一种用于焊锡丝生产的模具

By designing replacement and cleaning components for the mold, the problem of downtime caused by frequent mold changes in solder wire production was solved, enabling rapid mold head replacement and solder wire cleaning, thereby improving production efficiency and mold life.

CN224508057UActive Publication Date: 2026-07-17TIANJIN SONGBEN ENVIRONMENTAL PROTECTION SCI & TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
TIANJIN SONGBEN ENVIRONMENTAL PROTECTION SCI & TECH
Filing Date
2025-08-12
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing solder wire molds require frequent mold changes when producing solder wires of different diameters, resulting in long production line downtime and reduced production efficiency.

Method used

Design a mold that includes a mold frame and a cleaning component. The mold frame is equipped with a replacement component that enables quick replacement of the wire drawing die head via a rotating block and a screw. It is also equipped with a motor-driven cleaning component to remove impurities from the surface of the solder wire.

Benefits of technology

It enables quick replacement of wire drawing die heads, reduces production line downtime, improves production continuity and efficiency, and extends the service life of the die.

✦ Generated by Eureka AI based on patent content.

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Abstract

本实用新型涉及焊锡丝生产技术领域,公开了一种用于焊锡丝生产的模具,包括模架。本实用新型通过人员通过把手带动定位杆进行运动,使定位杆带动限位片从而对弹簧进行压缩,定位杆滑动在连接板内部,当定位杆脱离定位孔后,此时人员通过转动圆柱,使圆柱带动转动块转动在内槽外壁,在圆柱内部设置有拉丝模头,从而可以快速根据生产需要切换不同的拉丝模头,大幅缩短了更换所需的人员操作时间,有效减少了因换模导致的生产线停机时长,显著提升了生产的连续性与效率,切换完成后,弹簧弹性通过限位片推动定位杆,使定位杆重新插入定位孔,从而对圆柱固定,拉丝模头与固定块固定,通过拆卸螺杆,可以对拉丝模头进行维修或者保养更换。
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Claims

1. A mold for solder wire production, characterized by, Includes a mold frame (1), wherein a replacement component (2) is provided inside the mold frame (1), and a cleaning component (3) is provided on the outer wall of the mold frame (1). The replacement component (2) includes an inner groove (201) which is located inside the mold frame (1). A rotating block (202) is rotatably connected to the outer wall of the inner groove (201). A cylinder (203) is fixedly connected to the inner wall of the rotating block (202). A screw (204) is threadedly connected to the inside of the cylinder (203). A fixing block (205) is threadedly connected to the screw (204). A wire drawing die head (206) is fixedly connected to the outer wall of the fixing block (205). The rotating block (202)... The positioning hole (207) is provided inside. A positioning rod (208) is slidably connected to the outer wall of the positioning hole (207). A limiting piece (209) is fixedly connected to the outer wall of the positioning rod (208). A handle (210) is fixedly connected to the end of the positioning rod (208) away from the limiting piece (209). A spring (211) is sleeved on the outer wall of the positioning rod (208). A connecting plate (212) is slidably connected to the outer wall of the positioning rod (208). The connecting plate (212) is fixedly connected to the top of the mold frame (1).

2. A mold for solder wire production as claimed in claim 1, characterized in that: The cleaning component (3) includes a fixing plate (301) which is fixedly connected to the outer wall of the mold frame (1).

3. A mold for solder wire production as claimed in claim 2, characterized in that: A motor (302) is fixedly connected to the top of the fixed plate (301), and a gear (303) is fixedly connected to the output end of the motor (302).

4. A mold for solder wire production as claimed in claim 3, characterized in that: The gear (303) is meshed with a gear (304), and a sleeve (305) is fixedly connected to the inner wall of the gear (304).

5. A mold for solder wire production as claimed in claim 4, characterized in that: A brush wheel (306) is fixedly connected to the outer wall of the sleeve (305) away from the gear (304), and a fixing column (307) is rotatably connected to the inner wall of the sleeve (305). The fixing column (307) is fixedly connected to the outer wall of the mold frame (1).

6. The mold for solder wire production as claimed in claim 1, wherein: The outer wall of the mold frame (1) is fixedly connected to a support plate (4), and the top of the support plate (4) is fixedly connected to a dust suction nozzle (5).

7. A mold for solder wire production as claimed in claim 6, characterized in that: The suction nozzle (5) is internally connected to a pipe (6), and the end of the pipe (6) away from the suction nozzle (5) is connected to a suction box (7).