Cleaning board and cleaning device

Abstract

This application provides a cleaning plate and a cleaning device. The cleaning plate includes a substrate and a cleaning component. The cleaning component is connected to at least one surface of the substrate. The cleaning component includes a connecting layer and an elastic layer. One side of the connecting layer is used to connect to the substrate. The elastic layer includes an elastic body and elastic protrusions. The elastic body is connected to the other side of the connecting layer away from the substrate. A plurality of elastic protrusions are connected to the surface of the elastic body on the side away from the connecting layer. The cleaning component also includes a plurality of abrasives. The plurality of abrasives are at least distributed on the surfaces of the plurality of elastic protrusions.

Description

Technical Field

[0001] This application relates to the field of probe cleaning technology, and more particularly to a cleaning plate and cleaning device. Background Technology

[0002] When probes inspect circuit boards, the OSP film (organic protective coating) on ​​the circuit board can adhere to the probe tip, causing contamination. Therefore, probes need to be cleaned after testing. Currently, most probes are cleaned with cleaning paper, which has an abrasive layer on its surface to clean the probe. However, this cleaning method can easily damage the probe. Utility Model Content

[0003] This application provides a cleaning plate and a cleaning device to solve the problem that cleaning paper can easily damage probes in the known art.

[0004] This application provides a cleaning plate, including a substrate and a cleaning component; the cleaning component is connected to at least one surface of the substrate, the cleaning component includes a connecting layer and an elastic layer, one side of the connecting layer is used to connect to the substrate, the elastic layer includes an elastic body and elastic protrusions, the elastic body is connected to the other side of the connecting layer away from the substrate, and a plurality of elastic protrusions are connected to the surface of the elastic body on the side away from the connecting layer; wherein, the cleaning component further includes a plurality of abrasives, and the plurality of abrasives are at least distributed on the surface of the plurality of elastic protrusions.

[0005] In one possible implementation, the abrasive is configured as a granular structure, and the particle size of the abrasive is 1.5 μm to 2.5 μm.

[0006] In one possible implementation, the grinding element is connected to the sidewall of the elastic protrusion.

[0007] In one possible implementation, a plurality of the elastic protrusions are spaced apart on the surface of the elastic body on the side away from the connecting layer.

[0008] In one possible implementation, some of the abrasive elements are also located between two adjacent elastic protrusions and connected to the surface of the elastic body on the side away from the connecting layer.

[0009] In one possible implementation, the elastic body has multiple buffer holes.

[0010] In one possible implementation, a mounting groove is formed on the surface of the substrate, and the cleaning component is accommodated in the mounting groove.

[0011] In one possible implementation, the thickness of the cleaning element is 400 μm to 500 μm.

[0012] This application also provides a cleaning device, including a first mounting plate, a second mounting plate, and the cleaning plate, wherein the first mounting plate and the second mounting plate are spaced apart along a first direction, and the cleaning plate is located between the first mounting plate and the second mounting plate, wherein at least one of the first mounting plate and the second mounting plate is used to mount a part to be cleaned, and wherein at least one of the first mounting plate and the second mounting plate is movable relative to the cleaning plate along the first direction.

[0013] In one possible implementation, the cleaning device further includes a first carrier plate and a second carrier plate, wherein along the first direction, the first carrier plate is connected to the side of the first mounting plate near the second mounting plate, the second carrier plate is connected to the side of the second mounting plate near the first mounting plate, and the cleaning plate is located between the first carrier plate and the second carrier plate, and the cleaning plate is connected to either the first carrier plate or the second carrier plate.

[0014] In the cleaning plate of this application, the elastic layer of the cleaning component consists of an elastic body and elastic protrusions. A grinding component is connected to the surface of the elastic protrusions. When the probe abuts against the elastic layer, the elastic deformation of the elastic protrusions causes multiple elastic protrusions to cover the surface of the probe. This allows the grinding component on the surface of the elastic protrusions to clean the probe surface, while also preventing the grinding component from excessively pressing against the probe surface and damaging it. Furthermore, the elastic layer of this application can buffer the pressure applied by the probe to the cleaning component and supports the cleaning component through the substrate to prevent the probe from puncturing the cleaning component, thereby improving the service life of the cleaning plate. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the cleaning plate of this application in one embodiment.

