A wet cleaning apparatus for semiconductor manufacturing
By using a mechanical drive mechanism to clamp and rotate semiconductor wafers, the problem of water splashing during spraying is solved, achieving efficient cleaning stability and water collection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 深圳市深科电子有限公司
- Filing Date
- 2025-08-13
- Publication Date
- 2026-07-17
AI Technical Summary
Existing semiconductor cleaning devices suffer from water splashing and low cleaning stability during water rinsing, and cannot effectively collect the sprayed water.
A mechanical drive mechanism is used to clamp and fix the semiconductor wafer, and the wafer is fed into the storage box by rotating and moving the carrier plate to collect the spray water.
It effectively reduces the splashing of spray water, improving the stability of the cleaning process and the efficiency of water collection.
Smart Images
Figure CN224507822U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing-related products, specifically a wet cleaning device for semiconductor manufacturing. Background Technology
[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits. The semiconductor integrated circuit (IC) manufacturing process requires the participation of both organic and inorganic materials. Furthermore, the manufacturing process is always carried out in a cleanroom with human intervention, inevitably leading to various environmental contaminations of the silicon wafers. Therefore, wafers need to be cleaned to remove contaminants. Semiconductor wet cleaning equipment uses a rinsing method for cleaning.
[0003] However, existing cleaning devices have defects because the spray water impacts the semiconductor wafer during rinsing, causing the spray water to splash and making it impossible to effectively collect the spray water. In addition, the cleaning process is not very stable. Utility Model Content
[0004] The purpose of this invention is to provide a wet cleaning apparatus for semiconductor manufacturing to solve the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: a wet cleaning device for semiconductor production, comprising a beam frame, a storage box fixedly connected to the bottom of the beam frame, a concave support plate disposed within the beam frame, a first motor fixedly connected to the top of the support plate, a threaded rod fixedly connected to the output end of the first motor, a shelf fixedly connected to the top end of the threaded rod, a traction sleeve slidably sleeved on the threaded rod, connecting blocks fixedly connected to the four corners of the traction sleeve, a traction rod rotatably connected to the connecting blocks, a clamping block rotatably connected to one end of the traction rod, the clamping block being inserted into the shelf, and vertical rods fixedly connected to both sides of the traction sleeve, with a fixed connection between the two vertical rods. A stop plate is fixedly connected to the beam frame. The stop plate is slidably sleeved on a threaded rod. A screw sleeve is threaded onto the threaded rod and located between the stop plate and the traction sleeve. Vertical plates are fixedly connected to both sides of the top of the beam frame. A second motor is fixedly connected to the side wall of one of the vertical plates. A rotating rod is fixedly connected to the output shaft of the second motor. One end of the rotating rod is rotatably connected to the other vertical plate. Two gears are fixedly sleeved on the rotating rod. One side of the two gears is provided with meshing toothed plates. The toothed plates are slidably inserted into the beam frame. A traction plate is fixedly connected to the bottom of the beam frame. The traction plate is fixedly connected to a bearing plate. A horizontal plate is fixedly connected between the two toothed plates. A spray head is installed on the horizontal plate.
[0006] As a preferred embodiment of this utility model, the placement plate is provided with a strip groove corresponding to the position of the clamping block, and a sliding rod is fixedly connected in the strip groove, and the clamping block is slidably sleeved on the sliding rod.
[0007] As a preferred embodiment of this utility model, the inner walls on both sides of the beam frame are provided with limiting grooves, and limiting rods are fixedly connected in the limiting grooves, with the traction plate slidably sleeved on the limiting rods.
[0008] As a preferred embodiment of this invention, a drain pipe is inserted into the storage box, and a control valve is provided at one end of the drain pipe.
[0009] As a preferred embodiment of this invention, the support plate is provided with multiple drainage holes.
[0010] As a preferred embodiment of this utility model, the outer wall of the sleeve is provided with multiple anti-slip textures, all of which are inclined.
[0011] Compared with the prior art, the beneficial effects of this utility model are:
[0012] This wet cleaning apparatus for semiconductor production involves placing a semiconductor wafer on a placement plate, rotating a sleeve to move it downwards and push a stop plate, which in turn pulls a traction sleeve downwards using a vertical plate. The traction sleeve then moves a traction rod, which in turn moves a clamping block. Multiple clamping blocks clamp and fix the semiconductor wafer in place. External spray pipes from the spray head spray water onto the semiconductor wafer, and a first motor drives a threaded rod to rotate, thus rotating the semiconductor wafer.
[0013] This wet cleaning device for semiconductor production uses a second motor to start a rotating rod, which in turn causes a gear to rotate. The gear drives a toothed plate to move downward, which in turn causes a traction plate to move downward, pulling a support plate. The support plate then extends the semiconductor wafers on the placement plate into the storage box, allowing the cleaning water generated during the spraying process to be collected.
