High heat flux chip cooling device based on streaming ice
By utilizing the solid-liquid phase transition properties of fluid ice, the problems of low heat dissipation efficiency and temperature non-uniformity in the cooling of high heat flux density chips are solved, achieving a highly efficient and uniform cooling effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
- Filing Date
- 2025-06-16
- Publication Date
- 2026-07-14
AI Technical Summary
Existing high heat flux density chip cooling technologies suffer from low heat dissipation efficiency and poor temperature uniformity. In particular, when using fluid sensible heat absorption and fluid gas-liquid phase change heat absorption, traditional fluid cooling media are unable to effectively meet the heat dissipation requirements of high heat flux density chips, resulting in rapid temperature rise and large non-uniformity of the chip.
A cooling device based on fluid ice is adopted, including a heat extraction unit, a fluid ice production unit and a driving unit. It utilizes the solid-liquid phase change characteristics of fluid ice when absorbing heat, and achieves efficient heat exchange through the support zone and the medium zone. The temperature of the fluid ice remains unchanged during the phase change, thus achieving efficient cooling.
Flowing ice absorbs a large amount of heat during the solid-liquid phase transition and maintains a stable temperature, effectively overcoming the temperature rise problem caused by traditional fluid cooling media and achieving efficient and uniform cooling of high heat flux density chips.
Smart Images
Figure CN224503935U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip heat dissipation technology, and in particular to a high heat flux density chip cooling device based on flowing ice. Background Technology
[0002] Existing high heat flux density chip cooling technologies mainly fall into two categories: fluid sensible heat absorption and fluid gas-liquid phase change absorption.
[0003] For fluids that absorb and dissipate heat, water, thermal oil, ethylene glycol, and aqueous ethylene glycol solutions are commonly used cooling media. These fluids primarily remove heat generated by the chip through sensible heat absorption. However, this method has several drawbacks. First, due to the lack of a phase change process, the temperature of these fluids will rise significantly when absorbing the same amount of heat. When the heat flux density generated by the chip is too high, ordinary sensible heat-absorbing fluids cannot quickly and effectively remove the heat, causing the chip temperature to rise rapidly. Second, the excessive temperature rise caused by sensible heat absorption can further lead to significant temperature inhomogeneity within the chip. The varying contact conditions between different parts of the chip and the cooling fluid, coupled with the rapid temperature rise of the fluid, result in different heat dissipation effects across different areas of the chip, leading to uneven temperature distribution. This temperature inhomogeneity not only reduces the overall performance of the chip but can also cause localized overheating, severely impacting the chip's reliability and stability.
[0004] For fluid gas-liquid phase change endothermic processes, water, fluorinated liquids, refrigerants, ethanol, and other fluids are common gas-liquid phase change cooling media. These fluids mainly remove the heat generated by the chip through the latent heat of gas-liquid phase change. Water dominates traditional phase change systems due to its high latent heat of vaporization, wide liquid phase temperature range, and low cost. Fluorinated liquids have unique advantages in immersion direct cooling scenarios due to their excellent dielectric properties and chemical inertness. Refrigerants can achieve precise control of boiling point by adjusting the composition, making them suitable for different temperature ranges. Ethanol has attracted attention due to its low toxicity and good wettability with microstructures. The main technical bottlenecks of this technology are reflected in two aspects: two-phase flow dynamics and heat transfer limits. (1) Flow instability is caused by the flow pattern transformation caused by the density difference between the gas and liquid phases, including complex flow states such as intermittent flow and slug flow. The pressure drop oscillation amplitude of the two-phase flow in the microchannel can be several times the steady-state value. This dynamic fluctuation not only leads to drastic changes in local thermal resistance but also induces the accumulation of mechanical stress, accelerating the failure of the system structure. (2) The critical heat flux density restricts the heat load capacity of the system. When the surface heat flux density exceeds the critical heat flux density threshold, it will trigger film boiling, resulting in a sharp drop in the heat transfer coefficient.
[0005] In summary, chip cooling technologies based on fluid sensible and endothermic heat transfer face severe challenges in addressing the heat dissipation issues of chips with high heat flux densities, such as excessive temperature rise and large temperature non-uniformity; while chip cooling technologies based on fluid gas-liquid phase change endothermic heat transfer face problems of unstable flow and dry burning. Utility Model Content
[0006] This invention provides a high heat flux density chip cooling device based on fluid ice, which solves the defects of low heat dissipation efficiency and poor temperature uniformity in the existing chip cooling technology based on fluid sensible heat absorption and fluid gas-liquid phase change heat absorption.