[0016] Figure 2 This is a schematic diagram of the cleaning component of the cleaning plate in one embodiment of this application.

[0017] Figure 3 This is a schematic diagram of the cleaning device of this application in one embodiment.

[0018] Figure 4 This is a schematic diagram of the structure of the first carrier plate of the cleaning device of this application in one embodiment.

[0019] Key component symbols: 200, cleaning device; 100, cleaning plate; Z, first direction; X, second direction; Y, third direction; 10, substrate; 11, mounting groove; 12, positioning hole; 20, cleaning component; 21, connecting layer; 22, elastic layer; 221, elastic body; 2210, buffer hole; 222, elastic protrusion; 23, grinding component; 31, first mounting plate; 32, second mounting plate; 33, first carrier plate; 331, perforation; 332, positioning post; 34, second carrier plate; 40, probe.

[0020] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0021] The following description will refer to the accompanying drawings to provide a more complete picture of the present application. The drawings illustrate exemplary embodiments of the present application. However, the present application may be implemented in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. These exemplary embodiments are provided to make the present application thorough and complete, and to fully convey the scope of the present application to those skilled in the art. Similar reference numerals denote the same or similar components.

[0022] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to limit the application. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to also include the plural forms. Furthermore, when used herein, “comprising” and / or “including” and / or “having,” integers, steps, operations, components, and / or components, but does not exclude the presence or addition of one or more other features, regions, integers, steps, operations, components, and / or groups thereof.

[0023] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. Furthermore, unless expressly defined herein, terms such as those defined in a general dictionary should be interpreted as having the same meaning as they have in the relevant art and in the content of this application, and will not be interpreted as having an idealized or overly formal meaning.

[0024] The specific embodiments of this application will be further described in detail below with reference to the accompanying drawings.

[0025] like Figures 1 to 3 As shown, this embodiment provides a cleaning plate 100, including a substrate 10 and a cleaning component 20.

[0026] For ease of reading, this application introduces the terms first direction Z, second direction X, and third direction Y to describe the embodiments of this application. The first direction Z, second direction X, and third direction Y can be three non-parallel straight lines in space; further, the first direction Z, second direction X, and third direction Y can be three mutually perpendicular directions in a three-dimensional coordinate system (a three-dimensional Cartesian coordinate system). In subsequent embodiments, the first direction Z is described as the Z-axis direction of the three-dimensional coordinate system, the second direction X as the X-axis direction of the three-dimensional coordinate system, and the third direction Y as the Y-axis direction of the three-dimensional coordinate system.

[0027] Along the first direction Z, the cleaning component 20 is connected to at least one surface of the substrate 10. The cleaning component 20 includes a connecting layer 21 and an elastic layer 22. One side of the connecting layer 21 is used to connect to the substrate 10. The elastic layer 22 includes an elastic body 221 and elastic protrusions 222. The elastic body 221 is connected to the other side of the connecting layer 21 away from the substrate 10, and a plurality of elastic protrusions 222 are connected to the surface of the elastic body 221 away from the connecting layer 21. The cleaning component 20 also includes a plurality of abrasive elements 23, which are distributed at least on the surfaces of the plurality of elastic protrusions 222.

