labels

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0022] Figure 2 This is a schematic diagram of the overall structure of the vibration damping component of this utility model;

[0023] Figure 3 This is a schematic diagram of the overall structure of the packaging component of this utility model;

[0024] Figure 4 This is a schematic diagram of the overall structure of the lifting component of this utility model.

[0025] The attached figures are labeled as follows:

[0026] 1. Vibration damping assembly; 11. Base; 12. Support plate; 13. Fixing block; 14. Connecting rod; 15. Fixing rod; 16. Spring; 17. Sliding sleeve; 18. Connecting rod; 2. Encapsulation assembly; 21. Placement plate one; 22. Placement plate two; 23. Placement slot; 24. Groove; 25. Sealing ring; 26. Mounting slot; 27. Heat-conducting plate; 28. Heat dissipation plate; 29. ​​Housing; 210. Slider; 3. Lifting assembly; 31. Drive motor; 32. Lead screw; 33. Guide rod; 34. Bracket one; 35. Bracket two; 36. Housing. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The utility model will be further described in detail below with reference to the accompanying drawings.

[0029] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0030] As attached Figure 1 To be continued Figure 4 The aforementioned filter chip packaging stability enhancement device includes a vibration damping component 1, a packaging component 2, and a lifting component 3.

[0031] Example 1

[0032] Specifically, the vibration damping component 1 includes a base 11, and a receiving groove is provided on the top of the base 11. The receiving groove is used to provide installation space for other components of the vibration damping component 1 and limit their displacement range. Fixing blocks 13 are symmetrically arranged inside the receiving groove. The fixing blocks 13 are used to fix the position of the connecting rod 14 to ensure that the connecting rod 14 will not shake during operation.

[0033] The fixed block 13 has a connecting rod 14 at one end, which provides a sliding track for the sliding sleeve 17, allowing the sliding sleeve 17 to move stably along its axial direction. The connecting rod 14 has a fixed rod 15 in the middle, which supports and fixes one end of the spring 16, providing a force point for the spring 16. The outer end of the connecting rod 14 is symmetrically provided with sliding sleeves 17, which can slide on the connecting rod 14 to transmit the force generated by vibration to the spring 16. The outer end of the connecting rod 14 is fitted with a spring 16 near the end of the sliding sleeve 17. One end of the spring 16 is fixedly connected to one end of the sliding sleeve 17, and the other end of the spring 16 is fixedly connected to one end of the fixed rod 15. The spring 16 absorbs and buffers vibration energy through its own elastic deformation, reducing the vibration transmitted to the upper component.

[0034] Specifically, the vibration damping assembly 1 also includes a connecting rod 18 and a support plate 12. The bottom end of the connecting rod 18 is hinged to the top end of the sliding sleeve 17 through a pivot seat, and the top end of the connecting rod 18 is hinged to the bottom end of the support plate 12 through a hinge seat. The connecting rod 18 serves to connect the sliding sleeve 17 and the support plate 12, converting the vertical vibration of the support plate 12 into the horizontal movement of the sliding sleeve 17. The overall size of the base 11 is larger than the size of the support plate 12. This design enables the base 11 to provide more stable support for the entire device, lower the overall center of gravity of the device, and improve the anti-tipping ability.

[0035] Example 2

[0036] Based on Example 1, in order to further provide precise placement and positioning space for the filter chip, an encapsulation component is provided on the top of the vibration damping component.

[0037] Specifically, the packaging component 2 includes a placement plate 21. The bottom of the placement plate 21 is provided with a sealing ring 25. The sealing ring 25 is rectangular and cooperates with the groove 24 to enhance the sealing between the placement plate 21 and the placement plate 22, preventing dust, moisture and other substances from entering the package and affecting the chip performance.

[0038] Among them, the first placement plate 21 is symmetrically provided with sliders 210 at both ends. The sliders 210 cooperate with the lead screw 32 and the guide rod 33 to enable the first placement plate 21 to rise and fall stably under the drive of the lifting component 3. The second placement plate 22 is provided below the first placement plate 21. The bottom end of the second placement plate 22 is fixedly connected to the top end of the support plate 12. The second placement plate 22 provides a placement platform for the filter chip. At the same time, through the fixed connection with the support plate 12, the encapsulation component 2 is fixed on the vibration damping component 1.

