A packaging substrate
By setting notches in the connecting metal layer of the packaging substrate, the problem of edge warping during the cutting process is solved, the processing quality and reliability of the packaging substrate are improved, and the flatness and dimensional accuracy of the packaging substrate are ensured.
CN224503940UActive Publication Date: 2026-07-14HONGLI ZHIHUI GRP CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HONGLI ZHIHUI GRP CO LTD
- Filing Date
- 2025-07-04
- Publication Date
- 2026-07-14
AI Technical Summary
Technical Problem
The packaging substrate is prone to warping during the cutting process, which affects the appearance and dimensional accuracy, and reduces the product qualification rate and reliability.
Method used
A notch is provided on the second extension of the connecting metal layer of the packaging substrate so that it does not contact the edge, thereby reducing the contact area between the blade and the metal.
Benefits of technology
This effectively avoids abnormal warping of the packaging substrate after cutting, improves processing quality and reliability, ensures a flat surface of the packaging substrate, improves dimensional accuracy, and provides a guarantee for subsequent packaging and testing.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224503940U_ABST
Abstract
The application provides a packaging substrate, comprising a base layer, at least two first pads, at least two through holes and a connecting metal layer, wherein the first pads are located on the front surface of the base layer, the connecting metal layer is located at least at the edge of the front surface of the base layer and extends out of the first extension and the second extension of the front surface of the base layer, the first extension contacts the corresponding first pad, the second extension extends to the other edge of the base layer adjacent to the edge where the connecting metal layer is located, and the second extension of at least one connecting metal layer has a notch so that at least part of the second extension is not in contact with the edge where the connecting metal layer is located. The application sets the notch on the second extension, so that at least part of the second extension is not in contact with the edge where the connecting metal layer is located, thereby reducing the contact area between the blade and the metal when the packaging substrate is cut, effectively avoiding the abnormal phenomenon that the packaging substrate is warped after cutting, and improving the processing quality and reliability of the packaging substrate.
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