[0007] This invention provides a high heat flux density chip cooling device based on fluidized ice, comprising:
[0008] The heat extraction unit has a support area and a medium area that can exchange heat with each other. The support area is used to support the chip to be cooled, and the medium area is used to introduce flowing ice.
[0009] A fluid ice production unit, connected to the medium region, is used to receive molten fluid ice and prepare it into liquid fluid ice;
[0010] A drive unit, connected between the medium region and the fluid ice production unit, is used to drive the directional movement of the fluid ice.
[0011] According to the high heat flux density chip cooling device based on fluid ice provided by this utility model, the heat extraction unit includes:
[0012] The small channel heat sink has a support surface and multiple microchannels; the support surface serves as the support area for supporting the chip to be cooled; the microchannels are connected to the fluid ice production unit and the driving unit, and serve as the medium area for introducing fluid ice.
[0013] According to the high heat flux density chip cooling device based on fluid ice provided by this utility model, the diameter of the microchannel ranges from 0.05 to 5 mm.
[0014] According to the high heat flux density chip cooling device based on fluid ice provided by this utility model, the heat extraction unit includes:
[0015] The jet heat sink is connected to the fluid ice production unit and serves as the medium zone for introducing fluid ice.
[0016] The recirculation unit is located in the jet direction of the jet heat sink. The chip to be cooled is installed on the side of the recirculation unit away from the jet heat sink. The recirculation unit is connected to the drive unit and serves as the support area to support the chip to be cooled and to receive the melted liquid ice back to the drive unit.
[0017] According to the high heat flux density chip cooling device based on fluid ice provided by this utility model, the jet heat sink has multiple nozzles, and the nozzles are arranged facing the return unit.
[0018] According to the high heat flux density chip cooling device based on fluid ice provided by this utility model, the reflux unit includes:
[0019] A water receiving tray is located in the jet direction of the jet heat sink and has a connecting hole that communicates with the fluid ice making unit.
[0020] According to the high heat flux density chip cooling device based on fluidized ice provided by this utility model, the fluidized ice production unit includes one or more combinations of fluidized bed, vacuum unit, subcooling unit and scraping unit.
[0021] According to the high heat flux density chip cooling device based on fluid ice provided by this utility model, the driving unit includes any one of a mechanical pump, a magnetic drive pump, a plunger pump, and a peristaltic pump.
[0022] The high heat flux density chip cooling device based on fluidized ice provided by this utility model further includes:
[0023] The pipeline connects the heat extraction unit, the fluid ice making unit, and the drive unit in sequence to form a closed loop.
[0024] According to the high heat flux density chip cooling device based on fluidized ice provided by this utility model, the carrier liquid of the fluidized ice is pure water or a binary solution composed of pure water and sodium chloride, ethanol, ethylene glycol or propylene glycol.
[0025] This invention provides a high heat flux density chip cooling device based on fluidized ice, comprising: a heat extraction unit, a fluidized ice production unit, and a driving unit. The heat extraction unit has a support area and a medium area capable of exchanging heat with each other. The support area supports the chip to be cooled, and the medium area is used to introduce fluidized ice. The fluidized ice production unit is connected to the medium area and is used to receive molten fluidized ice and prepare it into liquid fluidized ice. The driving unit is connected between the medium area and the fluidized ice production unit and is used to drive the fluidized ice to move in a directional manner. This invention provides a high heat flux density chip cooling device based on fluidized ice, which utilizes the solid-liquid phase change that occurs during the absorption of heat by fluidized ice, absorbing a large amount of heat while maintaining a constant temperature during the phase change. This allows the fluidized ice to carry away more heat with a lower temperature change, effectively overcoming the temperature rise problem caused by the sensible heat absorption of traditional fluids. By leveraging the fluidity, large latent heat of solid-liquid phase change, and good stability of fluidized ice, efficient cooling of high heat flux density chips is achieved. Attached Figure Description
[0026] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0027] Figure 1 This is a schematic diagram of the structure of a high heat flux density chip cooling device based on fluid ice provided in one embodiment of the present invention.
[0028] Figure 2 This is a schematic diagram of the structure of the heat extraction unit provided in one embodiment of the present invention.
[0029] Figure 3 This is a schematic diagram of the structure of the heat extraction unit provided in one embodiment of the present invention.
[0030] Figure label:
[0031] 1. Heat extraction unit; 2. Drive unit; 3. Flow ice production unit; 4. Pipeline; 5. Chip to be cooled; 6. Flow ice. Detailed Implementation
[0032] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0033] In the description of this embodiment, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this embodiment and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this embodiment.
