A package structure mounted with a diode device

Abstract

A package structure installed with a diode device, comprising a base, a diode module, a shielding cover and a heat dissipation assembly, the base is a multi-layer composite structure, including an insulating support layer and a conductive wiring layer; the diode module includes a diode structure and a packaging shell, the diode structure is suspended in the center of the cavity through an insulating fixing piece, and the upper and lower surfaces of the packaging shell are respectively provided with elastic contact sheets; the shielding cover is composed of a metal frame and an anti-interference coating, and the metal frame covers the outer periphery of the base and the packaging shell; the heat dissipation assembly includes a heat-conducting base plate, a flow guide channel and heat dissipation fins. The base of the multi-layer composite structure realizes the integration of electrical isolation and shielding, reduces the lead inductance; the flexible connecting part absorbs thermal stress and avoids welding fatigue; the shielding cover covers the outer periphery of the base and the packaging shell, forming a closed loop, the anti-interference coating covers the key contact area to prevent leakage current interference; the turbulence generator in the flow guide channel combines the heat-conducting base plate and the multi-stage heat dissipation fins to improve the heat dissipation efficiency.

Description

Technical Field

[0001] Specifically, this utility model is a package structure in which a diode device is installed. Background Technology

[0002] Existing diode packaging structures often suffer from poor heat dissipation, unstable installation, unreliable electrical connections, difficult maintenance, and poor anti-interference capabilities during packaging. For example, traditional devices may use bolts for fixing, leading to unstable contact resistance; poorly designed heat sinks may cause localized overheating; messy wiring may cause electromagnetic interference; or replacing the diode may require disassembling the entire module, making maintenance inconvenient. To address these issues, we propose a packaging structure that houses the diode device. Utility Model Content

[0003] In view of the above, this utility model provides a package structure with a diode device installed, so as to solve the problems mentioned in the background art.

[0004] The technical solution adopted by this utility model to solve its technical problem is: a package structure for mounting a diode device, including a base, a diode module, a shielding cover, and a heat dissipation component. The base is a multi-layer composite structure, including an insulating support layer and a conductive wiring layer, wherein the conductive wiring layer is embedded inside the insulating support layer and extends to the side wall of the base to form an external terminal; the diode module includes a diode structure and a package housing, the package housing is a cavity structure with openings on both sides, the diode structure is suspended in the center of the cavity by insulating fasteners, and the upper and lower surfaces of the package housing are respectively provided with electrodes for the diode anode and cathode. The package includes a perfectly matched elastic contact piece, and the package housing is mounted on the base. The external terminals are electrically connected to the diode structure through a conductive wiring layer. The shielding cover consists of a metal frame and an anti-interference coating. The metal frame covers the outer periphery of the base and the package housing, and the anti-interference coating is applied to the inner surface of the metal frame and the joint of the elastic contact piece. The heat dissipation assembly includes a thermally conductive substrate, a flow channel, and heat dissipation fins. The thermally conductive substrate is attached to the lower surface of the base and connected to the cathode electrode of the diode module through a thermal interface material. The flow channel penetrates the thermally conductive substrate and extends into the interior of the heat dissipation fins to form a multi-level heat dissipation path.

[0005] Preferably, the contact end of the elastic contact piece is provided with a wedge-shaped guide portion, and the inclination direction of the wedge-shaped guide portion is consistent with the insertion direction of the anode electrode and cathode electrode of the diode module.

[0006] Preferably, the insulating fastener is a cross-shaped support frame, with its four ends fixed to the inner wall of the encapsulation housing through flexible connecting parts, and the bending direction of the flexible connecting parts matches the thermal expansion direction of the diode structure.

[0007] Preferably, the flow channel is provided with a turbulence generator, which is composed of staggered flow guide vanes, the tilt angle of which gradually changes along the heat dissipation path.

[0008] The diode device packaging structure of this utility model achieves integrated electrical isolation and shielding through a multi-layer composite base, and the external terminals are directly connected to the diode module through a conductive wiring layer, reducing lead inductance.

[0009] The diode structure is suspended in the center of the cavity by an insulating fastener, and thermal stress is absorbed by a flexible connection to avoid welding fatigue; the wedge-shaped guide of the elastic contact piece ensures that the electrodes are automatically aligned during insertion and removal.

[0010] The shielding cover covers the outer periphery of the base and the encapsulation housing to form a closed loop, and the anti-interference coating covers the key contact areas to prevent leakage current interference.

[0011] A turbulence generator within the flow channel enhances airflow disturbance, which, combined with a thermally conductive substrate and multi-stage heat dissipation fins, improves heat dissipation efficiency. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of this utility model.

