Wafer centering device

Abstract

The utility model belongs to the technical field of semiconductor processing discloses a kind of wafer centering device, including bearing component, processing platform component and centering film placing mechanism, bearing component includes the mounting seat and mounting bracket connected;Processing platform component includes base and processing table, base is located in mounting seat, processing table is rotatably connected to base, and at least three placement grooves are arranged at the circumferential interval of processing table;Centering film placing mechanism includes first drive assembly, lifting assembly and centering unit, and centering unit includes second drive assembly and jaw, second drive assembly is circumferentially spaced and arranged at the bottom of lifting assembly, and it can drive corresponding jaw to be clamped together wafer, lifting assembly is slidably connected to mounting bracket, first drive assembly is connected and drives lifting assembly to drive jaw to extend into corresponding placement groove, and second drive assembly can drive jaw to move along placement groove to place wafer below processing table.The utility model can solve the precision loss caused by cross-station transfer, and make wafer accurate positioning.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, and in particular to a wafer alignment device. Background Technology

[0002] With the rapid development of the semiconductor industry, the requirements for precision and efficiency in wafer manufacturing processes are increasing. Wafer alignment, as a key step in semiconductor processing, directly affects the precision and yield of subsequent processes such as photolithography and etching. Currently, common wafer alignment devices typically employ an independent alignment station design, where the wafer is first positioned at a separate alignment station and then transferred to the processing platform by a robotic arm.

[0003] However, since the alignment and processing functions are located at different workstations, a robotic arm must be used for wafer transfer. This not only increases the complexity of the equipment structure but also introduces additional vibration sources and positioning errors during the transfer process. When the robotic arm transfers wafers across workstations, the inherent vibration characteristics of its gripping mechanism are transmitted to the wafer, and the long-distance movement path further amplifies the motion instability. Furthermore, during a single placement, the robotic arm struggles to precisely control multiple degrees of freedom in multiple directions, making it impossible to guarantee accurate alignment between the wafer edge and the processing platform. This results in significant wafer positioning errors, making it difficult to meet the stringent high-precision requirements of semiconductor processes.

[0004] Therefore, there is an urgent need to provide a wafer alignment device to solve the above problems. Utility Model Content

[0005] The purpose of this invention is to provide a wafer alignment device to solve the accuracy loss caused by cross-station transfer, and at the same time improve the accurate positioning of the wafer from alignment to placement.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] The wafer alignment device includes:

[0008] The load-bearing component includes a mounting base and a mounting frame, wherein the mounting base is horizontally arranged and the mounting frame is vertically connected to the mounting base;

[0009] A processing platform component includes a base and a processing table. The base is disposed on the mounting seat, and the processing table is a cylinder and rotatably connected to the top surface of the base. At least three placement slots are circumferentially spaced along the edge of the top surface of the processing table.

[0010] The wafer centering and placement mechanism includes a first driving component, a lifting component, and at least three centering units. Each centering unit includes a second driving component and grippers. The second driving components are circumferentially spaced at the bottom of the lifting component and can drive the grippers to grip the wafers in a corresponding manner. The lifting component is slidably connected to the mounting bracket. The first driving component is connected to the lifting component and can drive the lifting component to move vertically so that the grippers can extend into the placement slots in a corresponding manner. The second driving component can drive the grippers to move along the placement slots in a corresponding manner to place the wafers onto the processing table.

[0011] Preferably, the lifting assembly includes a back plate, a fixed plate, a mounting plate, and at least three connecting members. The back plate is slidably connected to the mounting frame, the fixed plate is horizontally arranged and fixed to the bottom of the back plate, and the mounting plate is connected to the fixed plate through at least three circumferentially distributed connecting members. The second drive assembly is disposed on the mounting plate.

[0012] Preferably, the second drive assembly includes a cylinder, a push rod, and a connecting block. The cylinder is fixedly mounted on the mounting plate, the push rod is connected to the output end of the cylinder, the connecting block is connected to the push rod, and the gripper is connected to the push rod.

[0013] Preferably, the second drive assembly further includes a force sensor disposed between the push rod and the connecting block, configured to monitor the clamping force of the gripper on the wafer.

[0014] Preferably, the mounting plate is provided with at least three guide rails, and the connecting blocks are slidably disposed on the guide rails one by one.