[0014] This wet cleaning apparatus for semiconductor manufacturing features a clamping assembly that facilitates the clamping and fixing of semiconductor wafers, and a mechanical drive mechanism that moves the cleaning material into the storage box, reducing splashing during the cleaning process. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the structure of a wet cleaning apparatus for semiconductor manufacturing according to the present invention;
[0016] Figure 2 This is an enlarged view of point A in a wet cleaning apparatus for semiconductor manufacturing according to this utility model.
[0017] In the diagram: 1. Beam frame; 2. Storage box; 3. Bearing plate; 4. First motor; 5. Threaded rod; 6. Shelf; 7. Traction sleeve; 8. Connecting block; 9. Drainage pipe; 10. Traction rod; 11. Clamping block; 12. Vertical rod; 13. Stop plate; 14. Rotating sleeve; 15. Vertical plate; 16. Second motor; 17. Rotating rod; 18. Gear; 19. Tooth plate; 20. Traction plate; 21. Horizontal plate; 22. Sprinkler head; 23. Sliding rod; 24. Limiting rod. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0019] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0020] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0021] Please see Figure 1-2This utility model provides an embodiment of a wet cleaning device for semiconductor manufacturing, comprising a beam frame 1, a storage box 2 fixedly connected to the bottom of the beam frame 1, a concave support plate 3 disposed within the beam frame 1, a first motor 4 fixedly connected to the top of the support plate 3, a threaded rod 5 fixedly connected to the output end of the first motor 4, a shelf 6 fixedly connected to the top end of the threaded rod 5, a traction sleeve 7 slidably sleeved on the threaded rod 5, connecting blocks 8 fixedly connected to the four corners of the traction sleeve 7, a traction rod 10 rotatably connected to the connecting blocks 8, and a clamping block 1 rotatably connected to one end of the traction rod 10. 1. Clamping block 11 is inserted into the placement plate 6. Vertical rods 12 are fixedly connected to both sides of the traction sleeve 7. A stop plate 13 is fixedly connected between the two vertical rods 12. The stop plate 13 is slidably sleeved on the threaded rod 5. The threaded rod 5 is threadedly sleeved on the rotating sleeve 14. The rotating sleeve 14 is located between the stop plate 13 and the traction sleeve 7. Vertical plates 15 are fixedly connected to both sides of the top of the beam frame 1. Specifically, the semiconductor wafer is placed on the placement plate 6. By rotating the rotating sleeve 14, it moves downward and pushes the stop plate 13. The stop plate 13 uses the vertical plates 15 to pull the traction sleeve 7 downward. The traction sleeve 7 will drive the traction rod 10. The traction rod 10 pulls the clamping blocks 11 to move, and the multiple clamping blocks 11 clamp and fix the semiconductor wafer. A second motor 16 is fixedly connected to the side wall of one of the upright plates 15. The output shaft of the second motor 16 is fixedly connected to a rotating rod 17. One end of the rotating rod 17 is rotatably connected to another upright plate 15. Two gears 18 are fixedly sleeved on the rotating rod 17. One side of the two gears 18 is provided with meshing toothed plates 19. The toothed plates 19 are slidably inserted into the beam frame 1. The bottom end of the beam frame 1 is fixedly connected to a traction plate 20. The traction plate 20 is fixedly connected to the bearing plate 3. The two toothed plates 19 are slidably inserted into the beam frame 1. A horizontal plate 21 is fixedly connected between 9, and a spray head 22 is installed on the horizontal plate 21. Specifically, the spray head 22 sprays water onto the semiconductor wafer through the external spray pipe. The first motor 4 drives the threaded rod 5 to rotate, thereby rotating the semiconductor wafer. The second motor 16 starts and causes the rotating rod 17 to rotate. When the rotating rod 17 rotates, it causes the gear 18 to rotate. The gear 18 drives the toothed plate 19 to move down, causing the traction plate 20 to move down and pull the support plate 3 to move. The support plate 3 will extend the semiconductor wafer on the storage plate 6 into the storage box 2, which can collect the cleaning water during the spraying process.
[0022] In this embodiment, the shelf 6 is provided with a strip groove corresponding to the position of the clamping block 11, and a slide rod 23 is fixedly connected in the strip groove, and the clamping block 11 is slidably sleeved on the slide rod 23.
[0023] As a technical optimization of this utility model, the slide bar 23 provides sliding support for the clamping block 11, reducing the displacement of the clamping block 11 during movement.
[0024] In this embodiment, limiting grooves are provided on both inner walls of the beam frame 1, and limiting rods 24 are fixedly connected in the limiting grooves. The traction plate 20 is slidably sleeved on the limiting rods 24.
