A device for solving the problem of tin ion depletion in solder electrolysis
By using a cathode container frame and ion exchange membrane device to prevent tin ion deposition, the problem of tin ion depletion in solder electrolysis is solved, electrolyte enrichment is achieved, electrical efficiency is improved, and costs are reduced.
CN224508652UActive Publication Date: 2026-07-17YUNNAN TIN CO LTD TIN BRANCH
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YUNNAN TIN CO LTD TIN BRANCH
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-17
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Figure CN224508652U_ABST
Abstract
This utility model discloses a device for solving the problem of tin ion depletion in solder electrolysis, comprising: a cathode container frame and an ion exchange membrane; wherein, the cathode container frame includes two T-shaped plates placed front and back, two side strips, and a bottom strip; the T-shaped plates are sealed by three welding strips to form a H-shaped frame, and the two T-shaped plates are welded together by the two side strips and the bottom strip to form the cathode container frame, with one of the side strips having an inlet / outlet hole at its bottom; the ion exchange membrane covers the hollowed-out area formed in the cathode container frame. This device is simple to manufacture; after purchasing the appropriate number of ion exchange membranes from the market, it can be manufactured in one working day and put into use on the third working day; moreover, the device is reusable.
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