一种集成电路芯片加工用点焊机构
By introducing a waste gas absorption component and a loading and feeding component into the spot welding mechanism, the problems of smoke pollution and long clamping time during the welding process are solved, and the effects of smoke absorption and rapid loading are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU GEM NANO MATERIAL TECH CO LTD
- Filing Date
- 2025-07-03
- Publication Date
- 2026-07-17
AI Technical Summary
The toxic fumes generated during the welding process directly affect environmental safety, and the integrated circuit chips require a lot of time to be stably clamped after welding, resulting in a slow feeding speed.
An exhaust gas absorption component and a loading component were designed. The exhaust gas absorption component absorbs toxic fumes through the filter element in the filter box, and the loading component achieves quick clamping and fixation through the combination of the embedded block and the protruding outer frame.
It effectively absorbs toxic fumes during the welding process, simplifies the maintenance process, and improves the loading efficiency and welding speed of integrated circuit chips.
Smart Images
Figure CN224508650U_ABST
Abstract
Claims
1. A spot welding mechanism for integrated circuit chip processing, characterized in that, include: A work box (1) is fixedly connected to an extension groove plate (2) on one side of the work box (1), and an operating frame (3) is fixedly connected to one side of the inner wall of the work box (1). A telescopic rod (4) is connected to the bottom of the operating frame (3) through a movable frame, and a welding head (5) is fixedly connected to the bottom end of the telescopic rod (4). Loading assembly (6) is used to stably embed and load integrated circuit chips. One side of the loading assembly (6) is fixedly connected to the bottom of the epitaxial groove plate (2). Waste gas absorption assembly (7) is fixedly connected to the back of the inner wall of the working box (1) on one side. The waste gas absorption assembly (7) is used to absorb the waste gas during the spot welding process of integrated circuit chips.
2. The spot welding mechanism for integrated circuit chip processing according to claim 1, characterized by: The loading assembly (6) includes a drive motor (61) fixedly connected to the bottom of the outer groove plate (2). The top of the output shaft of the drive motor (61) is fixedly connected to a chassis (62) via a rotating shaft. The top of the chassis (62) is fixedly connected to a protruding outer frame (63), and the inner wall of the protruding outer frame (63) is movably connected to an embedded block (64).
3. The spot welding mechanism for integrated circuit chip processing according to claim 2, characterized by: A protrusion (65) is fixedly connected to one side of the embedded block (64), and a placement sleeve (66) is fixedly connected to the top of the embedded block (64). A groove (67) is provided on the surface of the placement sleeve (66), and an anti-slip texture is provided on the surface of the groove (67).
4. The spot welding mechanism for integrated circuit chip processing according to claim 1, characterized by: The exhaust gas absorption assembly (7) includes a stabilizing plate (71) fixedly connected to one side of the inner wall of the working box (1). A fan (72) is fixedly connected to one side of the stabilizing plate (71). The air inlet of the fan (72) is connected to a filter box (73) through a flexible hose. A filter element (711) is slidably connected to the inner wall of the filter box (73). An exhaust pipe (74) is connected to the bottom of the filter box (73).
5. The spot welding mechanism for integrated circuit chip processing according to claim 4, characterized by: The top of the filter box (73) is movably connected to a top cover (75), and both sides of the bottom of the top cover (75) are fixedly connected to embedded slot blocks (76).
6. The spot welding mechanism for integrated circuit chip processing according to claim 4, wherein: Both sides of the filter box (73) are fixedly connected to a folding plate (77), a spring (78) is fixedly connected to one side of the folding plate (77), a movable folding plate (79) is fixedly connected to one end of the spring (78), and a connecting rod (710) is fixedly connected to one side of the movable folding plate (79).