一种芯片研磨辅助结构
By designing a chip grinding auxiliary structure, including pads, enclosure components, and filling materials, the problems of unevenness and misalignment during the grinding of small-sized chips are solved, achieving higher grinding accuracy and efficiency, reducing costs, and improving operational convenience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- YIZHIFA TECH (SHENZHEN) CO LTD
- Filing Date
- 2025-08-12
- Publication Date
- 2026-07-17
AI Technical Summary
During chip polishing, especially for delamination operations on small-sized chips (less than 500μm×500μm), it is difficult to achieve uniform pressure control, resulting in uneven polishing and misalignment, which affects the accuracy and reliability of failure analysis.
The chip grinding auxiliary structure includes a pad, a chip support area, a baffle assembly, and a filler material. The pad provides stable support, the baffle assembly forms a closed inner cavity and is consistent with the chip height, and the filler material is coplanar with the chip surface after filling, ensuring the flatness of the grinding process.
It improves the flatness and precision of chip grinding, reduces costs, enhances operational convenience and applicability, significantly improves grinding efficiency and yield, and avoids grinding unevenness and misalignment problems caused by excessively small chip size.
Smart Images
Figure CN224509327U_ABST
Abstract
Claims
1. A chip grinding aid structure, characterized by, include: Gasket; The chip carrier area, located in the central region of the pad, is used to place the chip to be polished; A barrier assembly is disposed on the pad. The barrier assembly includes multiple barrier units, which are disposed around the chip carrier area to form a closed inner cavity. The height of each barrier unit is the same as the height of the chip on the chip carrier area. A filling material is filled into the closed inner cavity, and the upper surface of the filling material is coplanar with the upper surface of the chip and the upper surface of the enclosure assembly.
2. The chip grinding aid structure of claim 1, wherein, The gasket is a silicon gasket, and the thickness of the gasket is between 400μm and 600μm.
3. The chip grinding aid structure of claim 1, wherein, The enclosure unit is a silicon wafer.
4. The chip grinding aid structure of claim 1, wherein, The enclosure assembly has anti-slip texture on the side near the enclosed inner cavity.
5. The chip grinding aid structure of claim 1, wherein The chip to be ground has a size of less than 500μm × 500μm.
6. The chip dicing aid structure according to claim 1, wherein The filler material is AB glue.
7. The chip dicing aid structure according to claim 1, wherein The shortest distance between the enclosure assembly and the chip to be ground is between 1000μm and 3000μm.
8. The chip grinding aid structure of claim 1, wherein, The shape of the enclosure unit is rectangular.
9. The chip grinding aid structure of claim 1, wherein, Also includes: An adhesive is disposed between the chip carrier area and the chip to be ground, and between the enclosure assembly and the gasket.