半导体晶圆清洗装置

Abstract

本实用新型提供一种半导体晶圆清洗装置，通过沿横向均匀布设的若干个立板，以及设置在其上的支撑组件实现对多个晶圆的同时竖向支撑与旋转驱动。同步驱动组件确保所有支撑组件协调运转，使得多个晶圆能够同步稳定旋转。位于立板上方的喷淋组件持续向旋转中的晶圆喷射清洗介质，而位于晶圆两侧的多个清洗刷则由清洗驱动组件控制，实现同步靠近或远离晶圆进行机械刷洗。特别地，清洗刷上设有用于嵌设晶圆边缘部分的缺口，以增强边缘区域的清洗效果。这种设计不仅提高了清洗效率和设备利用率，还有效解决了晶圆边缘难以彻底清洗的问题，提升了整体洁净度和产品良率。

Claims

1. A semiconductor wafer cleaning apparatus, characterized by comprising: include: Several vertical panels evenly distributed along the horizontal direction; A number of support components are correspondingly disposed on the upright plate, the support components being used to vertically support the wafer and drive the wafer to rotate; A synchronous drive component that synchronously drives several of the aforementioned support components; A spray assembly, located above the upright plate, is used to spray cleaning media onto the rotating wafer; Multiple cleaning brushes located on both sides of several wafers; A cleaning drive assembly for simultaneously driving multiple cleaning brushes to move synchronously closer to or further away from the wafer.

2. The semiconductor wafer cleaning apparatus according to claim 1, characterized by: The support assembly includes a support roller located at the bottom of the wafer and limiting rollers symmetrically arranged on both sides of the wafer.

3. The semiconductor wafer cleaning apparatus of claim 2, wherein: The synchronous drive assembly includes a rotating rod connecting several support rollers and several limiting rollers located on the same side, a pulley disposed at the end of the rotating rod, a belt sleeved between the pulleys, and a synchronous drive motor for driving one of the pulleys to rotate.

4. The semiconductor wafer cleaning apparatus of claim 1, wherein: The cleaning drive assembly includes two mounting plates symmetrically arranged in the transverse direction below the vertical plate, a plurality of uprights arranged on the mounting plates, and a drive unit that synchronously drives the two mounting plates to move closer or further apart from each other. The cleaning brush is provided at the top of the pole.

5. The semiconductor wafer cleaning apparatus of claim 4, wherein: The drive unit includes a cleaning motor, a gear disposed at the output end of the cleaning motor, racks arranged along the longitudinal direction and meshing with the gears, and a guide rail for embedding the racks. The end of the rack away from the gear is connected to the mounting plate.

6. The semiconductor wafer cleaning apparatus of claim 5, wherein: Both mounting plates are provided with slide rails arranged parallel to the rack below, and the lower end of the slide rails is provided with sliders that slide on the slide rails.

7. The semiconductor wafer cleaning apparatus of claim 1, wherein: The cleaning brush has notches for embedding the edge portion of the wafer.

8. The semiconductor wafer cleaning apparatus according to claim 1, characterized in that: The spray assembly includes several spray pipes arranged longitudinally and several nozzles disposed on the spray pipes.

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