[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this embodiment, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0035] In this embodiment, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," "link," and "fix" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.
[0036] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0037] The following is combined Figures 1-3 This invention describes a high heat flux density chip cooling device based on fluidized ice. The device includes a heat extraction unit 1, a fluidized ice production unit 3, and a driving unit 2.
[0038] The heat extraction unit 1 has a support area and a medium area that can exchange heat with each other. The support area is used to support the chip 5 to be cooled, and the medium area is used to introduce fluid ice 6. The fluid ice making unit 3 is connected to the medium area and is used to receive the melted fluid ice 6 and prepare it into liquid fluid ice 6. The driving unit 2 is connected between the medium area and the fluid ice making unit 3 and is used to drive the fluid ice 6 to move in a directional manner.
[0039] Flow ice 6 is a two-phase homogeneous mixture composed of fine ice crystals and a carrier liquid. It is also known as ice slurry, liquid ice, pumped ice, binary ice, etc. The diameter of the ice crystal particles is generally between tens of micrometers and hundreds of micrometers. Under a microscope, they appear spherical. The carrier liquid is pure fresh water or a binary solution composed of water and a freezing point depressant, such as sodium chloride, ethanol, ethylene glycol, and propylene glycol.
[0040] Unlike traditional cooling fluids, fluidized ice 6 possesses unique solid-liquid phase change characteristics. During heat absorption, fluidized ice 6 undergoes a solid-liquid phase change, utilizing this process to absorb a significant amount of heat while maintaining a constant temperature throughout. This characteristic allows fluidized ice 6 to remove more heat with relatively low temperature changes, effectively overcoming the temperature rise problem caused by the sensible heat absorption of traditional fluids.
[0041] The heat extraction unit 1 has a support area and a medium area, which can exchange heat with each other. The support area is used to place the chip 5 to be cooled. The fluid ice 6 passes through the medium area to cool the chip 5. During the flow of the fluid ice 6 in the medium area, it conducts efficient heat exchange with the chip, absorbs heat and partially or completely turns into liquid, and flows back to the fluid ice production unit 3.
[0042] The support area of the heat collection unit 1 is in contact with the chip. When the fluid ice 6 flows through the medium area of the heat collection unit 1, it absorbs the heat from the chip. The heat collection unit 1 can be a microchannel cooling heat sink, a millimeter channel cooling heat sink, or a jet cooling heat sink, etc.
[0043] The fluidized ice production unit 3 receives the melted fluidized ice 6 and cools it to re-prepare it as fluidized ice 6. The fluidized ice production unit 3 can employ various fluidized ice 6 preparation technologies, such as fluidized bed method, vacuum method, subcooling method, scraping method, direct contact method, and one or more combinations of mixed-assisted ice-making methods. The specific preparation methods are described below:
[0044] Fluidized bed method: A fluidized bed structure is constructed inside the fluidized ice production unit 3. Liquid water enters from the bottom and, under the action of an upward airflow, the water forms a fluidized state within the fluidization zone. Refrigeration components are arranged around the fluidization zone, and the fluidized water is gradually cooled to form fluidized ice 6. The fluidized ice 6 prepared by this method has uniform particles, good fluidity, and can be quickly replenished into the circulation system.
[0045] Vacuum method: The fluid ice production unit 3 is designed as a sealed vacuum chamber. After liquid water is introduced into the chamber, the boiling point of the water is lowered by reducing the pressure inside the chamber, causing flash evaporation. Part of the water vaporizes and carries away the heat, while the remaining water is rapidly cooled to form fluid ice 6. This method has a fast preparation speed and can effectively utilize the latent heat of phase change of water, but it requires a high degree of sealing of the device.
[0046] Supercooling method: Liquid water is passed through a specially designed cooling channel, where it is rapidly cooled to below its freezing point without freezing, forming supercooled water. When the supercooled water flows out of the channel and enters a specific disturbance region, it is triggered by the disturbance to crystallize, instantly forming fluid ice 6. This method requires precise control of the cooling rate and disturbance, and can produce high-quality fluid ice 6.
[0047] Scraping method: A rotating cooling drum is installed inside the device. Liquid water is sprayed onto the surface of the drum, and the drum cools the water, causing it to freeze into ice. The ice layer is then scraped off with a scraper, forming fine, fluid ice particles. The fluid ice particles prepared by the scraping method have a regular shape, facilitating flow in the circulation system.
[0048] Direct contact method: This method uses a refrigerant that is immiscible with water and has a low boiling point, bringing the refrigerant directly into contact with liquid water. The refrigerant evaporates, absorbing heat from the water and cooling it to form liquid ice. This method has high heat exchange efficiency, but requires the selection of a suitable refrigerant to avoid environmental impact.
