一种半导体制冷的冷凝除湿装置
By combining semiconductor refrigeration components and condensation mechanisms, the problem of acidic water vapor corroding pipes is solved, achieving efficient dehumidification and reduced maintenance costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Filing Date
- 2025-06-24
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, acidic water vapor in industrial exhaust gas can easily corrode pipes, and the adsorption device is inconvenient to maintain and costly.
The system employs semiconductor refrigeration components and a condensation mechanism, using condenser plates and condenser elements for heat exchange. This reduces the exhaust gas temperature to below the dew point, causing water vapor to condense into liquid water, thus reducing the corrosion of pipelines by acidic water vapor. Furthermore, the system improves heat exchange efficiency through a hydrophobic coating and staggered condenser elements.
It significantly reduces exhaust gas humidity, reduces corrosion of pipelines by acidic water vapor, improves heat exchange efficiency, and has a compact structure with low maintenance costs.
Smart Images
Figure CN224506688U_ABST
Abstract
Claims
1. A semiconductor refrigeration condensation dehumidifying device, characterized by, The condenser includes a condenser box (1), with an air inlet (10) at the lower end and an air outlet (11) at the upper end. Condensation mechanisms (2) are symmetrically arranged on two opposing sides inside the condenser box (1). The condensation mechanism (2) includes a condensation plate (20) and a plurality of condensation components (200) distributed on the inner wall of the condensation plate (20). A semiconductor refrigeration component (21) is provided on the outer wall of the condensation plate (20). The cold end of the semiconductor refrigeration component (21) is in contact with the outer side of the condensation plate (20). A cooling component (22) is provided on the hot end of the semiconductor refrigeration component (21). A flow guiding cavity (220) is provided in the cooling component (22). A medium inlet (221) for supplying cooling medium into the flow guiding cavity (220) is provided at the lower end of the cooling component (22). A medium outlet (222) for discharging cooling medium is provided at the upper end of the cooling component (22).
2. The condensation dehumidifying apparatus using semiconductor refrigeration according to claim 1, wherein The condenser (200) is configured as either an array of condenser fins or condenser columns, with adjacent rows of condenser (200) staggered.
3. The condensation dehumidifying apparatus using semiconductor refrigeration according to claim 1, wherein The inner wall of the condenser plate (20) is provided with a hydrophobic coating.
4. The condensation dehumidifying apparatus of claim 1 or 3, wherein the semiconductor refrigeration device is a thermoelectric cooler. A temperature sensor is provided on the condenser plate (20).
5. The condensation dehumidifying apparatus of claim 1, wherein the semiconductor refrigeration device is a thermoelectric cooler. The semiconductor cooling assembly (21) includes a heat insulation plate (210) and a plurality of semiconductor cooling chips (211). The heat insulation plate (210) is provided with a plurality of mounting holes (212), and the semiconductor cooling chips (211) are embedded in the mounting holes (212).
6. A semiconductor refrigeration condensation dehumidification device according to claim 1 or 5, characterized in that, The cooling assembly (22) includes a heat-conducting plate (223) and a cover plate (224). The flow-guiding cavity (220) is disposed on the outer side of the heat-conducting plate (223). The cover plate (224) is disposed on the outer side of the heat-conducting plate (223) to close the flow-guiding cavity (220). The edge of the cover plate (224) is provided with several fasteners (225). The fasteners (225) pass through the heat-conducting plate (223), the semiconductor refrigeration assembly (21), and the condenser plate (20) in sequence and are connected to the side of the condenser box (1).
7. The semiconductor refrigeration condensation dehumidifier according to claim 6, characterized in that, A sealing ring (226) is provided between the edge of the heat-conducting plate (223) and the cover plate (224). A number of isolation strips (227) are provided in the flow guiding cavity (220). The isolation strips (227) divide the flow guiding cavity (220) into a tortuous flow guiding channel (2200) that connects the medium inlet (221) and the medium outlet (222).
8. The semiconductor refrigeration condensation dehumidifier according to claim 1, characterized in that, The medium inlets (221) of the two sets of cooling components (22) are connected by a liquid inlet pipe (23), and the medium outlets (222) of the two sets of cooling components (22) are connected by a liquid outlet pipe (24). Both the liquid inlet pipe (23) and the liquid outlet pipe (24) are equipped with a three-way connector (25).
9. A semiconductor refrigeration condensation dehumidification device according to claim 1, characterized in that, The condenser box (1) has a rectangular parallelepiped structure. The outer side of the condenser box (1) is provided with a shell (3), and the inner wall of the shell (3) is provided with a heat insulation layer (31).
10. The condensation dehumidifying apparatus of claim 1, wherein the semiconductor refrigeration device is a thermoelectric cooler. The air inlet (10) is provided with a lower flange (12) for connecting to an external pipeline, and the air outlet (11) is provided with an upper flange (13) for connecting to an external pipeline.