[0039] In addition, the top of the second placement plate 22 is symmetrically provided with several placement slots 23. The placement slots 23 are used to position and place the filter chip to prevent the chip from shifting during the operation of the device. The top of the second placement plate 22 is provided with a groove 24 that matches the sealing ring 25. The groove 24 provides an installation position for the sealing ring 25 to ensure that the sealing ring 25 can fully perform its sealing function.

[0040] The packaging component 2 also includes a mounting slot 26, which is located at the top of the placement plate 21 and provides mounting space for the heat-conducting plate 27. The heat-conducting plate 27 is located inside the mounting slot 26, and it can quickly conduct the heat generated by the chip to the heat sink 28. Several heat sinks 28 are symmetrically arranged at the top of the heat-conducting plate 27, increasing the heat dissipation area and accelerating heat dissipation. A shell 29 is provided at the outer end of the heat sink 28, protecting the heat sink 28 and the internal chip from damage caused by external objects. Several ventilation holes are provided at the top of the shell 29, which facilitate airflow and improve heat dissipation efficiency.

[0041] Specifically, the lifting components 3 are symmetrically arranged at both ends of the encapsulation component 2. The lifting components 3 include a first bracket 34 and a second bracket 35. The first bracket 34 is located at the top of the support plate 12 and provides mounting support for the drive motor 31. The second bracket 35 is located on one side of the first bracket 34 and provides mounting support for the guide rod 33. The first bracket 34 has a drive motor 31 at its top, which provides power for the lifting of the placement plate 21.

[0042] In addition, the drive motor 31 has an outer casing 36 at its outer end, which protects the drive motor 31 and prevents dust, moisture and other factors from affecting the normal operation of the motor. The output end of the drive motor 31 has a lead screw 32, which rotates under the drive of the drive motor 31. Through the threaded engagement with the slider 210, it drives the placement plate 21 to rise and fall. The bracket 2 35 has a guide rod 33 inside, which guides the movement of the slider 210 and ensures that the placement plate 21 does not deviate during the rising and falling process. The lead screw 32 and the guide rod 33 are respectively connected to the slider 210 to form a transmission connection, and together they enable the placement plate 21 to rise and fall stably and accurately.

[0043] Specifically, the inner wall of the sliding sleeve 17 is provided with a wear-resistant coating made of ceramic material. The ceramic wear-resistant coating can reduce the friction and wear between the sliding sleeve 17 and the connecting rod 14, extend the service life of the sliding sleeve 17 and the connecting rod 14, and ensure the stable operation of the vibration damping assembly 1.

[0044] In addition, the inner wall of the placement slot 23 is provided with a buffer pad, which is made of silicone material. The silicone buffer pad has good elasticity and cushioning performance, which can reduce the vibration and impact on the chip during placement and operation, and protect the chip from damage.

[0045] In practical use, external vibrations are transmitted to the support plate 12, which then transmits the force to the connecting rod 18. The bottom end of the connecting rod 18 is hinged to the sliding sleeve 17, and the top end is hinged to the support plate 12. This connection method converts the vertical vibrations experienced by the support plate 12 into horizontal sliding of the sliding sleeve 17 along the connecting rod 14. When the sliding sleeve 17 moves, it compresses or stretches the spring 16 fitted on the connecting rod 14. One end of the spring 16 is fixed to the sliding sleeve 17, and the other end is fixed to the fixed rod 15 in the middle of the connecting rod 14. The elastic deformation of the spring 16 absorbs vibration energy, thereby reducing the vibration transmitted to the encapsulation assembly 2. The fixing block 13 is fixed in the receiving groove of the base 11, providing stable support for the connecting rod 14 and ensuring the structural stability of the entire vibration damping assembly 1.

[0046] The operation of the packaging component 2 begins with the placement of the chip. The filter chip is placed into the placement slot 23 of the placement plate 22. The buffer pad on the inner wall of the placement slot 23 can prevent the chip from making direct hard contact with the placement plate 22, thus protecting the chip. Subsequently, the lifting component 3 is activated, the drive motor 31 works, and the lead screw 32 at its output end begins to rotate. The sliders 210 at both ends of the placement plate 21 form a transmission connection with the lead screw 32. At the same time, the sliders 210 are also sleeved on the guide rod 33 in the bracket 2 35. The rotation of the lead screw 32 drives the sliders 210 to move up and down along the guide rod 33, thereby realizing the lifting of the placement plate 21.

