A ceramic package base

Abstract

The application discloses a ceramic packaging base which is composed of a flat insulating substrate, a first annular frame-shaped substrate and a second annular frame-shaped substrate arranged above and below the insulating substrate respectively, upper pads and lower pads arranged on the upper surface and the lower surface of the insulating substrate respectively, a ring surface metal layer arranged on the upper surface of the first annular frame-shaped substrate, the upper pads being electrically insulated from the ring surface metal layer, part of the lower pads being electrically connected with the ring surface metal layer, the upper pads being electrically insulated from the lower pads, and a plating connection wiring being further arranged and connected with part of the lower pads, when a plurality of ceramic packaging bases are integrated in a ceramic packaging base combination board, the lower pads are electrically connected with the upper pads of adjacent base units, the plating connection wirings of the adjacent base units are connected, and thus a plating path arranged in sequence and insulated from each other is formed on the combination board, the insulating test can be directly conducted on two adjacent base units, and the ceramic packaging base does not need to be detected one by one, so that the detection efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of electronic packaging technology, and in particular to a ceramic packaging substrate. Background Technology

[0002] Ceramic packaging substrates are generally constructed by stacking multiple insulating substrates, with conductive wiring on the insulating substrates to enable the conduction of signals between electronic components and the outside world. The manufacturing process of ceramic packaging substrates includes: processing the required structure and printing conductive patterns on a larger ceramic green body, followed by multi-layer lamination, slitting and pressing, sintering and electroplating, ultimately forming a ceramic packaging substrate assembly board containing multiple substrate units. After the assembly board is prepared, it is then cut into multiple independent ceramic packaging substrates through a slitting process.

[0003] However, in existing ceramic package substrate assembly board designs, not only are adjacent substrate units electrically connected via lower and upper pads, but the upper and lower pads of the same substrate unit are also electrically connected. This connection method makes it impossible to perform effective insulation testing on each substrate unit during the assembly board stage. Insulation testing can only be performed after the product has been cut and formed into individual package substrates, increasing labor costs and overall manufacturing costs, and significantly reducing product testing efficiency. Utility Model Content

[0004] This application aims to address one of the technical problems existing in the prior art. To this end, this application provides a ceramic packaging substrate that solves the problem that currently, insulation testing can only be performed on each of the slit ceramic packaging substrates individually, which is time-consuming, labor-intensive, and inefficient.

[0005] To achieve the above objectives, the technical solution adopted in this application is: a ceramic packaging base, wherein the ceramic packaging base is obtained by dividing a ceramic packaging base assembly plate into individual base units, and the ceramic packaging base includes: a first annular frame-shaped substrate, a second annular frame-shaped substrate, and an insulating substrate; the first annular frame-shaped substrate is disposed above the insulating substrate and located at the top of the ceramic packaging base; the insulating substrate is located in the middle of the ceramic packaging base; and the second annular frame-shaped substrate is disposed below the insulating substrate and located at the bottom of the ceramic packaging base.

[0006] The insulating substrate has a flat plate structure. The lower surface of the first annular frame substrate and the upper surface of the insulating substrate cooperate to form an upper cavity. The upper surface of the second annular frame substrate and the lower surface of the insulating substrate cooperate to form a lower cavity.

[0007] It also includes a toroidal metal layer, which is disposed on the upper surface of the first annular frame substrate in a manner that surrounds the upper cavity;

[0008] The upper cavity is provided with an upper solder pad, which is located on the upper surface of the insulating substrate and is electrically insulated from the annular metal layer.

[0009] The lower cavity is provided with a lower pad, which is located on the lower surface of the insulating substrate and is electrically insulated from the upper pad. The lower pad includes a first lower pad and a second lower pad that are spaced apart. The first lower pad is electrically connected to the annular metal layer.

[0010] The lower surface of the insulating substrate is provided with electroplating connection wiring. The first lower pad and the second lower pad are respectively connected to a portion of the electroplating connection wiring, and the first lower pad and the second lower pad are electrically insulated from each other.

[0011] Preferably, the electroplating connection wiring includes a first electroplating connection wiring, a second electroplating connection wiring, and a third electroplating connection wiring arranged at intervals. The first electroplating connection wiring is electrically connected to the first lower pad, the third electroplating connection wiring is electrically connected to the second lower pad, and the second electroplating connection wiring is electrically insulated from the first lower pad and the second lower pad.

