一种高精度光学元件抛光机
By designing a polishing ring frame and a chip collection system, the problem of chip collection in high-precision optical component polishing machines was solved, achieving clean polishing and efficient chip diversion, thus improving the equipment's performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XINYANG TUZHAN OPTICS CO LTD
- Filing Date
- 2025-06-21
- Publication Date
- 2026-07-17
AI Technical Summary
Existing high-precision optical component polishing machines cannot effectively collect the waste generated during the polishing process, leading to air pollution and debris affecting the polishing quality.
An optical component polishing machine was designed, comprising a polishing ring frame, a polishing inner liner, an upper chip suction ring frame, a lower chip suction ring frame, a flow-through back frame, and a chip suction unit. By setting up an arc-shaped suction groove, an arc-shaped suction plate, a chip suction groove, and a magnetic suction strip, a closed-type polishing operation and rapid chip drainage are achieved.
It enables clean operation of high-precision optical component polishing, avoids air pollution, and improves polishing quality and efficiency.
Smart Images
Figure CN224509250U_ABST
Abstract
Claims
1. A high-precision optical element polisher comprising a polishing ring holder (1), characterized in that: The inner wall of the polishing ring frame (1) is fixedly connected to a polishing inner liner (2), and an arc-shaped groove (3) is opened on the front side of the polishing ring frame (1). An arc-shaped draw plate (4) is movably connected inside the arc-shaped groove (3). The upper chip suction ring frame (5) and the lower chip suction ring frame (6) are provided. The upper chip suction ring frame (5) is fixedly connected to the top of the polishing ring frame (1), and the lower chip suction ring frame (6) is fixedly connected to the bottom of the polishing ring frame (1). A flow-through back frame (7) is provided on the back of the upper chip suction ring frame (5) and the lower chip suction ring frame (6).
2. The high-precision optical element polishing machine according to claim 1, characterized in that: The back center of the flow back frame (7) is provided with a chip suction unit (8), and the inner walls of the upper chip suction ring frame (5) and the lower chip suction ring frame (6) are provided with annular grooves (9) at their ends.
3. The high precision optical element polishing machine of claim 1, wherein: The inner walls of the upper chip suction ring (5) and the lower chip suction ring (6) are provided with a first chip suction groove (10), and the inner walls of the first chip suction groove (10) are uniformly provided with a first chip suction partition (11).
4. The high precision optical element polishing machine of claim 1, wherein: The polishing inner liner (2) is provided with a polishing unit (12) at its top end, and a polishing fixture (13) is fixedly connected to the bottom end of the polishing inner liner (2).
5. The high precision optical element polishing machine of claim 1, wherein: The inner wall of the polishing ring frame (1) is provided with a second chip suction groove (14), and the inner wall of the second chip suction groove (14) is uniformly provided with a second chip suction baffle (15).
6. The high precision optical element polishing machine of claim 5, wherein: A push plate (16) is fixedly connected to one end of the second chip suction groove (14), and a magnetic strip (17) is provided between the push plate (16) and the arc-shaped suction groove (3).