[0049] Hybrid assisted ice-making method: This method combines the advantages of multiple methods mentioned above. For example, water is first subcooled using a subcooling method, and then the airflow disturbance in a fluidized bed process is used to promote crystallization, forming fluidized ice 6. This hybrid method can integrate the advantages of multiple methods and improve the preparation efficiency and quality of fluidized ice 6.
[0050] The drive unit 2 provides the power for the directional movement of the fluid ice 6, for example, a pump. Furthermore, the heat extraction unit 1, the fluid ice production unit 3, and the drive unit 2 can be connected via the pipe 4 to form a circulating cooling loop for the fluid ice 6, achieving efficient and stable cooling of the high heat flux density chip.
[0051] This invention provides a high heat flux density chip cooling device based on fluidized ice, comprising: a heat extraction unit 1, a fluidized ice preparation unit 3, and a driving unit 2. The heat extraction unit 1 has a support area and a medium area capable of exchanging heat with each other. The support area supports the chip 5 to be cooled, and the medium area is used to introduce fluidized ice 6. The fluidized ice preparation unit 3 is connected to the medium area and is used to receive the melted fluidized ice 6 and prepare it into liquid fluidized ice 6. The driving unit 2 is connected between the medium area and the fluidized ice preparation unit 3 and is used to drive the fluidized ice 6 to move in a directional manner. This invention provides a high heat flux density chip cooling device based on fluidized ice, which utilizes the solid-liquid phase change that occurs during the heat absorption process of fluidized ice 6, absorbing a large amount of heat while maintaining a constant temperature during the phase change. This allows the fluidized ice 6 to remove more heat with a lower temperature change, effectively overcoming the temperature rise problem caused by the sensible heat absorption of traditional fluids. By leveraging the advantages of fluidized ice 6 such as its fluidity, large latent heat of solid-liquid phase change, and good stability, efficient cooling of high heat flux density chips is achieved.
[0052] In one embodiment of this utility model, the heat extraction unit 1 includes: a small-channel heat sink having a support surface and multiple microchannels; the support surface serves as a support area for supporting the chip 5 to be cooled; the microchannels are connected to the fluid ice production unit 3 and the driving unit 2, serving as a medium area for introducing fluid ice 6. Figure 2In the structure shown, the heat extraction unit 1 uses a microchannel heat sink to cool the chip. One end of the microchannel is connected to the fluid ice production unit 3, and the other end is connected to the driving unit 2. The fluid ice 6 exchanges heat with the chip through the microchannel from the fluid ice production unit 3. It can be understood that the support surface of the microchannel heat sink is the top support structure of the microchannel, and the chip can be placed on top of the microchannel; alternatively, the structure of the microchannel can be processed, for example, by processing the microchannel into a ring shape, and the chip can be placed inside the annular microchannel for heat exchange.
[0053] In one embodiment of this invention, the diameter of the microchannel ranges from 0.05 to 5 mm. In this embodiment, the width and depth of the microchannel are carefully optimized and determined based on the heat flux density of the chip and the flow characteristics of the fluidized ice 6. Preferably, for high heat flux density chips, the width of the microchannel may be between 0.05 and 5 mm. Such a micro / small channel structure can significantly increase the contact area between the fluidized ice 6 and the chip, thereby greatly improving heat exchange efficiency.
[0054] In one embodiment of this utility model, the heat extraction unit 1 includes a jet heat sink and a reflux unit. The jet heat sink is connected to the fluid ice production unit 3 and serves as a medium for introducing fluid ice 6. The reflux unit is located in the jet direction of the jet heat sink. The chip 5 to be cooled is mounted on the side of the reflux unit opposite to the jet heat sink. The reflux unit is connected to the drive unit 2 and serves as a support area for supporting the chip 5 to be cooled and receiving the melted fluid ice 6 flowing back to the drive unit 2. Figure 3 In the structure shown, the heat extraction unit 1 adopts jet cooling. The jet heat sink is located at the top of the reflux unit and the fluid ice production unit 3. Fluid ice 6 is ejected from above the reflux unit to the reflux unit. The chip is installed on the back of the reflux unit. The fluid ice 6 exchanges heat with the chip through the reflux unit. After heat exchange, the fluid ice 6 flows back to the fluid ice production unit 3.
