一种平流施涂器模头结构、侧面供料的施涂器以及涂膜系统
By designing the structure of the horizontal flow applicator die head, the coating moves in a horizontal flow manner in the uniform distribution chamber and the discharge slit, which solves the problem of unstable coating discharge speed and achieves stable and uniform discharge.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHASHI LIGHT IND MACHINERY
- Filing Date
- 2025-08-19
- Publication Date
- 2026-07-17
AI Technical Summary
In existing coating systems, the coating discharge speed is prone to sudden increases or decreases during adjustment, making adjustments difficult.
The applicator employs a horizontal flow coating die head structure, including a horizontally placed first die lip and second die lip, and is equipped with a first and second material distribution groove. The coating material enters the material distribution chamber from the inlet through the connecting channel and is discharged from the outlet slit, avoiding the tendency of the coating material to fall and achieving horizontal flow.
It effectively avoids sudden changes in the coating discharge speed, simplifies the discharge adjustment process, and improves the stability and uniformity of coating distribution.
Smart Images
Figure CN224507446U_ABST
Abstract
Claims
1. A flow coater die structure characterized by, The device includes a first mold lip and a second mold lip that are placed horizontally and fitted together vertically. The bottom surface of the first mold lip is recessed and has a first material leveling groove and a second material leveling groove. The top surfaces of the first material leveling groove, the second material leveling groove, and the second mold lip together form a first material leveling cavity and a second material leveling cavity. A connecting channel is provided between the first material leveling cavity and the second material leveling cavity. The first mold lip is also provided with an inlet that communicates with the first material leveling cavity. A discharge slit that communicates with the second material leveling cavity is also provided between the first mold lip and the second mold lip.
2. The laminar applicator die structure of claim 1 wherein, The feed inlet is connected to a feed pipe.
3. The laminar applicator die structure of claim 1 wherein, The first uniform material chamber includes a constant diameter section connected to the feed inlet and a reduced diameter section connected to the connecting channel.
4. A side-fed applicator characterized in that, It includes two horizontally opposed coating rollers, and also includes a horizontal coating die structure as described in any one of claims 1-3, which is respectively opposed to the two coating rollers.
5. A film coating system characterized by, Includes the side-feeding applicator as described in claim 4.