[0013] Figure 2 yes Figure 1 A magnified view of part A in the diagram.

[0014] Figure 3 yes Figure 1 A magnified view of part B in the diagram.

[0015] Figure 4 This is a schematic diagram of the diode structure and its package housing.

[0016] Figure 5 This is an assembly diagram of the base and heat dissipation components.

[0017] Figure 6 This is a schematic diagram of a diode structure.

[0018] Figure 7 This is a schematic diagram of the heat dissipation component.

[0019] In the diagram, 1 is the base; 2 is the insulating support layer; 3 is the conductive wiring layer; 301 is the external terminal; 4 is the diode structure; 401 is the cathode electrode; 402 is the anode electrode; 5 is the package housing; 6 is the insulating fastener; 7 is the metal frame; 8 is the anti-interference coating; 9 is the thermally conductive substrate; 10 is the heat dissipation fins; 11 is the flow channel; 12 is the turbulence generator; and 13 is the elastic contact piece. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings and some embodiments.

[0021] exist Figures 1-7 Among them, a package structure for mounting a diode device includes a base 1, a diode module, a shielding cover and a heat dissipation component. The base 1 is a multi-layer composite structure, including an insulating support layer 2 and a conductive wiring layer 3. The conductive wiring layer 3 is embedded inside the insulating support layer 2 and extends to the side wall of the base 1 to form an external terminal 301. The multi-layer composite structure of the base 1 achieves integrated electrical isolation and shielding. The external terminal 301 is directly connected to the diode module through the conductive wiring layer 3, reducing lead inductance.

[0022] In this embodiment, the diode module includes a diode structure 4 and a package housing 5. The package housing 5 is a cavity structure with openings on both sides. The diode structure 4 is suspended in the center of the cavity by an insulating fixing member 6. The upper and lower surfaces of the package housing 5 are respectively provided with elastic contact pieces 13 that match the anode electrode 402 and the cathode electrode 401 of the diode. The package housing 5 is mounted on the base 1. The external terminal 301 is electrically connected to the diode structure 4 through a conductive wiring layer 3. The contact end of the elastic contact piece 13 is provided with a wedge-shaped guide portion. The inclination direction of the wedge-shaped guide portion is consistent with the insertion direction of the anode electrode 402 and the cathode electrode 401 of the diode module. The insulating fixing member 6 is a cross-shaped support frame. Its four ends are fixed to the inner wall of the package housing 5 through flexible connecting portions. The bending direction of the flexible connecting portions matches the thermal expansion direction of the diode structure 4. The diode structure 4 is suspended in the center of the cavity by the insulating fixing member 6. The flexible connecting portion absorbs thermal stress and avoids welding fatigue. The wedge-shaped guide portion of the elastic contact piece 13 ensures that the electrodes are automatically aligned during insertion and removal.

[0023] In this embodiment, the shielding cover is composed of a metal frame 7 and an anti-interference coating 8. The metal frame 7 covers the outer periphery of the base 1 and the encapsulation shell 5, and the anti-interference coating 8 is applied to the inner surface of the metal frame 7 and the joint of the elastic contact piece 13. The shielding cover covers the outer periphery of the base 1 and the encapsulation shell 5 to form a closed loop, and the anti-interference coating 8 covers the key contact area to prevent leakage current interference.

[0024] In this embodiment, the anti-interference coating 8 forms a Faraday cage effect through the continuous distribution of the metal mesh, directly reflecting high-frequency electromagnetic interference (such as switching noise); the arrangement of the mesh cells parallel to the current direction can reduce eddy current losses.

[0025] In this embodiment, the heat dissipation assembly includes a thermally conductive substrate 9, a flow channel 11, and heat dissipation fins 10. The thermally conductive substrate 9 is attached to the lower surface of the base 1 and connected to the cathode electrode 401 of the diode module through a thermal interface material. The flow channel 11 penetrates the thermally conductive substrate 9 and extends into the interior of the heat dissipation fins 10 to form a multi-stage heat dissipation path. A turbulence generator 12 is provided in the flow channel 11. The turbulence generator 12 is composed of staggered flow guides, and the tilt angle of the flow guides gradually changes along the heat dissipation path direction. The turbulence generator 12 in the flow channel 11 enhances airflow disturbance and improves heat dissipation efficiency in combination with the thermally conductive substrate 9 and the multi-stage heat dissipation fins 10.