[0028] Thus, in the cleaning plate 100 of this application, the elastic layer 22 of the cleaning member 20 is composed of an elastic body 221 and elastic protrusions 222. The abrasive member 23 is connected to the surface of the elastic protrusions 222. When the probe 40 abuts against the elastic layer 22, the elastic deformation of the elastic protrusions 222 causes multiple elastic protrusions 222 to cover the surface of the probe 40. On the one hand, the abrasive member 23 on the surface of the elastic protrusions 222 can clean the surface of the probe 40. On the other hand, the elastic deformation of the elastic protrusions 222 can prevent the abrasive member 23 from pressing too hard on the surface of the probe 40 and damaging the probe 40. In addition, the elastic layer 22 of this application can buffer the pressure applied by the probe 40 to the cleaning member 20 and support the cleaning member 20 through the substrate 10 to prevent the probe 40 from puncturing the cleaning member 20, thereby improving the service life of the cleaning plate 100.

[0029] Please combine Figures 1 to 2 In one embodiment, the substrate 10 is a square plate, which can be made of high-frequency circuit board material such as WA6000. Along the first direction Z, a plurality of mounting grooves 11 are formed on one side surface of the substrate 10, the mounting grooves 11 being recessed inward from the surface of the substrate 10. Each mounting groove 11 can accommodate a cleaning component 20 to simultaneously clean multiple probes 40. The mounting grooves 11 are spaced apart, and the specific dimensions of the mounting grooves 11 can be designed according to the dimensions of the cleaning components 20 to be accommodated. The specific distribution of the multiple mounting grooves 11 can also be designed according to the distribution of the multiple probes 40 to be cleaned.

[0030] The thickness of the cleaning component 20 is approximately 400um to 500um, specifically 400um, 410um, 420um, 430um, 440um, 450um, 460um, 470um, 480um, 490um, 5000um, etc.

[0031] In some embodiments, the depth of the mounting groove 11 is greater than or equal to the thickness of the cleaning component 20, so that the surface of the cleaning component 20 on the side away from the substrate 10 does not extend beyond the surface of the substrate 10, thereby providing a certain degree of protection for the cleaning component 20 and preventing wear and tear on the cleaning component 20.

[0032] It is understood that, in other embodiments, the depth of the mounting groove 11 may also be less than the thickness of the cleaning component 20, so that part of the cleaning component 20 is exposed outside the mounting groove 11. The specific relative relationship between the depth of the mounting groove 11 and the thickness of the cleaning component 20 can be selected according to design requirements.

[0033] In addition, along the first direction Z, mounting grooves 11 are provided on both opposite sides of the substrate 10, and the number, shape, size, etc. of the mounting grooves 11 on each side of the substrate 10 can be designed accordingly based on the number of probes 40 that need to be cleaned on that side.

[0034] Please combine Figures 1 to 2 In one embodiment, the connecting layer 21 is a cured adhesive. One side of the connecting layer 21 is bonded to the bottom wall of the mounting groove 11, and the other side of the connecting layer 21 is bonded to the side of the elastic body 221 away from the elastic protrusion 222, so as to fix the elastic layer 22 to the substrate 10.

[0035] In this embodiment, the elastic body 221 can be made of elastic materials such as silicone or sponge, and the specific material can be selected according to the actual need for cleaning the probe 40.

[0036] The elastic body 221 has multiple buffer holes 2210. Along the second direction X, the multiple buffer holes 2210 are arranged at intervals. Along the third direction Y, the buffer holes 2210 penetrate the elastic body 221 to improve the buffering performance of the elastic body 221.

[0037] Furthermore, multiple elastic protrusions 222 are integrally formed with the elastic body 221, and the area of ​​the elastic layer 22 away from the connecting layer 21 has a generally wavy structure to form the aforementioned multiple elastic protrusions 222.

[0038] Multiple elastic protrusions 222 are spaced apart on the surface of the elastic body 221 on the side away from the connecting layer 21. Along the second direction X, the multiple elastic protrusions 222 are arranged sequentially at intervals, and a certain gap is formed between any two adjacent elastic protrusions 222, which allows the elastic protrusions 222 to undergo elastic deformation within the gap. The grinding element 23 is provided with a granular structure, and the grinding element 23 can be made of materials such as alumina.

