一种锑化镓晶片抛光装置
By introducing a liquid addition mechanism and an adjustment mechanism into the gallium antimonide wafer polishing device, the problems of uneven polishing liquid distribution and inconvenient replacement of the limiting plate are solved, achieving uniform distribution of polishing liquid and efficient polishing effect, and enhancing the adaptability and cleaning capability of the device.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-17
AI Technical Summary
In existing gallium antimonide wafer polishing equipment, the polishing slurry cannot be evenly distributed, resulting in poor polishing quality. Furthermore, the limit plate is inconvenient to replace, and the cleaning effect is unsatisfactory.
A gallium antimonide wafer polishing device was designed, comprising a base, a polishing disc, a liquid addition mechanism, and an adjustment mechanism. Polishing liquid is evenly dripped through an arc-shaped tube and applied by a scraper. The pressure is adjusted by an electric push rod and an adjustment ring to adapt to different wafer requirements.
This achieves uniform distribution of the polishing slurry, improves polishing efficiency and quality, and enhances the versatility and cleaning effect of the device.
Smart Images
Figure CN224509324U_ABST
Abstract
Claims
1. A polishing device for gallium antimonide wafer, comprising a base (1), a controller (11) is arranged on the base (1), characterized in that: A mounting bracket (4) is fixedly installed on the base (1), and an electric push rod (5) is fixedly installed on the mounting bracket (4). Several placement trays (8) are provided at the output end of the electric push rod (5). A wafer body (16) is provided inside the placement tray (8). A pressure plate (9) is pressed onto the wafer body (16). An adjustment mechanism (3) is also provided on the placement tray (8). A polishing disc (10) is rotatably installed on the base (1). A liquid adding mechanism (2) is provided on the mounting bracket (4).
2. A gallium antimonide wafer polishing apparatus as claimed in claim 1, wherein: The output end of the electric push rod (5) is fixedly connected to a connecting frame (6), and a guide rod (7) is fixedly connected to the upper surface of the connecting frame (6). The guide rod (7) slides through the mounting frame (4), and the lower end of the connecting frame (6) is fixedly connected to the placement plate (8).
3. The apparatus for polishing a GaSb wafer according to claim 1, wherein: A motor (12) is fixedly installed inside the base (1). The output end of the motor (12) is fixedly connected to the polishing disc (10). A return groove (13) is provided between the outer edge of the polishing disc (10) and the base (1). A water outlet pipe (14) is fixedly connected to the bottom of the return groove (13).
4. The apparatus for polishing a GaSb wafer of claim 1, wherein: The pressure plate (9) is slidably sleeved inside the placement plate (8), and a spring (91) is sleeved on the pressure plate (9), with the lower end of the spring (91) fixedly connected to the pressure plate (9).
5. A gallium antimonide wafer polishing apparatus as claimed in claim 4, wherein: The adjustment mechanism (3) includes an adjustment ring (31), which is fixedly connected to the upper end of the spring (91). The adjustment ring (31) is slidably connected to the inner wall of the placement plate (8). Several guide rods (32) are fixedly connected to the upper surface of the adjustment ring (31). Several sliding sleeves (33) and screw sleeves (35) are fixedly connected to the upper surface of the placement plate (8). The guide rods (32) slide through the sliding sleeves (33) and the upper end of the placement plate (8).
6. A gallium antimonide wafer polishing apparatus as claimed in claim 5, wherein: The screw sleeve (35) is internally threaded with a screw rod (34), and the lower end of the screw rod (34) is rotatably mounted on the adjusting ring (31).
7. The apparatus of claim 1, wherein: the polishing pad is a polyurethane pad. The liquid adding mechanism (2) includes a liquid storage tank (21), which is fixedly installed on the mounting frame (4). The bottom of the liquid storage tank (21) is connected to several mounting pipes (22), and the bottom of the mounting pipes (22) is fixedly connected to an arc-shaped pipe (23).
8. A gallium antimonide wafer polishing apparatus as claimed in claim 7, wherein: The liquid adding mechanism (2) also includes a scraper (24), which is fixedly connected to the lower surface of the placement tray (8).