[0026] In this embodiment, the turbulence generator 12 is composed of staggered guide vanes, which are integrated into the flow channel 11 by mechanical structure (such as welding, snap-fit ​​or embedded installation). The tilt angle of the guide vanes gradually changes along the heat dissipation path, that is, from the inlet to the outlet of the flow channel 11, the angle of the guide vanes gradually changes to form non-uniform airflow disturbance. The staggered guide vanes change the airflow direction, disrupt the laminar flow state, and enhance the heat exchange efficiency between the fluid and the surface of the heat dissipation fins 10. At the same time, the staggered guide vanes change the airflow direction, disrupt the laminar flow state, and enhance the heat exchange efficiency between the fluid and the surface of the heat dissipation fins 10.

[0027] In this embodiment, the substrate of the heat dissipation fin 10 is cast from a high thermal conductivity metal (such as copper-aluminum alloy) and has longitudinal grooves on its surface. Graphene thermal conductive strips are embedded in the grooves to enhance lateral heat diffusion. The longitudinal grooves of the heat dissipation fin 10 are aligned with the turbulence generator 12 of the flow channel 11 to ensure that the airflow directly impacts the fin surface after being disturbed by turbulence. The flexible welding layer of the substrate allows the heat dissipation fin 10 to deform synchronously with the flow channel 11 during thermal expansion, avoiding structural stress concentration.

[0028] In a specific implementation of this utility model: the encapsulation shell 5 is mounted on the base 1, and the external terminal 301 is electrically connected to the diode structure 4 through the conductive wiring layer 3. The base 1 with its multi-layer composite structure achieves integrated electrical isolation and shielding. The external terminal 301 is directly connected to the diode module through the conductive wiring layer 3, reducing lead inductance. The diode structure 4 is suspended in the center of the cavity through the insulating fixing member 6, and absorbs thermal stress through the flexible connection part to avoid welding fatigue. The shielding cover covers the outer periphery of the base 1 and the encapsulation shell 5 to form a closed loop. The anti-interference coating 8 covers the key contact area to prevent leakage current interference. The turbulence generator 12 in the flow channel 11 enhances airflow disturbance, and the heat dissipation efficiency is improved in combination with the thermally conductive substrate 9 and the multi-stage heat dissipation fins 10.

[0029] It is worth noting that in the description of this utility model, "multiple" means two or more, unless otherwise explicitly specified. In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection. The circuits described in this utility model are all commonly used circuits in the art, and other related components are all commonly used existing components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0030] It will be apparent to those skilled in the art that this utility model patent is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this utility model patent. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of this utility model patent is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be encompassed within this utility model patent. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A package structure for mounting a diode device, comprising a base, a diode module, a shielding cover, and a heat dissipation assembly, characterized in that: The base is a multi-layer composite structure, including an insulating support layer and a conductive wiring layer, wherein the conductive wiring layer is embedded inside the insulating support layer and extends to the side wall of the base to form an external terminal. The diode module includes a diode structure and a package housing. The package housing is a cavity structure with openings on both sides. The diode structure is suspended in the center of the cavity by an insulating fixing component. The upper and lower surfaces of the package housing are respectively provided with elastic contact pieces that match the anode and cathode electrodes of the diode. The package housing is mounted on the base. The external terminals are electrically connected to the diode structure through a conductive wiring layer. The shielding cover is composed of a metal frame and an anti-interference coating. The metal frame covers the outer periphery of the base and the encapsulation shell, and the anti-interference coating is applied to the inner surface of the metal frame and the joint of the elastic contact piece. The heat dissipation component includes a thermally conductive substrate, a flow channel, and heat dissipation fins. The thermally conductive substrate is attached to the lower surface of the base and connected to the cathode electrode of the diode module through a thermal interface material. The flow channel passes through the thermally conductive substrate and extends into the interior of the heat dissipation fins to form a multi-level heat dissipation path.

2. The package structure for mounting a diode device according to claim 1, characterized in that: The contact end of the elastic contact piece is provided with a wedge-shaped guide, and the inclination direction of the wedge-shaped guide is consistent with the insertion direction of the anode and cathode electrodes of the diode module.

3. The package structure for mounting a diode device according to claim 1, characterized in that: The insulating fastener is a cross-shaped support frame, with its four ends fixed to the inner wall of the encapsulation housing through flexible connecting parts. The bending direction of the flexible connecting parts matches the thermal expansion direction of the diode structure.

4. The package structure for mounting a diode device according to claim 1, characterized in that: The flow channel is equipped with a turbulence generator, which consists of staggered flow guide vanes with the tilt angle of the vanes gradually changing along the heat dissipation path.

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