半导体测试用输送设备及半导体测试系统

By optimizing the loading and unloading process of semiconductor testing equipment through a U-shaped layout and a turning mechanism, the equipment achieves efficient space utilization and flexible layout, solving the problems of time-consuming and labor-intensive manual loading and unloading and large equipment footprint in the existing technology, and improving the degree of automation and testing efficiency.

CN224507703UActive Publication Date: 2026-07-17SHENZHEN YUANLICHUANG TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN YUANLICHUANG TECH CO LTD
Filing Date
2025-06-06
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing semiconductor testing equipment requires time-consuming and labor-intensive manual operation during loading and unloading, has a large footprint, lacks flexibility, and is difficult to adapt to the development needs of modularization and high integration.

Method used

The conveying equipment adopts a U-shaped layout and is combined with a loading and unloading turning mechanism to enable the material tray to be loaded and unloaded in a direction perpendicular to the conveying direction. The rotation and transformation of the material tray's posture are realized through the loading and unloading turning mechanisms, reducing the lateral space requirement. Automated loading and unloading are achieved through lifting and palletizing mechanisms.

Benefits of technology

It improves the space utilization and layout flexibility of the equipment, reduces the horizontal footprint of the equipment, enhances the degree of automation, adapts to the compact layout of multiple devices, and improves testing efficiency.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224507703U_ABST
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Abstract

本申请涉及一种半导体测试用输送设备及半导体测试系统。半导体测试用输送设备具有上料位、下料位以及位于上料位和下料位之间的传输装置。半导体置于料盘中自上料位向传输装置上料,以及自传输装置向下料位下料。输送设备包括设置于上料位和传输装置之间的上料转向机构,以及设置于传输装置和下料位之间的下料转向机构。其中,处于上料位的料盘以上料姿态被输送至上料转向机构,上料转向机构受控驱动料盘由上料姿态旋转为输送姿态后输送至传输装置,处于传输装置的料盘以输送姿态被输送至下料转向机构,下料转向机构受控驱动料盘旋转为下料姿态后输送至下料位。本申请提供的半导体测试用输送设备,可提升设备的空间利用率及设备布置的灵活性。
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Claims

1. A semiconductor testing conveying device comprising a loading station (101), a unloading station (102), and a transfer device (3) located between the loading station (101) and the unloading station (102), wherein semiconductors are placed in a tray (6) and loaded from the loading station (101) to the transfer device (3), and unloaded from the transfer device (3) to the unloading station (102), characterized in that, The conveying device (100) includes a feeding turning mechanism (2) disposed between the feeding position (101) and the conveying device (3), and a discharging turning mechanism (4) disposed between the conveying device (3) and the unloading position (102). The material tray (6) at the feeding position (101) is conveyed to the feeding turning mechanism (2) in a feeding posture. The feeding turning mechanism (2) is controlled to drive the material tray (6) to rotate from the feeding posture to the conveying posture and then convey it to the conveying device (3). The material tray (6) at the conveying device (3) is conveyed to the unloading turning mechanism (4) in a conveying posture. The unloading turning mechanism (4) is controlled to drive the material tray (6) to rotate to the unloading posture and then convey it to the unloading position (102).

2. The conveyance apparatus for semiconductor test according to Claim 1, wherein The loading and unloading postures of the material tray (6) are rotated 90° on the horizontal plane compared to the conveying posture of the material tray (6).

3. The conveyance apparatus for semiconductor test according to Claim 1, wherein The conveying equipment (100) includes a lifting and dispensing mechanism (12) and a loading trolley (11) located at the loading position (101). The loading trolley (11) is used to carry stacked trays (6) and connect them to the lifting and dispensing mechanism (12). The lifting and dispensing mechanism (12) is used to convey the stacked trays (6) one by one to the loading and turning mechanism (2).

4. The conveyance apparatus for semiconductor test according to Claim 3, wherein The conveying equipment (100) includes a lifting and stacking mechanism (52) and a unloading trolley (51) disposed at the unloading position (102). The lifting and stacking mechanism (52) is used to stack a number of the material trays (6) one by one, and the unloading trolley (51) is used to dock to the lifting and stacking mechanism (52) to receive the material trays (6) stacked on the lifting and stacking mechanism (52).

5. The conveyance apparatus for semiconductor test according to Claim 1, wherein The conveying equipment (100) includes a material identification device, and the conveying device (3) has a waiting pick-up position (31). After the semiconductor and / or tray (6) is identified as qualified by the material identification device, it waits to be picked up for testing at the waiting pick-up position (31).

6. The conveyance apparatus for semiconductor test according to Claim 5, wherein The conveying device (3) has a tray buffer position (32) located downstream of the waiting material pick-up position (31), the tray buffer position (32) being used to stack empty trays (6).

7. The conveyance apparatus for semiconductor test according to Claim 6, wherein The transmission device (3) has a post-inspection release position (34) located downstream of the tray buffer position (32), and the empty tray (6) is used to place qualified semiconductors at the post-inspection release position (34).

8. The conveyance apparatus for semiconductor test according to any one of claims 5 to 7, wherein The transmission device (3) has NG storage positions (33) located side by side with the waiting pick-up position (31), and the NG storage positions (33) are used to store semiconductors that are identified as unqualified by the material identification device or that fail the test.

9. The semiconductor testing conveying device as described in claim 4, characterized in that, The loading position (101), the conveying device (3) and the unloading position (102) are arranged in a U-shape. The loading position (101) and the unloading position (102) are also equipped with a material car sensing device. The material car sensing device at the loading position (101) is used to detect whether the loading trolley (11) is docked with the lifting and palletizing mechanism (12). The material car sensing device at the unloading position (102) is used to detect whether the unloading trolley (51) is docked with the lifting and palletizing mechanism (52).

10. A semiconductor test system, characterized by, The device includes a testing machine (200), a robotic arm (300), and a conveying device (100) as described in any one of claims 1 to 9, wherein the robotic arm (300) picks up a semiconductor from the conveying device (100) and places it on the testing machine (200) for testing, and picks up the tested semiconductor from the testing machine (200) and puts it back on the conveying device (100).