[0012] Preferably, the lower surface of the second annular frame substrate is provided with external terminals, which are electrically connected to the upper pad and the lower pad respectively.

[0013] Preferably, the external terminals include a first external terminal, a second external terminal, a third external terminal, and a fourth external terminal disposed on the lower surface of the second annular frame substrate, and the upper pads include a first upper pad and a second upper pad disposed at intervals.

[0014] The first external terminal is electrically connected to the first lower pad via a wiring unit and / or a through-hole conductor unit; the second external terminal is electrically connected to the first upper pad via a wiring unit and / or a through-hole conductor unit; the third external terminal is electrically connected to the second lower pad via a wiring unit and / or a through-hole conductor unit; and the fourth external terminal is electrically connected to the second upper pad via a wiring unit and / or a through-hole conductor unit.

[0015] Preferably, the first lower pad is electrically connected to the toroidal metal layer via a wiring unit and / or a via conductor unit.

[0016] Preferably, the wiring unit includes a first connecting wire, a second connecting wire, a third connecting wire and a fourth connecting wire disposed on the lower surface of the insulating substrate, and a fifth connecting wire disposed on the upper surface of the insulating substrate.

[0017] Preferably, the through-hole conductor unit includes a fourth through-hole conductor that penetrates the first annular frame substrate;

[0018] The first corner hole conductor, the second corner hole conductor, the third corner hole conductor, and the fourth corner hole conductor pass through the second annular frame substrate;

[0019] A first through-hole conductor, a second through-hole conductor, and a third through-hole conductor that penetrate the insulating substrate.

[0020] Preferably, the first external terminal is electrically connected to the first lower pad in sequence through a first corner hole conductor and a first connecting wire;

[0021] The second external terminal is electrically connected to the first upper pad in sequence through the second corner hole conductor, the second connection wiring and the second through hole conductor;

[0022] The third external terminal is electrically connected to the second lower pad in sequence through the third corner hole conductor and the third connecting wire;

[0023] The fourth external terminal is electrically connected to the second upper pad in sequence through the fourth corner hole conductor, the fourth connection wiring, the third through hole conductor, and the fifth connection wiring.

[0024] Preferably, the annular metal layer is electrically connected to the first external terminal in sequence through a fourth through-hole conductor, a first through-hole conductor, a first connecting wire, and a first corner hole conductor.

[0025] Preferably, it also includes a metal ring, which is disposed on the metal layer of the ring surface.

[0026] The beneficial effects of this application are:

[0027] The ceramic packaging substrate of this application comprises a flat insulating substrate and a first annular frame substrate and a second annular frame substrate respectively disposed above and below it. Upper and lower pads are respectively disposed on the upper and lower surfaces of the insulating substrate. A ring-shaped metal layer is disposed on the upper surface of the first annular frame substrate. The upper pads are electrically insulated from the ring-shaped metal layer, and a portion of the lower pads are electrically connected to the ring-shaped metal layer. The upper and lower pads are electrically insulated from each other. Electroplating connection wiring is also provided, and the lower pads are electrically connected to a portion of the electroplating connection wiring. When multiple ceramic packaging substrates... When the bases are integrated in an array on a ceramic package base assembly board, the lower pads are electrically connected to the upper pads of the adjacent package bases, and the plating wiring of the adjacent package bases is electrically connected to each other, thereby forming sequentially arranged and mutually insulated plating paths on the assembly board. This allows each plating path to connect multiple package bases in series. When performing insulation testing, insulation testing can be performed directly on two adjacent package base elements, i.e., two adjacent plating paths, without having to test each ceramic package base after the assembly board is cut, thus improving testing efficiency and reducing production costs. Attached Figure Description

[0028] Figure 1 This is a front view of a ceramic encapsulation base according to this application.

[0029] Figure 2 This is a cross-sectional view of a ceramic packaging base according to this application.

[0030] Figure 3 This is a top view of a ceramic packaging base according to this application.

[0031] Figure 4 This is a bottom view of a ceramic encapsulation base according to this application.

[0032] Figure 5 This is a structural diagram of the upper surface of the insulating substrate.

[0033] Figure 6 This is a structural diagram of the lower surface of the insulating substrate.

[0034] Figure 7 This is a structural diagram of the upper surface of the first annular frame substrate.

[0035] Figure 8 This is a structural diagram of the lower surface of the insulating substrate in a ceramic packaging base assembly.

