一种微电极阵列植入装置
By combining the design of the adsorption pen and the mounting base with snaps and fasteners, the microelectrode array can be clamped without damage and implanted with high precision. This solves the mechanical damage and compatibility problems of traditional implantation tools and improves the stability and adaptability of implantation.
Patent Information
- Application Number
- CN202521699985.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-11
- Publication Date
- 2026-07-17
- Estimated Expiration
- 2035-08-11
AI Technical Summary
Traditional mechanical clamping implantation tools have high risks of mechanical damage, poor universality and adaptability, and stress concentration problems, making it difficult to achieve damage-free clamping and high-precision control.
The design combines an adsorption pen and a mounting base, connecting the microelectrode array via negative pressure or adhesive. Combined with a clamping mechanism of snaps and fasteners, it achieves a stable connection for microelectrode arrays of different specifications and types, and is precisely positioned in three-dimensional space through an XYZ moving platform and a multi-dimensional adjustment device.
It achieves non-destructive clamping and high-precision implantation of microelectrode arrays, improving the applicability and implantation accuracy of the device, and ensuring the stability and versatility of electrical connections.
Smart Images
Figure CN224505454U_ABST
Abstract
Claims
1. A microelectrode array implantation device, characterized in that, include: An adsorption pen (1) has an adsorption end (101), which is connected to the array end of the microelectrode array (4) to be implanted by negative pressure or adhesive. Mounting base (2) is connected to the adsorption pen (1). The mounting base (2) has a mounting surface (201) for connecting to the connector (401) end of the microelectrode array (4) to be implanted. A buckle (3) is connected to the mounting base (2). The buckle (3) has a bolt hole (301) on the side opposite to the mounting surface (201). A fastener is connected in the bolt hole (301) by a threaded structure. The fastener and the mounting surface (201) are adapted to clamp the connector (401) of the microelectrode array (4) to be implanted.
2. The microelectrode array implant device of claim 1, wherein, The adsorption pen (1) has an airflow channel (102) inside, the adsorption end (101) has an airflow channel opening, and a suction cup (5) is connected to the airflow channel opening. The suction cup (5) has an adsorption port and an installation port, and the installation port is connected to the airflow channel opening.
3. The microelectrode array implant device of claim 2, wherein, The adsorption pen (1) has at least two adsorption ends (101), and each adsorption end (101) has at least one airflow channel opening.
4. The microelectrode array implant device of claim 2, wherein, The adsorption pen (1) has at least two arranged side by side, each adsorption pen (1) has an adsorption channel, and each adsorption pen (1) has at least one adsorption end (101).
5. The microelectrode array implant device of claim 4, wherein, Each of the adsorption pens (1) has at least two adsorption ends (101).
6. The microelectrode array implant device of claim 1, wherein, The adsorption end (101) of the adsorption pen (1) has a vertical bend.
7. The microelectrode array implant device of claim 2, wherein, The suction port of the suction cup (5) has a diameter of 1 to 10 mm.
8. The microelectrode array implant device of claim 1, wherein, The adsorption end (101) of the adsorption pen (1) has an adhesive rod, and the end of the adhesive rod has an adhesive.
9. The microelectrode array implantation device of claim 2, wherein, The airflow channel (102) of the adsorption pen (1) is connected to an air tube (6), and the other end of the air tube (6) is connected to an air pressure control device.
10. The microelectrode array implant device of claim 9, wherein, The air pressure control device includes a positive pressure output device (7) and a negative pressure output device (8), the output ends of the positive pressure output device (7) and the negative pressure output device (8) are connected to the air pipe (6) through a three-way valve (601).
11. The microelectrode array implant device of claim 1, wherein, The mounting base (2) has a bent portion (202), and the end of the bent portion (202) has a limiting ring (203), which is connected to the pen body of the adsorption pen (1).
12. The microelectrode array implant device of claim 11, wherein, The mounting base (2) is connected to the adsorption pen (1) via a Z-axis sliding assembly, which includes a Z-axis connecting rod (9), a Z-axis slide rail (10), and a first connecting member (11). One end of the Z-axis connecting rod (9) is connected to the limiting ring (203). The Z-axis slide rail (10) has a Z-axis slide groove parallel to the axis of the Z-axis connecting rod (9). The Z-axis connecting rod (9) is slidably connected in the Z-axis slide groove. The Z-axis slide rail (10) is connected to the first connecting member (11). The first connecting member (11) is connected to the pen body of the absorbent pen (1).
13. The microelectrode array implant device of claim 12, wherein, The first connector (11) is connected to the pen body of the absorbent pen (1) via a ball-head adapter (12).
14. The microelectrode array implant device of claim 12, wherein, The first connector (11) is connected to the adsorption pen (1) via an XY axis sliding assembly. The XY axis sliding assembly includes: an X-axis slide rail (13), an X-axis slider (14), a Y-axis slide rail (15), a Y-axis slider (23), and a second connector (24). The first connector (11) is connected to the X-axis slide rail (13), the X-axis slider (14) is slidably connected to the X-axis slide rail (13), the X-axis slider (14) is connected to the Y-axis slide rail (15), the Y-axis slider (23) is slidably connected to the Y-axis slide rail (15), the Y-axis slider (23) is connected to the second connector (24), and the second connector (24) is connected to the pen body of the absorbent pen (1).
15. The microelectrode array implantation device of any one of claims 1-14, wherein, Also includes: The XYZ mobile platform (25) has a mobile terminal connected to the adsorption pen (1).