一种SMT贴片机的防氧化焊膏喷涂装置

Abstract

本实用新型公开了一种SMT贴片机的防氧化焊膏喷涂装置，涉及SMT贴片机领域，包括支撑板、混料罐和泵机，所述支撑板的上方两侧设置有限位组件，且支撑板的顶部四角固定连接有支撑立杆。该一种SMT贴片机的防氧化焊膏喷涂装置，通过设置有限位组件、混料罐和惰性气体供气管，在SMT贴片机中对焊膏喷涂装置进行使用的过程中，避免在后续加工的过程中发生工件偏移的情况，保证后续焊膏喷涂的顺利进行，且夹持部件具有防夹损效果，避免因夹持力过大而对工件造成损坏，同时可有效实现对焊膏的防氧化处理，且对焊膏物料进行充分混合，使得焊膏物料在后续的使用过程中更加顺利，方便工作人员对SMT贴片机的焊膏喷涂装置进行使用。

Claims

1. An anti-oxidation solder paste spraying device of SMT pick-and-place machine, comprising a support plate (1), a mixing tank (5) and a pump (13), characterized in that, Limiting components (2) are provided on both sides above the support plate (1), and support poles (3) are fixedly connected to the four corners of the top of the support plate (1). Supporting top plate (4) is fixedly connected to the top of the support poles (3). The mixing tank (5) is fixedly connected to one side of the top of the supporting top plate (4). A movable cover (6) is provided above the mixing tank (5). A mixing component (12) is provided inside the mixing tank (5). The pump (13) is located on the top of the supporting top plate (4). A flow pipe (14) is fixedly connected to one side of the pump (13). The end of the flow pipe (14) is fixedly connected to the inner bottom wall of the mixing tank (5). A connecting hose (15) is fixedly connected to the other side of the pump (13). At the same time, the end of the connecting hose (15) passes through the supporting top plate (4) and is fixedly connected to a spray port (16).

2. The oxidation-preventing solder paste spraying device of the SMT chip mounter according to claim 1, characterized in that, The limiting component (2) includes a small motor (201), a limiting screw (202), a sliding block (203), a connecting block (204), a connecting rod (205), a blocking plate (206), a clamping plate (207), and a return spring (208). The small motor (201) is located inside the support plate (1), and the output shaft of the small motor (201) is fixedly connected to the limiting screw (202) through a coupling. The limiting screw (202) is rotatably connected inside the support plate (1).

3. The anti-oxidation solder paste spraying device for an SMT pick-and-place machine according to claim 2, characterized in that, The limiting screw (202) is connected to a sliding block (203) by a threaded rotation, and the sliding block (203) is engaged and slidably connected with the support plate (1), and a connecting block (204) is welded to the top of the sliding block (203).

4. The oxidation-preventing solder paste spraying device of the SMT chip mounter according to claim 2, characterized in that, Connecting rods (205) are connected through the four inner corners of the connecting block (204), and a baffle plate (206) is welded to one end of the connecting rod (205). The baffle plate (206) is located on one side of the connecting block (204), and a clamping plate (207) is located on the other side of the connecting block (204).

5. The oxidation-preventing solder paste jetting device of the SMT chip mounter according to claim 2, characterized in that, The clamping plate (207) is welded to the other end of the connecting rod (205), and a return spring (208) is provided on the outside of the connecting rod (205), and the return spring (208) is provided between the connecting block (204) and the clamping plate (207).

6. The oxidation-preventing solder paste jetting device of the SMT chip mounter according to claim 1, characterized in that, The top of the mixing tank (5) is fixedly connected to an arc-shaped locking block (7), and the movable cover (6) is engaged with the top of the mixing tank (5) through the arc-shaped locking block (7). The movable cover (6) and the outer wall of the mixing tank (5) are both welded with fixing blocks (8), and the fixing blocks (8) are fixedly connected to each other by bolts.

7. The oxidation-preventing solder paste jetting device of the SMT chip mounter according to claim 1, characterized in that, A fan (9) is fixedly connected to one side of the top of the movable cover (6), and an inert gas supply pipe (10) is fixedly connected to one side of the fan (9), and an air inlet pipe (11) is fixedly connected to the other side of the fan (9), and the air inlet pipe (11) is fixedly connected to the inner wall of the movable cover (6).

8. The anti-oxidation solder paste spraying device for an SMT pick-and-place machine according to claim 1, characterized in that, The mixing assembly (12) includes a drive motor (1201), a rotating rod (1202), and a mixing component (1203). The drive motor (1201) is located at the top center of the movable cover (6). The output shaft of the drive motor (1201) is fixedly connected to the rotating rod (1202) via a coupling. The outer wall of the rotating rod (1202) is fixedly connected to the mixing component (1203), and the outer wall of the mixing component (1203) is in contact with the inner wall of the mixing tank (5).

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