[0036] In the figure: 1. First annular frame substrate; 2. Second annular frame substrate; 3. Insulating substrate; 4. Upper cavity; 5. Lower cavity; 6. Annular metal layer; 7. First lower pad; 8. Second lower pad; 9. First electroplating connection wiring; 10. Second electroplating connection wiring; 11. Third electroplating connection wiring; 12. First external terminal; 13. Second external terminal; 14. Third external terminal; 15. Fourth external terminal; 16. First upper pad; 17. Second upper pad; 18. Metal ring; 19. First connecting wiring; 20. Second connecting wiring; 21. Third connecting wiring; 22. Fourth connecting wiring; 23. Fifth connecting wiring; 24. First through-hole conductor; 25. Second through-hole conductor; 26. Third through-hole conductor; 27. First corner hole conductor; 28. Second corner hole conductor; 29. ​​Third corner hole conductor; 30. Fourth corner hole conductor; 31. Fourth through-hole conductor;

[0037] 32. Electroplated busbar; 33. Electroplated lead wire. Detailed Implementation

[0038] The following specific embodiments will further illustrate the content of this application in detail.

[0039] Example 1

[0040] Depend on Figures 1 to 7 As shown, this application discloses a ceramic packaging base. The ceramic packaging base is obtained by dividing a ceramic packaging base assembly plate into individual base units. The ceramic packaging base includes a first annular frame substrate 1, a second annular frame substrate 2, and an insulating substrate 3. The first annular frame substrate 1 is disposed above the insulating substrate 3 and is located at the top of the ceramic packaging base. The insulating substrate 3 is located in the middle of the ceramic packaging base. The second annular frame substrate 2 is disposed below the insulating substrate 3 and is located at the bottom of the ceramic packaging base.

[0041] The insulating substrate 3 has a flat plate structure. The lower surface of the first annular frame substrate 1 and the upper surface of the insulating substrate 3 cooperate to form an upper cavity 4. The upper surface of the second annular frame substrate 2 and the lower surface of the insulating substrate 3 cooperate to form a lower cavity 5.

[0042] It also includes a toroidal metal layer 6, which is disposed on the upper surface of the first annular frame substrate 1 in a manner that surrounds the upper cavity 4. The toroidal metal layer 6 is also provided with a metal ring 18, which is used to increase the mechanical strength of the base unit 1, improve the impact and bending resistance of the overall structure, and also provide a unified interface standard for subsequent packaging.

[0043] The upper cavity 4 is provided with an upper pad, which is located on the upper surface of the insulating substrate 3 and is electrically insulated from the annular metal layer 6. The upper pad includes a first upper pad 16 and a second upper pad 17 that are spaced apart.

[0044] The lower cavity 5 is provided with a lower pad, which is located on the lower surface of the insulating substrate 3 and is electrically insulated from the upper pad. The lower pad includes a first lower pad 7 and a second lower pad 8 arranged at intervals. The first lower pad 7 is electrically connected to the annular metal layer 6.

[0045] The lower surface of the insulating substrate 3 is provided with electroplating connection wiring, which includes a first electroplating connection wiring 9, a second electroplating connection wiring 10, and a third electroplating connection wiring 11 spaced apart. The first electroplating connection wiring 9 is electrically connected to the first lower pad 7, and the third electroplating connection wiring 11 is electrically connected to the second lower pad 8. The second electroplating connection wiring 10 is electrically insulated from the first lower pad 7 and the second lower pad 8, and is also electrically connected to the first electroplating connection wiring 9 and the third electroplating connection wiring 11 on adjacent base units. The electroplating connection wiring not only enables electroplating continuity between the first lower pad and the second lower pad in the composite board structure during the ceramic packaging base fabrication process, but also allows for the simultaneous disconnection of the electrical connection between the first lower pad and the second lower pad when the composite board is cut into individual packaging bases, eliminating the need for an additional laser wire cutting step, simplifying the process, and reducing costs.

[0046] The lower surface of the second annular frame substrate 2 is provided with external terminals. The external terminals include a first external terminal 12, a second external terminal 13, a third external terminal 14, and a fourth external terminal 15 located at the four corners of the lower surface of the second annular frame substrate 2. The first external terminal 12 is electrically connected to the first lower pad 7 through a wiring unit and / or a through-hole conductor unit. The second external terminal 13 is electrically connected to the first upper pad 16 through a wiring unit and / or a through-hole conductor unit. The third external terminal 14 is electrically connected to the second lower pad 8 through a wiring unit and / or a through-hole conductor unit. The fourth external terminal 15 is electrically connected to the second upper pad 17 through a wiring unit and / or a through-hole conductor unit.

