一种半导体颗粒物清洗槽体

By using an ultrasonic transducer and a servo motor-driven support plate inside the ultrasonic cleaning tank, combined with a spraying assembly, the problem of existing cleaning equipment being unable to thoroughly remove particulate matter from semiconductor surfaces is solved, achieving a highly efficient and low-cost cleaning effect.

CN224507868UActive Publication Date: 2026-07-17MATA HUAYAN TECH (SUZHOU) CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
MATA HUAYAN TECH (SUZHOU) CO LTD
Filing Date
2025-08-05
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing cleaning equipment is insufficient to meet the requirements of high-precision cleaning of tiny particles on semiconductor surfaces, and chemical solvent cleaning may cause corrosion to semiconductor materials or result in incomplete cleaning, especially in semiconductor devices with complex structures.

Method used

The ultrasonic cleaning tank uses an ultrasonic transducer and a servo motor-driven support plate, combined with a spraying assembly, to achieve ultrasonic cleaning and vertical spraying of cleaning fluid, ensuring that particulate matter is removed and preventing re-adhesion.

Benefits of technology

It achieves efficient removal of particulate matter from semiconductor surfaces, reduces cleaning costs, and protects the integrity of semiconductor materials.

✦ Generated by Eureka AI based on patent content.

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Abstract

本实用新型公开了一种半导体颗粒物清洗槽体,包括超声波清洗槽与安装在其内部的两个超声换能器,所述超声波清洗槽的内部开设有清洗腔,所述超声换能器位于清洗腔的内部,所述超声波清洗槽的内壁上开设有通槽,所述超声波清洗槽的内壁上固定安装有两个伺服电机,所述超声波清洗槽的内顶壁上转动连接有两个调节丝杆。该实用新型,通过在超声波清洗槽内分出清洗腔实现对半导体的超声清洗,使得颗粒物从半导体上脱落至清洗液内部,同时通过垂直移动的承载板可带动装配花篮垂直运动,进而便于对半导体进行装配,且通过顶部喷洒组件可在完成超声清洗后的半导体顶部喷洒清洗液,使得附着的部分颗粒物脱落完成高效清洁。
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Claims

1. A semiconductor particle cleaning tank comprising an ultrasonic cleaning tank (1) and two ultrasonic transducers (2) installed inside the tank, characterized in that: The ultrasonic cleaning tank (1) has a cleaning chamber (3) inside, the ultrasonic transducer (2) is located inside the cleaning chamber (3), the ultrasonic cleaning tank (1) has a through groove (4) on its inner wall, two servo motors (5) are fixedly installed on the inner wall of the ultrasonic cleaning tank (1), two adjusting screws (6) are rotatably connected to the inner top wall of the ultrasonic cleaning tank (1), the bottom end of the adjusting screw (6) passes through the through groove (4) and is rotatably connected to the inner wall of the cleaning chamber (3), a support plate (7) is slidably connected to the inner wall of the ultrasonic cleaning tank (1), the support plate (7) is threaded to the adjusting screw (6), an assembly basket (8) is detachably installed on the top of the support plate (7), drainage grooves (9) are provided on both the left and right sides of the ultrasonic cleaning tank (1), and spraying components (10) are provided on both the front and back of the ultrasonic cleaning tank (1). The spraying assembly (10) includes a mounting groove (1001) which is formed on the ultrasonic cleaning tank (1). A diversion box (1002) is slidably connected to the inner wall of the mounting groove (1001). Spray nozzles (1003) arranged at equal intervals are fixedly installed on the diversion box (1002). An electric push rod (1004) is fixedly installed on the ultrasonic cleaning tank (1). The output end of the electric push rod (1004) passes through the ultrasonic cleaning tank (1) and is fixedly connected to the diversion box (1002).

2. The semiconductor particle cleaning tank of claim 1, wherein: Collection boxes (11) are installed on both the left and right sides of the ultrasonic cleaning tank (1), and the collection boxes (11) are located at the bottom of the drain tank (9).

3. The semiconductor particle cleaning tank of claim 1, wherein: The output shaft of the servo motor (5) and the top of the adjusting screw (6) are both equipped with gears, and the two gears mesh with each other.

4. The semiconductor particle cleaning tank of claim 1, wherein: The inner wall of the bearing plate (7) and the through groove (4) are made to slide and seal.

5. The semiconductor particle cleaning tank of claim 1, wherein: The ultrasonic cleaning tank (1) has two guide seats (12) integrally formed on its inner wall, and the two guide seats (12) are located on the left and right sides of the through groove (4) respectively.

6. The semiconductor particle cleaning tank of claim 1, wherein: The ultrasonic cleaning tank (1) has a limiting groove (13) on its inner wall, and the bearing plate (7) is slidably connected to the inner wall of the limiting groove (13).