[0025] As a technical optimization of this utility model, when the traction plate 20 moves, one end slides on the limiting rod 24, thereby increasing the stability of both ends of the moving bearing plate 3.
[0026] In this embodiment, a drain pipe 9 is inserted into the storage box 2, and a control valve is provided at one end of the drain pipe 9.
[0027] As a technical optimization of this utility model, the drain pipe 9 can facilitate the discharge of water collected in the storage box 2.
[0028] In this embodiment, the support plate 3 is provided with multiple drainage holes.
[0029] As a technical optimization of this utility model, the drainage hole facilitates the drainage of water from the spray support plate 3.
[0030] In this embodiment, the outer wall of the sleeve 14 is provided with multiple anti-slip textures, all of which are inclined.
[0031] As a technical optimization of this utility model, the setting of multiple anti-slip textures increases the stability when rotating the sleeve 14 and avoids slippage.
[0032] The working principle of this wet cleaning device for semiconductor production is described in detail below: First, the semiconductor wafer is placed on the placement plate 6. The rotating sleeve 14 moves down and pushes the stop plate 13. The stop plate 13 uses the upright plate 15 to pull the traction sleeve 7 down. The traction sleeve 7 drives the traction rod 10 to move. The traction rod 10 pulls the clamping block 11 to move. Multiple clamping blocks 11 clamp and fix the semiconductor wafer. The spray head 22 sprays water onto the semiconductor wafer through the external spray pipe. The first motor 4 drives the threaded rod 5 to rotate, realizing the rotation of the semiconductor wafer. The start of the second motor 16 causes the rotating rod 17 to rotate. When the rotating rod 17 rotates, it can cause the gear 18 to rotate. The gear 18 drives the toothed plate 19 to move down, causing the traction plate 20 to move down and pull the support plate 3 to move. The support plate 3 will carry the semiconductor wafer on the placement plate 6 to extend into the storage box 2, which can collect the cleaning water during the spraying process.
[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
Claims
1. A wet cleaning apparatus for semiconductor production comprising a beam frame (1), characterized in that: A storage box (2) is fixedly connected to the bottom of the beam frame (1). A bearing plate (3) with a concave structure is provided inside the beam frame (1). A first motor (4) is fixedly connected to the top of the bearing plate (3). A threaded rod (5) is fixedly connected to the output end of the first motor (4). A shelf plate (6) is fixedly connected to the top of the threaded rod (5). A traction sleeve (7) is slidably sleeved on the threaded rod (5). A connecting block (8) is fixedly connected to each of the four corners of the traction sleeve (7). A traction rod (10) is rotatably connected to the connecting block (8). A clamping block (11) is rotatably connected to one end of the traction rod (10). The clamping block (11) is inserted into the shelf plate (6). Vertical rods (12) are fixedly connected to both sides of the traction sleeve (7). A stop plate (13) is fixedly connected between the two vertical rods (12). The stop plate (13) is slidably sleeved on the threaded rod (5). 5) The upper thread is fitted onto the rotating sleeve (14), which is located between the stop plate (13) and the traction sleeve (7). Vertical plates (15) are fixedly connected to both sides of the top of the beam frame (1). A second motor (16) is fixedly connected to the side wall of one of the vertical plates (15). A rotating rod (17) is fixedly connected to the output shaft of the second motor (16). One end of the rotating rod (17) is rotatably connected to the other vertical plate (15). (17) Two gears (18) are fixedly sleeved on the upper part. One side of the two gears (18) is provided with meshing tooth plates (19). The tooth plates (19) are slidably inserted on the beam frame (1). The bottom end of the beam frame (1) is fixedly connected to a traction plate (20). The traction plate (20) is fixedly connected to the bearing plate (3). A cross plate (21) is fixedly connected between the two tooth plates (19). A spray head (22) is installed on the cross plate (21).
2. The wet cleaning apparatus for semiconductor production according to claim 1, wherein: The shelf (6) is provided with a strip groove corresponding to the position of the clamp (11), and a slide rod (23) is fixedly connected in the strip groove. The clamp (11) is slidably sleeved on the slide rod (23).
3. The apparatus according to claim 1, wherein: Limiting grooves are provided on both inner walls of the beam frame (1), and limiting rods (24) are fixedly connected in the limiting grooves. The traction plate (20) is slidably sleeved on the limiting rods (24).
4. The apparatus according to claim 1, wherein: The storage box (2) is equipped with a drain pipe (9), and a control valve is provided at one end of the drain pipe (9).
5. The apparatus according to claim 1, wherein: The support plate (3) is provided with multiple drainage holes.
6. The apparatus according to claim 1, wherein: The outer wall of the sleeve (14) is provided with multiple anti-slip textures, all of which are inclined.