[0047] When the placement plate 21 descends to the appropriate position, the sealing ring 25 at the bottom of the placement plate 21 is embedded in the groove 24 at the top of the placement plate 22 to form a sealing structure, preventing external dust, moisture and other substances from entering the package. The heat generated by the chip during operation is transferred through the placement plate 21 to the heat-conducting plate 27 in the mounting groove 26. The heat-conducting plate 27 conducts the heat to the heat sink 28 at the top. The outer shell 29 at the outer end of the heat sink 28 has ventilation holes at the top. Air flows through the ventilation holes, accelerating the dissipation of heat on the heat sink 28 and ensuring that the chip operates at a suitable temperature.

[0048] It should be noted that all electrical components mentioned in this article are connected to an external main controller and 220V AC mains power. The main controller can be a conventional known device that can be controlled by a computer or other means. The detailed description of known functions and known components is omitted in the specific implementation of this disclosure. In order to ensure the compatibility of the device, the operating methods used are consistent with the parameters of commercially available instruments.

[0049] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A filter chip packaging stability enhancement device, characterized in that, include: Vibration damping component (1), encapsulation component (2), and lifting component (3); The vibration damping component (1) includes a base (11), a receiving groove is provided on the top of the base (11), and a fixing block (13) is symmetrically provided inside the receiving groove. A connecting rod (14) is provided at one end of the fixing block (13), a fixing rod (15) is provided in the middle of the connecting rod (14), and a sliding sleeve (17) is symmetrically provided at the outer end of the connecting rod (14). A spring (16) is sleeved on the outer end of the connecting rod (14) near the sliding sleeve (17). One end of the spring (16) is fixedly connected to one end of the sliding sleeve (17), and the other end of the spring (16) is fixedly connected to one end of the fixing rod (15).

2. The filter chip packaging stability enhancement device according to claim 1, characterized in that: The vibration damping assembly (1) also includes a connecting rod (18) and a support plate (12). The bottom end of the connecting rod (18) is hinged to the top end of the sliding sleeve (17) through a rotating shaft seat. The top end of the connecting rod (18) is hinged to the bottom end of the support plate (12) through a hinge seat. The overall size of the base (11) is larger than the size of the support plate (12).

3. The filter chip packaging stability enhancement device according to claim 2, characterized in that: The encapsulation component (2) is set at the top of the vibration damping component (1). The encapsulation component (2) includes a placement plate one (21). The bottom end of the placement plate one (21) is provided with a sealing ring (25). The sealing ring (25) is rectangular. The two ends of the placement plate one (21) are symmetrically provided with sliders (210). The placement plate one (21) is provided below the placement plate one (21). The bottom end of the placement plate two (22) is fixedly connected to the top end of the support plate (12). The top end of the placement plate two (22) is symmetrically provided with several placement grooves (23). The top end of the placement plate two (22) is provided with a groove (24) that matches the sealing ring (25).

4. The filter chip packaging stability enhancement device according to claim 3, characterized in that: The encapsulation component (2) also includes a mounting slot (26), which is located at the top of the placement plate (21). The mounting slot (26) is provided with a heat-conducting plate (27), and a number of heat dissipation plates (28) are symmetrically arranged at the top of the heat-conducting plate (27). The heat dissipation plates (28) are provided with a shell (29) at the outer end, and a number of ventilation holes are opened at the top of the shell (29).

5. The filter chip packaging stability enhancement device according to claim 4, characterized in that: The lifting assembly (3) is symmetrically arranged at both ends of the encapsulation assembly (2). The lifting assembly (3) includes a first bracket (34) and a second bracket (35). The first bracket (34) is located at the top of the support plate (12), and the second bracket (35) is located on one side of the first bracket (34). The top of the first bracket (34) is provided with a drive motor (31). The outer end of the drive motor (31) is provided with a housing (36). The output end of the drive motor (31) is provided with a lead screw (32). The second bracket (35) is provided with a guide rod (33). The lead screw (32) and the guide rod (33) are respectively connected to the slider (210) for transmission.

6. The filter chip packaging stability enhancement device according to claim 5, characterized in that: The inner wall of the sliding sleeve (17) is provided with a wear-resistant coating, which is made of ceramic material.

7. The filter chip packaging stability enhancement device according to claim 6, characterized in that: The inner wall of the placement groove (23) is provided with a buffer pad, which is made of silicone material.

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