一种无铅焊接热风回流焊机
By installing a cooling box on the outside of the reflow soldering machine and using a water-cooled cooling fan and centrifugal fan as the airflow guiding mechanism, the interference of the built-in heat dissipation structure on temperature control is solved, the temperature stability of the lead-free soldering area is achieved, and the soldering quality and efficiency are improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUIZHOU AOSHITONG ELECTRONICS CO LTD
- Filing Date
- 2025-12-23
- Publication Date
- 2026-07-17
AI Technical Summary
The built-in heat dissipation structure of existing lead-free hot air reflow soldering machines can easily interfere with the temperature control of the soldering zone, leading to temperature fluctuations, insufficient solder melting, and cold solder joints.
The cooling box is set up independently outside the reflow soldering machine and connected to the reflow soldering machine through a connecting component. It uses a water-cooled heat sink and a centrifugal fan in conjunction with a flow guiding mechanism to ensure a stable temperature profile and avoid interference from the cooling airflow to the welding area.
This achieves stable temperature in the welding zone, avoids problems such as insufficient solder melting and cold solder joints, and improves welding quality and production efficiency.
Smart Images
Figure CN224508653U_ABST