[0015] Preferably, the first drive assembly includes a drive motor and a first lead screw, the first lead screw being connected to the output end of the drive motor, and the lifting assembly being screwed to the first lead screw.

[0016] Preferably, the mounting bracket is provided with a slider, and of the lifting assembly and the slider, one is provided with a groove and the other is provided with a protrusion that cooperates with the groove.

[0017] Preferably, the wafer alignment device further includes a line scanning component, which includes an adjustment bracket and a line scanning laser head. The adjustment bracket is disposed on the mounting base, and the line scanning laser head is mounted on the adjustment bracket and configured to scan the edge position of the wafer on the processing stage.

[0018] Preferably, the adjusting bracket includes a support and a support arm. The support is fixedly connected to the mounting base, and the support arm is movably connected to the support. The line scanning laser head is mounted on the support arm, and the support arm can move the line scanning laser head closer to or away from the processing table.

[0019] Preferably, the top surface of the processing table is provided with multiple adsorption holes for adsorbing and fixing the wafer.

[0020] The beneficial effects of this utility model are:

[0021] This invention provides a wafer alignment device. A stable reference frame is formed through the rigid connection between the supporting components and the processing platform components. The rotational cooperation between the processing table and the base enables adjustment of the wafer's horizontal orientation. The alignment and placement mechanism adopts a multi-jaw collaborative operation mode. The second drive component drives the jaws to move, and the lifting motion controlled by the first drive component ensures that the jaws are precisely embedded into the placement slots of the processing table. This design integrates the traditional separate alignment and placement processes into a continuous action, eliminating vibration transmission and repetitive positioning errors caused by the robot's cross-station transfer. Multiple circumferentially distributed alignment units ensure balanced force on the wafer and achieve radial positioning of the wafer through the guiding effect of the placement slots. Furthermore, the rotatable nature of the processing table further compensates for circumferential deviations. This integrated alignment and placement mechanism significantly improves the stability and accuracy of wafer positioning, creating ideal reference conditions for subsequent processes. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the wafer alignment device described in an embodiment of the present invention;

[0023] Figure 2 This is a structural schematic diagram of the load-bearing component described in an embodiment of the present utility model;

[0024] Figure 3 This is a structural schematic diagram of the processing platform component described in an embodiment of the present utility model;

[0025] Figure 4 This is a schematic diagram of the centering and loading mechanism described in an embodiment of the present invention;

[0026] Figure 5 This is a structural schematic diagram of the line scanning component described in an embodiment of the present invention.

[0027] In the picture:

[0028] 1. Load-bearing component; 11. Mounting base; 12. Mounting bracket;

[0029] 2. Machining platform components; 21. Base; 22. Machining table; 220. Placement slot; 221. Adsorption hole;

[0030] 3. Centering and loading mechanism; 31. First drive assembly; 311. Drive motor; 312. First lead screw; 32. Lifting assembly; 320. Slide rail; 321. Back plate; 322. Fixing plate; 323. Mounting plate; 3231. Guide rail; 324. Connector; 33. Centering unit; 331. Second drive assembly; 3311. Cylinder; 3312. Push rod; 3313. Connecting block; 3314. Force sensor; 332. Gripper;

[0031] 4. Line scanning component; 41. Adjustment bracket; 411. Support; 412. Support arm; 42. Line scanning laser head; 43. Third drive assembly;

[0032] 100. Wafer. Detailed Implementation

[0033] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar parts or parts having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0034] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] In the description of this utility model, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0036] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0037] like Figures 1-5As shown, this utility model provides a wafer alignment device, including a support component 1, a processing platform component 2, and an alignment and placement mechanism 3. The support component 1 includes a mounting base 11 and a mounting frame 12. The mounting base 11 is horizontally arranged, and the mounting frame 12 is vertically connected to the mounting base 11. The processing platform component 2 includes a base 21 and a processing table 22. The base 21 is disposed on the mounting base 11, and the processing table 22 is a cylinder and rotatably connected to the top surface of the base 21. At least three placement slots 220 are circumferentially spaced along the edge of the top surface of the processing table 22. The alignment and placement mechanism 3 includes a first drive component 31, a lifting component 32, and at least three alignment slots. Each centering unit 33 includes a second driving component 331 and a gripper 332. The second driving component 331 is circumferentially spaced at the bottom of the lifting component 32 and can drive the gripper 332 to grip the wafer 100 in a corresponding manner. The lifting component 32 is slidably connected to the mounting frame 12. The first driving component 31 is connected to the lifting component 32 and can drive the lifting component 32 to move vertically so that the gripper 332 can be inserted into the placement slot 220 in a corresponding manner. The second driving component 331 can drive the gripper 332 to move along the placement slot 220 in a corresponding manner to place the wafer 100 onto the processing table 22.

