一种电子材料表面处理一体化装置
By integrating ultrasonic cleaning and hot air drying into an integrated surface treatment device for electronic materials, the problems of low production efficiency and energy waste in existing technologies have been solved, and a highly efficient and automated surface treatment process has been achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIAN YISHENG ELECTRONIC MATERIALS CO LTD
- Filing Date
- 2025-07-08
- Publication Date
- 2026-07-17
AI Technical Summary
Existing electronic material surface treatment equipment requires cleaning before placing the material into a drying device, resulting in low production efficiency. Furthermore, the need for repeated heating in the independent drying equipment leads to energy waste, and the transfer of workpieces affects the subsequent processing results.
Design an integrated surface treatment device for electronic materials that combines ultrasonic cleaning and hot air drying. The device uses a hydraulic cylinder-driven sealing cover for automatic lifting and lowering. Combined with a spring clamping mechanism and push plate linkage design, it ensures that the components are stably immersed in the cleaning medium. During the drying stage, the hot air is guided by a flow equalization plate in different zones. The circular ventilation holes and rectangular ventilation openings work together with the heating grid and fan forced convection system to improve the uniformity and efficiency of drying.
It has enabled automated operation of electronic material surface treatment, improved production efficiency, reduced energy waste, avoided the risk of secondary contamination caused by workpiece transfer, and improved drying uniformity and efficiency.
Smart Images
Figure CN224507858U_ABST
Abstract
Claims
1. An electronic material surface treatment integrated device characterized by comprising: a surface treatment device; and a surface inspection device, wherein the surface treatment device and the surface inspection device are integrated. include: Ultrasonic cleaning machine (1); The cleaning mechanism includes a sealing cover (5), a gas distribution box (10), a spring (11), a positioning plate (12), a push plate (14), a placement frame (15), a slider (16), and a spring rod (17). The sealing cover (5) is located on the top of the ultrasonic cleaner (1). The gas distribution box (10) is fixedly connected to the bottom of the sealing cover (5). There are multiple springs (11) and they are all fixedly connected to the bottom of the gas distribution box (10). The positioning plate (12) is fixedly connected to the bottom of the springs (11). There are four push plates (14) and they are fixedly connected to the four bottom corners of the positioning plate (12). The placement frame (15) is slidably connected inside the ultrasonic cleaner (1). There are two sliders (16) and they are fixedly connected to both sides of the placement frame (15). The sliders (16) are slidably connected inside the ultrasonic cleaner (1). The spring rod (17) is fixedly connected to the bottom of the placement frame (15) and is located inside the ultrasonic cleaner (1).
2. The electronic material surface treatment integrated device according to claim 1, characterized in that: A protective shell (6) is fixedly connected to the surface of the sealing cover (5), a fan motor (7) is fixedly connected to the top of the protective shell (6), a heating grid (9) is fixedly connected to the surface of the sealing cover (5), a fan (8) is provided on the top of the sealing cover (5), and the fan (8) and the heating grid (9) are both located inside the protective shell (6).
3. The electronic material surface treatment integrated device according to claim 1, characterized in that: The surface of the gas distribution box (10) is fixedly connected to a flow equalization plate (18), and the surface of the flow equalization plate (18) is respectively provided with an inner flow distribution area A (19) and an outer flow distribution area (20).
4. The electronic material surface treatment integrated device according to claim 3, characterized in that: The surface of the flow equalization plate (18) is provided with a plurality of circular ventilation holes (21) and a plurality of rectangular ventilation openings (22).
5. The integrated surface treatment device for electronic materials according to claim 4, characterized in that: The circular ventilation hole (21) is opened on the surface of the inner diversion zone A (19), and the rectangular ventilation opening (22) is opened on the surface of the outer diversion zone (20).
6. The electronic material surface treatment integrated device according to claim 1, wherein: The surface of the positioning plate (12) is fixedly connected with a pressure mesh (13), and the bottom of the push plate (14) is in contact with the placement frame (15).
7. The electronic material surface treatment integrated device according to claim 1, characterized in that: The ultrasonic cleaner (1) has a side plate (3) fixedly connected to its surface, a hydraulic cylinder (4) fixedly connected to the top of the side plate (3), the output end of the hydraulic cylinder (4) fixedly connected to the sealing cover (5), and a control panel (2) fixedly connected to its surface.