[0039] The abrasive particle 23 has a particle size of 1.5 μm to 2.5 μm, specifically 1.5 μm, 1.6 μm, 1.7 μm, 1.8 μm, 1.9 μm, 2.0 μm, 2.1 μm, 2.2 μm, 2.3 μm, 2.4 μm, 2.5 μm, etc. The abrasive particle 23 is attached to the sidewall of the elastic protrusion 222. For example, along the second direction X, abrasive particles 23 are provided on the sidewalls of opposite sides of the elastic protrusion 222. Thus, when the probe 40 to be cleaned abuts against the surface of the elastic layer 22 on the side away from the connecting layer 21, the elastic protrusion 222 is compressed and undergoes elastic deformation, allowing the elastic protrusion 222 to cover the end of the probe 40, thereby enabling the abrasive particles 23 attached to the sidewall of the elastic protrusion 222 to clean the end of the probe 40.

[0040] It is worth noting that the shapes of the various elastic protrusions 222 can be the same or different. In addition, the cross-sectional shape of the elastic protrusions 222 can be a regular shape or other irregular shapes, as long as the protrusion structure formed by the elastic protrusions 222 can be used for the abrasive workpiece 23 to attach.

[0041] Furthermore, some of the multiple polishing elements 23 are located between two adjacent elastic protrusions 222 and connected to the surface of the elastic body 221 on the side away from the connecting layer 21. Some polishing elements 23 are located in the gap formed between two adjacent elastic protrusions 222 and are attached to the surface of the area of ​​the elastic body 221 corresponding to the gap, so as to clean the end face of the probe 40 by means of these polishing elements 23.

[0042] like Figures 3 to 4 As shown, and in combination Figure 1 This embodiment also provides a cleaning device 200, including a first mounting plate 31, a second mounting plate 32, and the aforementioned cleaning plate 100.

[0043] Along the first direction Z, a first mounting plate 31 and a second mounting plate 32 are spaced apart, and a cleaning plate 100 is located between the first mounting plate 31 and the second mounting plate 32. At least one of the first mounting plate 31 and the second mounting plate 32 is used to mount the part 20 to be cleaned.

[0044] In this embodiment, both the first mounting plate 31 and the second mounting plate 32 are needle plates, meaning that either the first mounting plate 31 or the second mounting plate 32 can mount either the probe 40 or the cleaning plate 100. The probe 40 is mounted on one of the first mounting plate 31 and the cleaning plate 100 on the other, as long as the cleaning element 20 of the cleaning plate 100 faces the probe 40. Both the first mounting plate 31 and the second mounting plate 32 have mounting holes. Along the first direction Z, the mounting holes penetrate both the first mounting plate 31 and the second mounting plate 32. One end of the probe 40 can pass through the mounting hole and extend into the area between the first mounting plate 31 and the second mounting plate 32, abutting against the cleaning element 20 of the cleaning plate 100, thereby cleaning the probe 40.

[0045] Furthermore, along the first direction Z, at least one of the first mounting plate 31 and the second mounting plate 32 can move relative to the cleaning plate 100. The cleaning device 200 also includes a drive assembly (not shown), which can be a lifting cylinder or a lead screw lifting slide, etc., which can drive the first mounting plate 31 or the second mounting plate 32 to move along the first direction Z, thereby driving the probe 40 mounted on the first mounting plate 31 or the second mounting plate 32 to move along the first direction Z toward the cleaning component 20.

[0046] It is understood that in other embodiments, the driving component may synchronously drive the first mounting plate 31 and the second mounting plate 32 to move closer to or further away from each other, so as to bring the probe 40 and the cleaning plate 100 closer to each other and improve cleaning efficiency.

[0047] Please combine Figure 3 and Figure 4 In one embodiment, the cleaning device 200 further includes a first carrier plate 33 and a second carrier plate 34, which are located between a first mounting plate 31 and a second mounting plate 32. Along a first direction Z, the first carrier plate 33 is connected to the side of the first mounting plate 31 closest to the second mounting plate 32, and the second carrier plate 34 is connected to the side of the second mounting plate 32 closest to the first mounting plate 31. A cleaning plate 100 is located between the first carrier plate 33 and the second carrier plate 34, and is connected to one of the first carrier plate 33 and the second carrier plate 34. A probe 40 is mounted on a needle plate connected to the other of the first carrier plate 33 and the second carrier plate 34.