[0047] The first lower pad 7 is electrically connected to the toroidal metal layer 6 via wiring units and / or via conductor units.

[0048] The wiring unit specifically includes a first connecting wire 19, a second connecting wire 20, a third connecting wire 21 and a fourth connecting wire 22 disposed on the lower surface of the insulating substrate 3, and a fifth connecting wire 23 disposed on the upper surface of the insulating substrate 3.

[0049] The through-hole conductor unit includes a first corner hole conductor 29, a second corner hole conductor 30, a third corner hole conductor 31, and a fourth corner hole conductor 32 that pass through the second annular frame substrate 2; a first through-hole conductor 26, a second through-hole conductor 27, and a third through-hole conductor 28 that pass through the insulating substrate 3; and a fourth through-hole conductor 33 that passes through the first annular frame substrate 1.

[0050] Through-hole conductor units are installed within through-holes via printed or filled holes. The through-hole cross-section can be circular, semi-circular, or corner. Circular through-holes provide uniform stress distribution, and the drilling tools are mostly circular, facilitating machining. Furthermore, metal paste or electroplating materials can be easily and evenly filled into the circular hole, ensuring good conductivity and consistency.

[0051] The through-hole has a semi-circular cross-section. Compared to a full-circular through-hole, a semi-circular through-hole can reduce the amount of material required, especially in multilayer board designs, helping to reduce overall weight and cost. Semi-circular through-holes are suitable for applications requiring single-sided wiring or current paths in a specific direction. They are typically placed on the edge or surface of the substrate to facilitate integration with surface mount components (SMT), enhancing soldering reliability and heat dissipation performance.

[0052] The through-hole has a corner-shaped cross-section, which can be customized according to circuit layout requirements, making it more flexible to adapt to complex wiring requirements. The larger contact area reduces resistance and inductance effects, making it especially suitable for high-power applications.

[0053] The specific connection relationships between the layers of the packaging substrate are as follows:

[0054] First external terminal 12 → First corner hole conductor 29 → First connection wiring 19 → First lower pad 7;

[0055] Second external terminal 13 → Second corner hole conductor 30 → Second connection wiring 20 → Second through hole conductor 27 → First upper pad 16;

[0056] Third external terminal 14 → Third corner hole conductor 31 → Third connection wiring 21 → Second lower pad 8;

[0057] Fourth external terminal 15 → Fourth corner hole conductor 32 → Fourth connection wiring 22 → Third through hole conductor 26 → Fifth connection wiring 23 → Second upper pad 17;

[0058] Circular metal layer 6 → Fourth through hole conductor 31 → First through hole conductor 24 → First connecting wiring 19 → First corner hole conductor 27 → First external terminal 12.

[0059] The above connections ensure a reliable connection between the external terminals and the upper and lower pads. At the same time, the through-hole conductor unit can serve as a conductive channel, allowing current to be transferred from the external terminals to various layers of the package substrate.

[0060] Depend on Figure 8 As shown, when multiple ceramic packaging bases are integrated in an array in a ceramic packaging base assembly board, for adjacent base units, assuming that the four sides of packaging base A are adjacent to packaging bases B, C, D, and E respectively, and the structure and connection relationship of packaging bases A, B, C, D, and E are the same as those of the packaging bases, then the specific electrical connection relationship between adjacent packaging bases is as follows:

[0061] Package base B is located on the right side of package base A: first lower pad 7 of package base A → first connection wiring 19 of package base A → first corner hole conductor 27 of package base A → second corner hole conductor 28 of package base B → second connection wiring 20 of package base B → second through hole conductor 25 of package base B → first upper pad 16 of package base B.

[0062] Package base C is located above package base A: first lower pad 8 of package base A → first connection wiring 19 of package base A → first corner hole conductor 27 of package base A → fourth corner hole conductor 30 of package base C → fourth connection wiring 22 of package base C → third through hole conductor 26 of package base C → fifth connection wiring 23 of package base C → second upper pad 17 of package base C;

[0063] Package base D is located on the left side of package base A: second lower pad 8 of package base A → third connection wiring 21 of package base A → first triangular hole conductor 29 of package base A → fourth corner hole conductor 30 of package base D → fourth connection wiring 22 of package base D → third through hole conductor 26 of package base D → fifth connection wiring 23 of package base D → second upper pad 17 of package base D;

[0064] The package base E is located below the package base A: the second lower pad 8 of the package base A → the third connection wiring 21 of the package base A → the first triangular hole conductor 29 of the package base A → the second corner hole conductor 28 of the package base E → the second connection wiring 20 of the package base E → the second through hole conductor 25 of the package base E → the first upper pad 16 of the package base E.

