一种晶圆清洗装置及半导体制造设备
By introducing a cleaning brush and an opening/closing control component into the CMP equipment, the wafer cleaning device solves the problem of insufficient wafer rotation caused by reduced roller friction, achieving more efficient wafer cleaning and improving product yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG ICSPROUT SEMICONDUCTOR CO LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-07-17
AI Technical Summary
In existing CMP equipment, the rollers suffer from reduced friction due to wear of the gaskets, resulting in insufficient wafer rotation, which affects the cleaning effect and reduces product yield.
Design a wafer cleaning device, including a cleaning brush, a wafer driving assembly, and an opening/closing state control assembly. By controlling the opening/closing state of the wafer driving assembly, the friction between the wafer and the roller is ensured, thereby achieving effective wafer rotation and cleaning in conjunction with the cleaning brush.
This improved the cleaning effect on wafers, increased product yield, and ensured the consistency and integrity of the cleaning results.
Smart Images
Figure CN224507795U_ABST
Abstract
Claims
1. A wafer cleaning apparatus, characterized by comprising: include: Cleaning brushes, located on both sides of the wafer, are used to clean the wafer; The wafer drive assembly is used to drive the wafer to rotate and, together with the cleaning brush, cleans the wafer surface. An opening / closing state control component is connected to the wafer driving component and is used to control the opening / closing state of the wafer driving component so that the wafer driving component drives the wafer to rotate.
2. The wafer cleaning apparatus according to claim 1, wherein The opening / closing state control component is used to control the wafer driving component to be in an open state before the wafer reaches the wafer driving component, and to control the wafer driving component to be in a closed state and close to the wafer after the wafer reaches the position of the wafer driving component.
3. The wafer cleaning apparatus according to claim 2, wherein The wafer driving assembly includes multiple rollers, which are spaced apart along the lower edge of the wafer. The roller is provided with a groove to accommodate the edge portion of the wafer being inserted.
4. The wafer cleaning apparatus according to claim 3, wherein The roller consists of two drive half-wheels; In the closed state, the distance between the two drive half-wheels is greater than the thickness of the wafer, wherein the distance between the two drive half-wheels being greater than the thickness of the wafer ranges from 2.0 mm to 2.8 mm.
5. The wafer cleaning apparatus of claim 2, wherein The opening / closing state control component is one of a cylinder, a motor, or a dynamometer.
6. The wafer cleaning apparatus of claim 1, wherein The cleaning brushes are arranged side by side on both sides of the wafer, with the wafer vertically positioned between the two cleaning brushes. The height of the cleaning brushes is the same as the height of the center of the wafer.
7. The wafer cleaning apparatus according to claim 6, wherein The distance between the cleaning brush and the wafer is 0.3 mm to 0.8 mm.
8. The wafer cleaning apparatus according to claim 7, characterized in that, One end of the cleaning brush is provided with a liquid inlet component for introducing cleaning fluid into the cleaning brush.
9. The wafer cleaning apparatus of claim 1, wherein Also includes: Spray bars are respectively set above both sides of the wafer, and multiple nozzles are arranged at intervals on the spray bars for spraying cleaning fluid onto the wafer.
10. A semiconductor manufacturing apparatus, characterized by comprising: The device includes a wafer cleaning apparatus, as described in any one of claims 1-9.