[0038] A stable reference frame is formed by the rigid connection between the load-bearing component 1 and the processing platform component 2. The rotational cooperation between the processing table 22 and the base 21 enables the adjustment of the horizontal orientation of the wafer 100. The centering and placement mechanism 3 adopts a multi-gripper 332 collaborative operation mode. The second drive component 331 drives the gripper 332 to move, and the lifting motion controlled by the first drive component 31 makes the gripper 332 accurately embedded in the placement slot 220 of the processing table 22. This design integrates the traditional separate centering and placement processes into a continuous action, eliminating vibration transmission and repetitive positioning errors caused by the robot's cross-station transfer. The multiple centering units 33 evenly distributed in the circumference not only ensure the balanced force on the wafer 100, but also achieve the radial positioning of the wafer 100 through the guiding effect of the placement slot 220, and the rotatable characteristics of the processing table 22 further compensate for circumferential deviations. This integrated centering and placement mechanism significantly improves the stability and accuracy of the wafer 100 positioning, creating ideal reference conditions for subsequent processes.

[0039] Specifically, such as Figure 2 As shown, the top surface of the processing stage 22 is provided with multiple adsorption holes 221 for adsorbing and fixing the wafer 100. By setting adsorption holes 221 on the top surface of the processing stage 22, the stability and accuracy of wafer 100 positioning are further optimized. When the centering and placing mechanism 3 lowers the wafer 100 to the processing stage 22, the negative pressure generated by the adsorption holes 221 makes the wafer 100 fit tightly against the surface of the processing stage 22, effectively suppressing the slight displacement caused by mechanical vibration or external disturbance.

[0040] Specifically, such as Figure 3As shown, the lifting assembly 32 includes a back plate 321, a fixed plate 322, a mounting plate 323, and at least three connecting members 324. The back plate 321 is slidably connected to the mounting frame 12. The fixed plate 322 is horizontally positioned and fixed to the bottom of the back plate 321. The mounting plate 323 is connected to the fixed plate 322 via at least three circumferentially distributed connecting members 324. The second drive assembly 331 is mounted on the mounting plate 323. The sliding of the back plate 321 along the mounting frame 323 improves the verticality and stability of the lifting motion. The rigid connection between the fixed plate 322 and the back plate 323 forms a stable load-bearing foundation, while the circumferentially distributed connecting members connect the mounting plate 323 to the fixed plate 322, ensuring the strength of the overall structure and facilitating the installation of the second drive assembly 331.

[0041] In this embodiment, the connector 324 is a bolt. The bolted connection structure allows for fine-tuning of the levelness of the mounting plate 323, ensuring that the mounting reference surfaces of the multiple second drive components 331 remain parallel.

[0042] More specifically, the second drive assembly 331 includes a cylinder 3311, a push rod 3312, and a connecting block 3313. The cylinder 3311 is fixedly mounted on the mounting plate 323, the push rod 3312 is connected to the output end of the cylinder 3311, the connecting block 3313 is connected to the push rod 3312, and the gripper 332 is connected to the push rod 3312. The cylinder 3311 is fixed to the mounting plate 323 to form a stable drive reference, avoiding the additional vibration generated by traditional swing cylinders. The direct connection structure between the push rod 3312 and the output end of the cylinder 3311 ensures that the driving force is transmitted linearly, and the transition of the connecting block 3313 facilitates the installation of the gripper 332.

[0043] More specifically, the second drive assembly 331 also includes a force sensor 3314, which is disposed between the push rod 3312 and the connecting block 3313 and is configured to monitor the clamping force of the gripper 332 on the wafer 100. When the clamping force exceeds the range, the output pressure of the cylinder 3311 can be adjusted to prevent the wafer 100 from being damaged due to excessive clamping force, and to avoid the wafer 100 from being displaced due to insufficient clamping force.