[0065] The assembly board also includes an electroplating busbar 32 and an electroplating lead 33, a first upper pad 16, a second upper pad 17 and / or a first lower pad 7, and a second lower pad 8 which are electrically connected to the electroplating busbar 19 via an electroplating lead 20.

[0066] In this electroplating path, electrical connections are achieved not only within a single base unit but also allow current to flow between multiple diagonally adjacent base units. This enables insulation testing of the ceramic package base assembly board. The insulation testing process for the ceramic package base assembly board is as follows:

[0067] 1. Prepare test equipment: The test equipment consists of a high resistance meter or insulation resistance tester, as well as test fixtures and wires.

[0068] 2. Select the path to be tested: Select a plating path on the base unit that involves the lower pad as "Path A", and select a plating path on the adjacent base unit that involves the lower pad as "Path B".

[0069] 3. Apply voltage and measure resistance: Connect one probe of the test instrument to the first lower pad 7 on path A and the other probe to the second lower pad 8 on path B. Apply the predetermined test voltage and then measure the resistance value between the two probes.

[0070] 4. Analysis results: If the two paths show an open circuit (i.e., the resistance value is very high, close to infinity), it indicates that the two paths do maintain a good electrical insulation state, and all related base units are qualified products.

[0071] If the result shows a short circuit (i.e., very low or almost zero resistance), it means that at least one base unit has failed internally, causing an electrical connection between its upper and lower pads. It's possible that the upper and lower pads of the same base unit are short-circuited. Subsequent checks on the package bases along that plating path are sufficient to identify defective products, thus effectively improving production efficiency while ensuring plating uniformity.

[0072] The base unit refers to the state of the packaging base on the assembly board. The packaging base can be obtained by dividing the assembly board into individual base units.

[0073] The ceramic packaging substrate of this application consists of a flat insulating substrate and a first annular frame substrate and a second annular frame substrate respectively provided on the upper and lower surfaces. Upper and lower pads are respectively provided on the upper and lower surfaces of the insulating substrate. An annular metal surface is provided on the upper surface of the first annular frame substrate. The upper pads are electrically insulated from the annular metal layer, and a portion of the lower pads are electrically connected to the annular metal layer. The upper and lower pads are electrically insulated from each other. Electroplating connection wiring is also provided, and the lower pads are connected to a portion of the electroplating connection wiring. Additionally, interconnect wiring units and through-hole conductor units are provided to realize the packaging substrate. The connections between different layers are achieved when multiple ceramic packaging substrates are integrated in an array on a ceramic packaging substrate assembly board. The lower pads are electrically connected to the upper pads of adjacent substrate units, and the electroplating wiring between adjacent substrate units is connected, thereby forming sequentially arranged and mutually insulated electroplating paths on the assembly board. This allows each electroplating path to electrically connect multiple packaging substrates in series. When performing insulation tests, insulation tests can be performed directly on two adjacent substrate units, i.e., two adjacent electroplating paths, without having to test each ceramic packaging substrate after the assembly board is cut, thus improving testing efficiency and reducing production costs.

[0074] The above embodiments are preferred embodiments of this application, but the implementation of this application is not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of this application shall be considered equivalent substitutions and shall be included within the protection scope of this application.

Claims

1. A ceramic encapsulation base, characterized in that, The ceramic encapsulation base is obtained by dividing a ceramic encapsulation base assembly plate into individual base units. The ceramic encapsulation base includes: a first annular frame substrate (1), a second annular frame substrate (2), and an insulating substrate (3). The first annular frame substrate (1) is disposed above the insulating substrate (3) and located at the top of the ceramic encapsulation base. The insulating substrate (3) is located in the middle of the ceramic encapsulation base. The second annular frame substrate (2) is disposed below the insulating substrate (3) and located at the bottom of the ceramic encapsulation base. The insulating substrate (3) has a flat plate structure. The lower surface of the first annular frame substrate (1) and the upper surface of the insulating substrate (3) cooperate to form an upper cavity (4). The upper surface of the second annular frame substrate (2) and the lower surface of the insulating substrate (3) cooperate to form a lower cavity (5). It also includes a toroidal metal layer (6), which is disposed on the upper surface of the first annular frame substrate (1) in a manner that surrounds the upper cavity (4); The upper cavity (4) is provided with an upper solder pad, which is located on the upper surface of the insulating substrate (3) and is electrically insulated from the annular metal layer (6). The lower cavity (5) is provided with a lower pad. The lower pad is located on the lower surface of the insulating substrate (3) and is electrically insulated from the upper pad. The lower pad includes a first lower pad (7) and a second lower pad (8) arranged at intervals. The first lower pad (7) is electrically connected to the annular metal layer (6). The lower surface of the insulating substrate (3) is provided with electroplating connection wiring. The first lower pad (7) and the second lower pad (8) are respectively connected to a portion of the electroplating connection wiring, and the first lower pad (7) and the second lower pad (8) are electrically insulated from each other.

