抽真空装置及半导体加工设备
By introducing an automatic cleaning vacuum device into semiconductor processing equipment, the problem of excessive pressure caused by polymer residues in connecting pipes and butterfly valves was solved, achieving automated cleaning and efficient operation of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI INTEGRATED CIRCUIT EQUIPMENT & MATERIALS INDUSTRY INNOVATION CENTER CO LTD
- Filing Date
- 2025-07-11
- Publication Date
- 2026-07-17
AI Technical Summary
In existing semiconductor processing equipment, excessive pressure caused by polymer residues in connecting pipes and butterfly valves leads to frequent shutdowns for maintenance, reducing equipment utilization and cleaning efficiency.
Design a vacuum pumping device equipped with cleaning components and a control unit. It automatically cleans by introducing cleaning gas into vacuum pipes and valves, reducing the frequency of manual disassembly and maintenance. The cleaning process is monitored and controlled in real time using a pressure detection mechanism.
It enables automatic cleaning of vacuum pipelines and valves, extends equipment maintenance cycles, improves production efficiency, reduces manpower requirements, and enhances equipment operational stability and processing precision.
Smart Images
Figure CN224507910U_ABST
Abstract
Claims
1. A vacuuming device comprising a vacuum pipe, a valve assembly and a vacuum pump, one end of the vacuum pipe being connected to the vacuum pump and the other end being connected to a reaction chamber, the valve assembly comprising a first valve, the first valve being arranged on the vacuum pipe, characterized in that, The vacuuming device further includes a cleaning component and a control unit. The cleaning component is communicatively connected to the control unit. The cleaning component is used to input cleaning gas into the vacuum pipeline under the drive of the control unit. The cleaning gas is used to remove residual substances in the vacuum pipeline and / or on the first valve.
2. The evacuation device of claim 1, wherein, It also includes a pressure detection mechanism, which is installed on the vacuum pipeline and used to detect the gas pressure in the vacuum pipeline; the pressure detection mechanism is communicatively connected to the control unit, which is used to drive the cleaning component to release the cleaning gas when the gas pressure exceeds a preset pressure range.
3. The evacuation device of claim 2, wherein, The cleaning assembly includes a gas flow controller and a delivery pipeline. The valve assembly includes a second valve. The delivery pipeline is connected to the vacuum pipeline. Both the gas flow controller and the second valve are mounted on the delivery pipeline. Both the gas flow controller and the second valve are communicatively connected to the control unit. The gas flow controller is used to detect the gas flow rate in the delivery pipeline, and the second valve is used to adjust the gas flow rate in the delivery pipeline under the drive of the control unit.
4. The evacuation device of claim 3, wherein, The cleaning assembly also includes a cleaning liquid input device disposed at one end of the delivery pipe; the cleaning liquid input device is communicatively connected to the control unit and is used to input cleaning liquid into the delivery pipe under the drive of the control unit, the cleaning liquid being able to be converted into the cleaning gas within the delivery pipe.
5. The evacuation device of claim 4, wherein, The cleaning assembly further includes a vaporizer disposed on the delivery pipe and located between the cleaning liquid inlet and the gas flow controller; one or more delivery pipes are disposed between the vaporizer and the reaction chamber, and the gas flow controller is disposed on each delivery pipe; the vaporizer is communicatively connected to the control unit and is used to vaporize the cleaning liquid to form the cleaning gas.
6. The evacuation device of claim 5, wherein, The valve assembly further includes a third valve disposed on the delivery pipe and located between the cleaning fluid inlet and the vaporizer; the third valve is communicatively connected to the control unit.
7. A vacuumizing device according to any one of claims 4-6, characterized in that It also includes a gas chromatograph, which is installed on the vacuum pipeline and used to analyze changes in the substance content of the gas in the vacuum pipeline; the gas chromatograph is communicatively connected to the control unit, which is used to control the type of cleaning liquid output by the cleaning liquid input device according to the detection results of the gas chromatograph.
8. A vacuumizing device according to any one of claims 2-6, characterized in that The pressure detection mechanism is installed on the vacuum pipe between the first valve and the vacuum pump.
9. A vacuumizing device according to any one of claims 2-6, characterized in that The number of pressure detection mechanisms is multiple, at least one of the pressure detection mechanisms is installed on the vacuum pipe between the first valve and the vacuum pump, and at least one of the pressure detection mechanisms is installed on the vacuum pipe between the first valve and the reaction chamber.
10. A semiconductor processing apparatus, characterized by comprising: A reaction chamber and a vacuum pumping device as claimed in any one of claims 1-9, said vacuum pumping device being in communication with said reaction chamber and being arranged to pump gas out of said reaction chamber.