[0044] In this embodiment, cylinder 3311 is a low-friction cylinder. The cylinder 3311 employs a special low-friction sealing ring and a precision-polished cylinder barrel, significantly reducing frictional resistance during piston movement and making the movement of the gripper 332 more stable and precise. This cylinder 3311 is used in conjunction with a high-precision proportional valve, which adjusts the output air pressure to achieve precise control of the output force of cylinder 3311. Simultaneously, the system dynamically adjusts the opening of the proportional valve by real-time monitoring feedback from the force sensor 3314, forming a closed-loop force control circuit. This combination ensures that the gripper 332 applies a constant, optimal clamping force to the wafer 100, preventing excessive clamping force from damaging the wafer 100, while also avoiding wafer 100 displacement due to insufficient clamping force, significantly improving the accuracy and reliability of wafer alignment.

[0045] More specifically, the mounting plate 323 is provided with at least three guide rails 3231, and the connecting blocks 3313 are slidably mounted on the guide rails 3231 one by one. The guide rails 3231 on the mounting plate 323 further optimize the movement accuracy and stability of the gripper 332. The sliding engagement of each connecting block 3313 with the corresponding guide rail 3231 forms a radial guide structure, ensuring that the gripper 332 always maintains a linear motion trajectory under the drive of the cylinder 3311, preventing the gripper 332 from swaying during the moving and clamping process.

[0046] Specifically, the first drive assembly 31 includes a drive motor 311 and a first lead screw 312. The first lead screw 312 is connected to the output end of the drive motor 311, and the lifting assembly 32 is screwed to the first lead screw 312. The lead screw drive has a small return error, which can accurately convert the rotational motion of the drive motor 311 into the vertical linear motion of the lifting assembly 32, ensuring the positioning accuracy of the gripper 332 in the vertical direction, so that the wafer can enter the placement slot 220 smoothly and accurately, reducing the risk of edge collision caused by vertical displacement deviation.

[0047] In this embodiment, the back plate 321 of the lifting assembly 32 is screwed to the first lead screw 312.

[0048] More specifically, such as Figure 2 and Figure 4 As shown, the mounting bracket 12 is equipped with a slider 121, a lifting assembly 32, and a slider 121. One of them has a groove 320, and the other has a protrusion 1211 that cooperates with the groove 320. The sliding design of the groove 320 and the protrusion 1211 forms a guide mechanism with a large contact surface, which effectively suppresses the lateral sway and torsional vibration of the lifting assembly 32 during the lifting process.

[0049] In this embodiment, the back plate 321 of the lifting assembly 32 has two grooves 320, and the slider 121 has two corresponding protrusions 1211.

[0050] Specifically, such as Figure 5 As shown, the wafer alignment device also includes a line scanning component 4, which comprises an adjustment bracket 41 and a line scanning laser head 42. The adjustment bracket 41 is mounted on the mounting base 11, and the line scanning laser head 42 is mounted on the adjustment bracket 41 and configured to scan the edge position of the wafer 100 on the processing stage 22. The integrated design of the line scanning component 4 enables the detection and closed-loop control of the wafer 100 position. The rigid mounting of the adjustment bracket 41 provides a stable measurement reference for the line scanning laser head 42, ensuring that the scanning data is not affected by equipment vibration. The continuous scanning of the wafer 100 edge by the line scanning laser head 42 can accurately capture the wafer 100's center position and contour deviation, thereby dynamically adjusting the action parameters of the alignment and placement mechanism 3 based on real-time measurement data. This closed-loop control system achieves active compensation for the wafer 100 position, effectively eliminating accumulated errors in the mechanical transmission system.

[0051] More specifically, the adjusting bracket 41 includes a support 411 and a support arm 412. The support 411 is fixedly connected to the mounting base 11, and the support arm 412 is movably connected to the support 411. The line-scan laser head 42 is mounted on the support arm 412, which can move the line-scan laser head 42 closer to or further away from the processing table 22. The rigid connection between the support 411 and the mounting base 11 ensures the stability of the measurement reference, while the movable support arm 412 structure allows the operator to adjust the relative position of the line-scan laser head 42 and the processing table 22 according to process requirements, ensuring that the laser beam maintains the optimal detection angle with the wafer edge.

