一种带有基材防护结构的蚀刻液精准配比装置
By combining electromagnetic flow valves and protective components, precise proportioning of etching solution and efficient collection of oblique jet liquid are achieved, solving the problems of inaccurate mixing of etching solution and substrate corrosion in existing technologies, thus improving etching effect and product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU LIANZHUO PHOTOELECTRIC MATERIAL CO LTD
- Filing Date
- 2025-08-07
- Publication Date
- 2026-07-17
AI Technical Summary
Existing etching solution mixing devices are difficult to precisely control the amount of material added, and the nozzles are prone to clogging or oblique spraying, which can lead to corrosion of non-target areas of the substrate, affecting product quality and scrap rate.
The material addition is precisely controlled by an electromagnetic flow valve and equipped with protective components, including a sleeve, a collection component and a fan. The oblique etching solution is collected by negative pressure adsorption and diversion to prevent it from corroding the substrate.
Improving the accuracy of etching solution formulation reduces the risk of corrosion in non-target areas of the substrate, reduces waste and production costs, and improves product yield.
Smart Images
Figure CN224506996U_ABST
Abstract
Claims
1. An etching solution precise proportioning device with a substrate protection structure, comprising a mixing device main body (1), characterized in that: The top of the mixing device body (1) is fixedly installed with a liquid storage cylinder (2), the input end of the liquid storage cylinder (2) is fixedly installed with an electromagnetic flow valve (3), the input end of the electromagnetic flow valve (3) is communicated with the inside of the mixing device body (1), the outer surface of the mixing device body (1) is fixedly installed with a fluoroplastic magnetic force pump (4), the output end of the fluoroplastic magnetic force pump (4) is fixedly connected with a liquid outlet pipe (5), the input end of the liquid outlet pipe (5) is fixedly connected with a fixed pipe (6), the output end of the fixed pipe (6) is fixedly connected with a spray head (7), and the outer surface of the fixed pipe (6) is installed with a protection assembly (8).
2. The etching solution precise proportioning device with substrate protection structure according to claim 1, characterized in that: The protection assembly (8) comprises a sleeve (81) which is screwed on the outer surface of the fixed pipe (6), a collecting assembly (82) is installed on the inner wall bottom end of the sleeve (81), a collecting cavity (83) is formed in the inside of the sleeve (81), a liquid outlet groove which is communicated with the inside bottom end of the collecting cavity (83) is formed in the surface of the sleeve (81), a sealing bolt (84) is screw-sealedly installed on the surface of the liquid outlet groove, a communicating pipe (85) which is communicated with the inside of the collecting assembly (82) is fixedly connected in the inside of the sleeve (81), a flow guide plate (86) is fixedly connected to the inside top end of the collecting cavity (83), and a fan (87) is fixedly installed on the top of the sleeve (81) and communicated with the inside of the collecting cavity (83).
3. The etching solution precise proportioning device with substrate protection structure according to claim 2, characterized in that: The collecting assembly (82) comprises a collecting plate (821) which is fixedly connected to the inner wall bottom end of the sleeve (81), a through groove (822) is formed in the inside center of the collecting plate (821), a liquid inlet groove (824) is formed in the inside of the collecting plate (821), liquid inlet holes (823) which are communicated with the inside of the liquid inlet groove (824) are equidistantly formed in the surface of the collecting plate (821), and the inside of the liquid inlet groove (824) is communicated with the inside of the collecting cavity (83) through the communicating pipe (85).
4. The etching solution precise proportioning device with substrate protection structure according to claim 2, characterized in that: The output end of the fan (87) extends to the top of the sleeve (81), the outer surface of the flow guide plate (86) is arc-shaped, and the top of the communicating pipe (85) is located directly below the arc-shaped surface of the flow guide plate (86).
5. The etching solution precise proportioning device with substrate protection structure according to claim 3, characterized in that: The outer surface of the spray head (7) is longitudinally and slidingly connected in the inside of the sleeve (81) and the through groove (822).
6. The etching solution precise proportioning device with substrate protection structure according to claim 3, characterized in that: The top of the collecting plate (821) has a smaller diameter than the bottom, and the outside of the collecting plate (821) is communicated with the inside of the liquid inlet groove (824) through the liquid inlet holes (823).
7. The etching solution precise proportioning device with substrate protection structure according to claim 2, characterized in that: The collecting cavity (83) and the flow guide plate (86) are both annular, and the outer surface of the fan (87) is sealingly and fixedly installed in the inside of the sleeve (81) through a sealing gasket.
8. The etching solution precise proportioning device with substrate protection structure according to claim 2, characterized in that: The sleeve (81) is circular, the top of the sleeve (81) has a smaller caliber than the bottom, and the small-caliber end of the sleeve (81) is provided with threads which are matched with the outer surface of the fixed pipe (6).
9. The etching solution precise proportioning device with substrate protection structure according to claim 3, characterized in that: The outer diameter of the spray head (7) is smaller than the caliber of the through groove (822), and the outer surface of the sleeve (81) is provided with anti-skid lines.
10. The etching solution precise proportioning device with substrate protection structure according to claim 2, characterized in that: The top aperture of the collection cavity (83) is larger than the bottom aperture, and the interior of the collection cavity (83) is in communication with the exterior of the sleeve (81) by means of a fan (87).