一种热泵低温蒸发系统
By using a heat pump low-temperature evaporation system to create a low-pressure environment with finned heat exchangers and ejectors, the problems of high energy consumption and large carbon emissions in traditional evaporation processes are solved, achieving low-temperature evaporation and low-cost operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU RUISHENGHUA ENERGY TECH CO LTD
- Filing Date
- 2025-09-19
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional evaporation processes are energy-intensive and emit large amounts of carbon, resulting in high operating costs.
The system employs a heat pump low-temperature evaporation system, which includes a heat pump component and a vacuum component. It utilizes a finned heat exchanger to absorb heat from the air and combines it with an ejector to create a low-pressure environment, allowing the material to evaporate at low temperatures. The condenser is located inside the evaporation tank, reducing the equipment size and lowering the heat source requirements.
It effectively reduces operating costs, carbon emissions, and improves equipment applicability, enabling low-temperature evaporation processes.
Smart Images
Figure CN224506278U_ABST
Abstract
Claims
1. A heat pump subcritical evaporation system, characterized in that, The system includes a heat pump assembly (19) and a vacuum assembly (18). The heat pump assembly (19) includes an evaporator (1), an evaporator (3), a finned heat exchanger (7), and a compressor (4). The secondary steam outlet of the evaporator (1) is connected to the shell-side inlet of the evaporator (3). The evaporator (1) has a condenser coil (5), and the inlet of the condenser coil (5) is connected to the outlet of the compressor (4). The outlet of the condenser coil (5) is provided with an electronic expansion valve 1 (2) and an electronic expansion valve 2 (6). The outlet of the electronic expansion valve 1 (2) is connected to the tube-side inlet of the evaporator (3), and the electronic expansion valve 2 (6) is connected to the inlet of the finned heat exchanger (7). The tube-side outlet of the evaporator (3) is connected with a one-way valve 1 (12), and the outlet of the one-way valve 1 (12) is connected to the inlet of the compressor (4). The outlet of the finned heat exchanger (7) is connected with a one-way valve 2 (13), and the outlet of the one-way valve 2 (13) is connected to the inlet of the compressor (4). The vacuum assembly (18) is used to control the evaporation temperature of the material in the evaporator (1).
2. A heat pump low temperature evaporation system according to claim 1, characterized in that The inlet of the evaporator (1) is connected to an inlet valve (11).
3. A heat pump low temperature evaporation system according to claim 1, wherein, The outlet of the evaporator (1) is connected to a material pump (8), and the outlet of the material pump (8) is connected to an outlet valve (10) and a return valve (9). The return valve (9) is connected to the return port of the evaporator (1).
4. A heat pump low temperature vaporization system according to claim 3, wherein, A densitometer is provided between the liquid outlet of the evaporator (1) and the material pump (8). The densitometer is used to measure the density of the material and is signal-connected to the liquid outlet valve (10) and the liquid return valve (9).
5. A heat pump low temperature vaporization system according to claim 1, wherein, The evaporator (1) is equipped with a level gauge, a pressure gauge and a temperature gauge.
6. A heat pump low temperature vaporization system according to claim 1, wherein, The vacuum assembly (18) includes an ejector (15) and a cooling water tank (16). The ejector (15) is connected to the shell-side outlet of the evaporator (3) via a condensate valve (14). The outlet of the cooling water tank (16) is connected to the ejector (15) via a water pump (17). The outlet of the ejector (15) is connected to the inlet of the cooling water tank (16).
7. A heat pump low temperature vaporization system according to claim 6, wherein, The cooling water tank (16) is equipped with an overflow pipe.
8. A heat pump low temperature vaporization system according to claim 7, wherein, The cooling water tank (16) is equipped with a cooling coil, and circulating water is circulated through the cooling coil.
9. A heat pump low temperature vaporization system according to claim 1, wherein, The outer walls of the evaporator (1), evaporator (3) and condenser are all covered with a heat insulation layer.