[0055] In the above embodiment, the jet heat sink has multiple nozzles, which are positioned facing the return unit. The return unit includes a water receiving tray disposed in the jet direction of the jet heat sink and having a connecting hole communicating with the fluid ice making unit 3. Preferably, a planar or microporous structure can be provided below the nozzles to achieve heat exchange between the fluid ice 6 and the chip. The water receiving tray is located below the nozzles and is used to recover the fluid ice 6 after heat exchange and return it to the fluid ice making unit 3 for recycling.
[0056] In one embodiment of this utility model, the fluidized ice production unit 3 includes one or more combinations of a fluidized bed, a vacuum unit, a subcooling unit, and a scraping unit. It is understood that, according to the fluidized ice 6 preparation method provided above, the fluidized bed prepares fluidized ice 6 using a fluidized bed method, the vacuum unit prepares fluidized ice 6 using a vacuum method, the subcooling unit prepares fluidized ice 6 using a subcooling method, the scraping unit prepares fluidized ice 6 using a scraping method, or a combination of the above-described device structures is used to prepare fluidized ice 6 using a mixed-assisted ice-making method.
[0057] In one embodiment of the present invention, the drive unit 2 includes any one of a mechanical pump, a magnetic drive pump, a plunger pump, and a peristaltic pump.
[0058] In one embodiment of the present invention, the high heat flux density chip cooling device based on fluid ice further includes: a pipe 4, which connects the heat extraction unit 1, the fluid ice production unit 3 and the driving unit 2 in sequence to form a closed loop, thereby enabling the cyclic use of fluid ice 6 and continuously cooling the chip.
[0059] In one embodiment of this invention, the carrier liquid of the fluidized ice 6 is pure water or a binary solution composed of pure water and sodium chloride, ethanol, ethylene glycol or propylene glycol.
[0060] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.
[0061] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.
Claims
1. A high heat flux density chip cooling device based on fluidized ice, characterized in that, include: The heat extraction unit (1) has a support area and a medium area that can exchange heat with each other. The support area is used to support the chip to be cooled (5), and the medium area is used to introduce fluid ice (6). The fluid ice production unit (3) is connected to the medium region and is used to receive the melted fluid ice (6) and prepare it into liquid fluid ice (6). The driving unit (2) is connected between the medium zone and the fluid ice production unit (3) and is used to drive the fluid ice (6) to move in a specific direction.
2. The high heat flux density chip cooling device based on flowing ice according to claim 1, characterized in that, The heat extraction unit (1) includes: The small channel heat sink has a support surface and multiple micro channels; the support surface serves as the support area for supporting the chip to be cooled (5); the micro channels are connected to the fluid ice production unit (3) and the driving unit (2) and serve as the medium area for introducing fluid ice (6).
3. The high heat flux density chip cooling device based on flowing ice according to claim 2, characterized in that, The diameter of the microchannel ranges from 0.05 to 5 millimeters.
4. The high heat flux density chip cooling device based on flowing ice according to claim 1, characterized in that, The heat extraction unit (1) includes: The jet heat sink is connected to the fluid ice production unit (3) and serves as the medium zone for introducing fluid ice (6). The reflux unit is located in the jet direction of the jet heat sink. The chip to be cooled (5) is installed on the side of the reflux unit away from the jet heat sink. The reflux unit is connected to the drive unit (2) and serves as the support area to support the chip to be cooled (5) and receive the melted fluid ice (6) back to the drive unit (2).
5. The high heat flux density chip cooling device based on flowing ice according to claim 4, characterized in that, The jet heat sink has multiple nozzles, and the nozzles are arranged toward the recirculation unit.
6. The high heat flux density chip cooling device based on flowing ice according to claim 4, characterized in that, The recirculation unit includes: A water receiving tray is located in the jet direction of the jet heat sink and has a connecting hole that communicates with the fluid ice making unit (3).
7. The high heat flux density chip cooling device based on flowing ice according to claim 1, characterized in that, The fluidized ice production unit (3) includes one or more combinations of fluidized bed, vacuum unit, subcooling unit and scraping unit.
8. The high heat flux density chip cooling device based on flowing ice according to any one of claims 1 to 7, characterized in that, The drive unit (2) includes any one of a mechanical pump, a magnetic drive pump, a plunger pump, and a peristaltic pump.
9. The high heat flux density chip cooling device based on flowing ice according to any one of claims 1 to 7, characterized in that, Also includes: Pipeline (4) connects the heat extraction unit (1), the fluid ice making unit (3) and the driving unit (2) in sequence to form a closed loop.
10. The high heat flux density chip cooling device based on flowing ice according to any one of claims 1 to 7, characterized in that, The carrier liquid of the fluid ice (6) is pure water or a binary solution composed of pure water and sodium chloride, ethanol, ethylene glycol or propylene glycol.