[0052] In this embodiment, the line scanning component 4 further includes a third driving assembly 43, which includes a motor and a second lead screw. A guide groove is provided on the support 411, and a protrusion is provided at the bottom of the support arm 412. The protrusion is slidably disposed within the guide groove and screwed to the second lead screw, which is connected to the output end of the motor. The driving method of the motor and the second lead screw can improve the linearity of the displacement and positioning accuracy of the support arm 412. The sliding cooperation between the guide groove and the protrusion forms a guiding structure, which not only ensures the stability of the movement trajectory of the support arm 412 but also effectively suppresses vibration interference, thereby improving the adjustment accuracy and operational stability of the line scanning laser head 42.

[0053] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer alignment device, characterized in that, include: The load-bearing component (1) includes a mounting base (11) and a mounting bracket (12), wherein the mounting base (11) is horizontally arranged and the mounting bracket (12) is vertically connected to the mounting base (11). The processing platform component (2) includes a base (21) and a processing table (22). The base (21) is disposed on the mounting base (11). The processing table (22) is a cylinder and is rotatably connected to the top surface of the base (21). At least three placement slots (220) are spaced apart circumferentially on the edge of the top surface of the processing table (22). The wafer centering and placement mechanism (3) includes a first drive assembly (31), a lifting assembly (32), and at least three centering units (33). Each centering unit (33) includes a second drive assembly (331) and a gripper (332). The second drive assembly (331) is circumferentially spaced at the bottom of the lifting assembly (32) and can drive the gripper (332) to grip the wafer (100) together. The lifting assembly (32) is slidably connected to the mounting frame (12). The first drive assembly (31) is connected to the lifting assembly (32) and can drive the lifting assembly (32) to move vertically so that the gripper (332) extends into the placement slot (220) one by one. The second drive assembly (331) can drive the gripper (332) to move along the placement slot (220) one by one to place the wafer (100) to the processing table (22).

2. The wafer alignment device according to claim 1, characterized in that, The lifting assembly (32) includes a back plate (321), a fixing plate (322), a mounting plate (323), and at least three connectors (324). The back plate (321) is slidably connected to the mounting frame (12). The fixing plate (322) is horizontally set and fixed to the bottom of the back plate (321). The mounting plate (323) is connected to the fixing plate (322) through at least three circumferentially distributed connectors (324). The second drive assembly (331) is disposed on the mounting plate (323).

3. The wafer alignment device according to claim 2, characterized in that, The second drive assembly (331) includes a cylinder (3311), a push rod (3312), and a connecting block (3313). The cylinder (3311) is fixedly mounted on the mounting plate (323). The push rod (3312) is connected to the output end of the cylinder (3311). The connecting block (3313) is connected to the push rod (3312). The gripper (332) is connected to the push rod (3312).

4. The wafer alignment device according to claim 3, characterized in that, The second drive assembly (331) further includes a force sensor (3314) disposed between the push rod (3312) and the connecting block (3313) and configured to monitor the clamping force of the gripper (332) on the wafer (100).

5. The wafer alignment device according to claim 3, characterized in that, The mounting plate (323) is provided with at least three guide rails (3231), and the connecting blocks (3313) are slidably disposed on the guide rails (3231) in a corresponding manner.

6. The wafer alignment device according to claim 1, characterized in that, The first drive assembly (31) includes a drive motor (311) and a first lead screw (312). The first lead screw (312) is connected to the output end of the drive motor (311), and the lifting assembly (32) is screwed to the first lead screw (312).

7. The wafer alignment device according to claim 5, characterized in that, The mounting bracket (12) is provided with a slider (121). The lifting assembly (32) and the slider (121) are provided with a groove (320) and a protrusion (1211) that cooperates with the groove (320).

8. The wafer alignment device according to claim 1, characterized in that, The wafer alignment device further includes a line scanning component (4), which includes an adjustment bracket (41) and a line scanning laser head (42). The adjustment bracket (41) is disposed on the mounting base (11), and the line scanning laser head (42) is mounted on the adjustment bracket (41) and configured to scan the edge position of the wafer (100) on the processing stage (22).

9. The wafer alignment device according to claim 8, characterized in that, The adjusting bracket (41) includes a support (411) and a support arm (412). The support (411) is fixedly connected to the mounting base (11), and the support arm (412) is movably connected to the support (411). The line scan laser head (42) is mounted on the support arm (412), and the support arm (412) can drive the line scan laser head (42) to move closer to or away from the processing table (22).

10. The wafer alignment apparatus according to any one of claims 1-9, characterized in that, The top surface of the processing table (22) is provided with a plurality of adsorption holes (221) for adsorbing and fixing the wafer (100).

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