一种制冷杯
By setting a hollow cavity inside the cooling pipe, filling it with cooling fluid, and combining it with a semiconductor cooling chip, the problem of insufficient efficiency per unit volume of the cooling pipe is solved, achieving a more efficient cooling and heat preservation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOSHAN PINLAI ELECTRICAL TECH CO LTD
- Filing Date
- 2025-04-23
- Publication Date
- 2026-07-17
AI Technical Summary
The existing cooling cups have insufficient cooling efficiency per unit volume of the cooling tubes, which cannot meet users' requirements for higher cooling effects.
A hollow cavity is set inside the cooling tube and filled with cooling fluid. The outer side of the cooling tube has a continuous arc shape and is connected to a sealing plug through a threaded structure. Combined with a semiconductor cooling chip and a cooling block, the cooling efficiency is improved.
It improves the cooling efficiency per unit volume of the cooling tube, resulting in better cooling effect without increasing the volume of the cooling tube, reducing the risk of damage to stored items, making cleaning easier, and providing better insulation.
Smart Images

Figure CN224505899U_ABST
Abstract
Claims
1. A cooling cup, comprising a cup body (1) and a cup lid (2), wherein the inner side of the cup body (1) is provided with a receiving cavity (11), and the cup lid (2) is provided with a cooling mechanism, characterized in that, The refrigeration mechanism is connected to a cooling pipe (3), which extends downward into the accommodating cavity (11). The inner side of the cooling pipe (3) has a hollow cavity (31), which is filled with cooling liquid.
2. The cooling cup of claim 1, wherein: The outer surface of the cooling tube (3) has a continuous arc shape.
3. The cooling cup of claim 1, wherein: The upper end of the cooling pipe (3) is open, and the upper end of the cooling pipe (3) is provided with a detachable sealing plug (32). The sealing plug (32) is tightly fitted with the inner wall of the cooling pipe (3). The sealing plug (32) is connected to a screw part (33), and the screw part (33) is detachably connected to the refrigeration mechanism through a threaded structure.
4. The cooling cup according to claim 3, characterized in that: The sealing plug (32) is formed by processing metal material.
5. The cooling cup of claim 1, wherein: The cooling mechanism includes a semiconductor cooling chip (41) and a cooling block (42). The cooling block (42) is disposed on the lower side of the semiconductor cooling chip (41), and the cooling pipe (3) is installed and fixed to the cooling block (42).
6. The cooling cup of claim 5, wherein: The upper side of the semiconductor cooling chip (41) is provided with a heat sink (43), and the lower side of the heat sink (43) is connected to a mounting base (44). The mounting base (44) is provided with a mounting cavity corresponding to the cooling block (42), and the cooling block (42) is embedded in the mounting cavity.
7. The cooling cup of claim 6, wherein: The heat sink (43) and the mounting base (44) are connected and fixed by a stud assembly. The outer side of the semiconductor cooling chip (41) is provided with a mounting plate (45). The mounting plate (45) is provided with a limiting hole corresponding to the semiconductor cooling chip (41). The mounting plate (45) is provided with a positioning hole corresponding to the stud assembly. The stud assembly passes through the upper and lower sides of the mounting plate (45) through the positioning hole. The heat sink (43) and the mounting base (44) are connected, fixed and clamp the mounting plate (45).
8. The refrigeration cup of claim 6, wherein: The mounting base (44) and the cup lid (2) are respectively provided with corresponding upper mounting part (441) and lower mounting part (21). The upper part of the cup lid (2) is open. The mounting base (44) can enter or leave the cup lid (2) through the upper opening of the cup lid (2). The upper mounting part (441) and the lower mounting part (21) are fixed to the cup lid (2) by screw device. The opening above the cup lid (2) is connected to a panel (22) that can be detached from it.
9. The refrigeration cup according to any of claims 1-8, wherein: The cup body (1) is provided with a first heat preservation cavity (121) and a second heat preservation cavity (122) arranged sequentially from the inside to the outside. The inner and outer sides of the first heat preservation cavity (121) are respectively spaced apart from the accommodating cavity (11) and the second heat preservation cavity (122).
10. The cooling cup according to claim 9, characterized in that: The first insulation cavity (121) and / or the second insulation cavity (122) are filled with cooling fluid.