[0048] Both the first carrier plate 33 and the second carrier plate 34 have through holes 331. One end of the probe 40 installed on the first mounting plate 31 or the second mounting plate 32 can pass through the through hole 331 and extend into the space between the first carrier plate 33 and the second carrier plate 34, and then abut against the cleaning component 20.

[0049] Positioning posts 332 are provided on both the first carrier plate 33 and the second carrier plate 34. Along the first direction Z, the positioning posts 332 protrude from the surface of the first carrier plate 33 near the second carrier plate 34 and the surface of the second carrier plate 34 near the first carrier plate 33. The substrate 10 has a positioning hole 12 that penetrates the substrate 10 along the first direction Z. The positioning posts 332 can be inserted through the positioning hole 12 to limit the substrate 10 on the first carrier plate 33 and the second carrier plate 34, ensuring that the probe 40 can abut against the cleaning member 20 provided on the substrate 10, and avoiding the probe 40 from directly abutting against the surface of the substrate 10 and damaging the probe 40.

[0050] The specific embodiments of this application have been described above with reference to the accompanying drawings. However, those skilled in the art will understand that various changes and substitutions can be made to the specific embodiments of this application without departing from the scope of this application. All such changes and substitutions fall within the scope defined by this application.

Claims

1. A cleaning sheet, characterized by, include: substrate; A cleaning component is connected to at least one side of the substrate. The cleaning component includes a connecting layer and an elastic layer. One side of the connecting layer is used to connect to the substrate. The elastic layer includes an elastic body and elastic protrusions. The elastic body is connected to the other side of the connecting layer away from the substrate. A plurality of the elastic protrusions are connected to the surface of the elastic body on the side away from the connecting layer. The cleaning component further includes a plurality of abrasive elements, which are distributed at least on the surfaces of the plurality of elastic protrusions.

2. The cleaning pad of claim 1, wherein, The grinding element is configured as a granular structure, and the particle size of the grinding element is 1.5um to 2.5um.

3. The cleaning pad of claim 1, wherein, The grinding element is connected to the sidewall of the elastic protrusion.

4. The cleaning pad of claim 1, wherein, Multiple elastic protrusions are spaced apart on the surface of the elastic body on the side away from the connecting layer.

5. The cleaning pad of claim 4, wherein, Some of the multiple grinding elements are also located between two adjacent elastic protrusions and connected to the surface of the elastic body on the side away from the connecting layer.

6. The cleaning pad of claim 1, wherein, The elastic body has multiple buffer holes.

7. The cleaning pad of claim 1, wherein, The substrate has a mounting groove on its surface, and the cleaning component is accommodated in the mounting groove.

8. The cleaning pad of claim 1, wherein, The thickness of the cleaning component is 400um to 500um.

9. A cleaning device characterized by The device includes a first mounting plate, a second mounting plate, and a cleaning plate as described in any one of claims 1 to 8. Along a first direction, the first mounting plate and the second mounting plate are spaced apart, and the cleaning plate is located between the first mounting plate and the second mounting plate. At least one of the first mounting plate and the second mounting plate is used to mount the part to be cleaned. Along the first direction, at least one of the first mounting plate and the second mounting plate is movable relative to the cleaning plate.

10. The cleaning device of claim 9, wherein, The cleaning device further includes a first carrier plate and a second carrier plate. Along the first direction, the first carrier plate is connected to the side of the first mounting plate near the second mounting plate, and the second carrier plate is connected to the side of the second mounting plate near the first mounting plate. The cleaning plate is located between the first carrier plate and the second carrier plate, and the cleaning plate is connected to either the first carrier plate or the second carrier plate.

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