2. The ceramic encapsulation base according to claim 1, characterized in that, The electroplating connection wiring includes a first electroplating connection wiring (9), a second electroplating connection wiring (10), and a third electroplating connection wiring (11) arranged at intervals. The first electroplating connection wiring (9) is electrically connected to the first lower pad (7), the third electroplating connection wiring (11) is electrically connected to the second lower pad (8), and the second electroplating connection wiring (10) is electrically insulated from the first lower pad (7) and the second lower pad (8).

3. A ceramic encapsulation base according to claim 1, characterized in that, The lower surface of the second annular frame substrate (2) is provided with external terminals, which are electrically connected to the upper pad and the lower pad respectively.

4. A ceramic encapsulation base according to claim 3, characterized in that, The external terminals include a first external terminal (12), a second external terminal (13), a third external terminal (14) and a fourth external terminal (15) disposed on the lower surface of the second annular frame substrate (2), and the upper pads include a first upper pad (16) and a second upper pad (17) disposed at intervals. The first external terminal (12) is electrically connected to the first lower pad (7) through a wiring unit and / or a through-hole conductor unit, the second external terminal (13) is electrically connected to the first upper pad (16) through a wiring unit and / or a through-hole conductor unit, the third external terminal (14) is electrically connected to the second lower pad (8) through a wiring unit and / or a through-hole conductor unit, and the fourth external terminal (15) is electrically connected to the second upper pad (17) through a wiring unit and / or a through-hole conductor unit.

5. A ceramic encapsulation base according to claim 4, characterized in that, The first lower pad (7) is electrically connected to the toroidal metal layer (6) through wiring units and / or through-hole conductor units.

6. A ceramic encapsulation base according to claim 5, characterized in that, The wiring unit includes a first connecting wire (19), a second connecting wire (20), a third connecting wire (21) and a fourth connecting wire (22) disposed on the lower surface of the insulating substrate (3), and a fifth connecting wire (23) disposed on the upper surface of the insulating substrate (3).

7. A ceramic encapsulation base according to claim 6, characterized in that, The through-hole conductor unit includes a fourth through-hole conductor (31) that penetrates the first annular frame substrate (1). The first corner hole conductor (27), the second corner hole conductor (28), the third corner hole conductor (29) and the fourth corner hole conductor (30) pass through the second annular frame substrate (2); The first through-hole conductor (24), the second through-hole conductor (25), and the third through-hole conductor (26) penetrate the insulating substrate (3).

8. A ceramic encapsulation base according to claim 7, characterized in that, The first external terminal (12) is electrically connected to the first lower pad (7) in sequence through the first corner hole conductor (27) and the first connection wiring (19); The second external terminal (13) is electrically connected to the first upper pad (16) in sequence through the second corner hole conductor (28), the second connection wiring (20), and the second through hole conductor (25); The third external terminal (14) is electrically connected to the second lower pad (8) in sequence through the third corner hole conductor (29) and the third connection wiring (21); The fourth external terminal (15) is electrically connected to the second upper pad (17) in sequence through the fourth corner hole conductor (30), the fourth connection wiring (22), the third through hole conductor (26) and the fifth connection wiring (23).

9. A ceramic encapsulation base according to claim 7, characterized in that, The annular metal layer (6) is electrically connected to the first external terminal (12) in sequence through the fourth through-hole conductor (31), the first through-hole conductor (24), the first connecting wire (19) and the first corner hole conductor (27).

10. A ceramic encapsulation base according to any one of claims 1-9, characterized in that, It also includes a metal ring (18) disposed on the annular metal layer (6).

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