一种用于双面抛光机台的清洗装置及双面抛光机台
By combining shock waves and ultrasonic waves in the cleaning structure, the problem of difficult removal of agglomerates in the polishing pad pores was solved, thereby improving the polishing rate and silicon wafer quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZING SEMICON CORP
- Filing Date
- 2025-08-14
- Publication Date
- 2026-07-17
Smart Images

Figure CN224509328U_ABST
Abstract
Claims
1. A cleaning device for a double-sided polishing machine, characterized in that, The double-sided polishing machine includes a first polishing pad and a second polishing pad arranged opposite to each other, comprising: A cleaning structure includes a spray component, the spray component includes a first surface and a second surface opposite to the first surface, the first surface and the second surface are respectively provided with at least one water spray nozzle, wherein the first surface faces the first polishing pad and the second surface faces the second polishing pad; A shock wave generator and an ultrasonic transducer are disposed inside the spray component, wherein the shock wave generator is used to emit shock waves to the first polishing pad and the second polishing pad, and the ultrasonic transducer is used to emit ultrasonic waves to the first polishing pad and the second polishing pad.
2. The cleaning apparatus of claim 1, wherein The shock wave generator and the ultrasonic transducer are located in the central region inside the spray component.
3. The cleaning apparatus of claim 1, wherein The cleaning structure further includes a moving component connected to the spraying component, wherein the moving component is a swing rod or a telescopic rod.
4. The cleaning apparatus of claim 3, wherein The spraying component and the moving component are integrally molded.
5. The cleaning apparatus of claim 3, wherein The dimension of the spray component in the direction perpendicular to the axis of the moving component is greater than the dimension of the moving component in the direction perpendicular to its axis.
6. The cleaning apparatus of claim 1, wherein Protective components are respectively provided around the water nozzles on the first and second sides. The protective components are connected to the spraying components and are used to prevent liquid splashing.
7. The cleaning apparatus of claim 6, wherein The protective component is a brush, with the brush located on the edge area of the first surface and surrounding all the water spray nozzles on the first surface, and there is a gap between the brush on the first surface and the first polishing pad. The brush located on the second surface is disposed on the edge area of the second surface and surrounds all the water spray nozzles on the second surface, and there is a gap between the brush located on the second surface and the second polishing pad.
8. The cleaning apparatus of claim 1, wherein The shock wave generator has an energy of 0.01-1 MPa and an action area of 5 mm 2 - 20 mm 2 , and an action distance of 5-50 cm.
9. The cleaning apparatus of claim 1, wherein The power of the ultrasonic transducer is 20W-1000W, the action area is 10cm 2 -20cm 2 , and the action distance is 5cm-50cm.
10. A double-sided polishing machine, characterized by, Includes the cleaning device as described in any one of claims 1-9.