一种晶片抛光用无蜡吸附垫
By using a wax-free adsorption pad for positioning and a vacuum adsorption structure, the problem of cleaning difficulties caused by wax fixation in traditional wafer polishing is solved, achieving stable adsorption and efficient cleaning of wafers of various specifications, and reducing production costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUXI JINGMINGGUANGDIAN TECH CO
- Filing Date
- 2025-08-20
- Publication Date
- 2026-07-17
AI Technical Summary
In the current wafer polishing process, traditional adsorption pads need to be fixed with wax, which makes cleaning difficult and cannot process wafers of different specifications at the same time, affecting production costs and efficiency.
A wax-free adsorption pad was designed, comprising a limiting unit, an adsorption unit, and a drainage unit. It utilizes a telescopic rod and a vacuum tube to achieve stable adsorption of wafers and collection of waste liquid. The vacuum tube provides negative pressure adsorption force and a drainage structure, thus avoiding the use of wax.
It reduces the amount of reagents used in the cleaning process, improves cleaning efficiency, reduces process costs, and can process wafers of different specifications simultaneously.
Smart Images
Figure CN224509346U_ABST
Abstract
Claims
1. A waxless adsorptive pad for wafer polishing, characterized by: include, The limiting unit (100) includes a fixed platform (101), a telescopic rod (102) is provided inside the fixed platform (101), and a limiting block (103) is provided on the telescopic rod (102). The adsorption unit (200) includes an adsorption pad (201) disposed at the geometric center of the fixed stage (101), on which a wafer (202) is placed. The drainage unit (300) includes a waste liquid chamber (301) disposed below the fixed platform (101).
2. A waxless adsorptive pad for wafer polishing according to claim 1, wherein: The fixed platform (101) has a movable groove (104) near the top, and a reset groove (105) connected to the movable groove (104) is provided on the upper surface of the fixed platform (101).
3. A waxless adsorptive pad for wafer polishing according to claim 2, wherein: A water-blocking plate (106) is embedded at the connection between the reset groove (105) and the movable groove (104), and a movable hole (107) is provided on the water-blocking plate (106).
4. A waxless adsorptive pad for wafer polishing according to claim 3, wherein: The telescopic rod (102) is provided inside the movable groove (104), and one end of the telescopic rod (102) is fixedly installed at the bottom of the movable groove (104).
5. A waxless adsorptive pad for wafer polishing according to claim 4, wherein: The telescopic rod (102) passes through the movable hole (107), and the other end of the telescopic rod (102) is provided with the limiting block (103) that cooperates with the reset groove (105).
6. A waxless adsorptive pad for wafer polishing according to claim 5, wherein: A vacuum tube (203) is provided at the geometric center of the bottom surface of the adsorption pad (201), and a countersunk hole (204) is provided at the geometric center of the upper surface of the adsorption pad (201).
7. A waxless adsorptive pad for wafer polishing according to claim 6, wherein: The countersunk hole (204) is connected to the vacuum tube (203). A rubber pad (205) is placed inside the countersunk hole (204). A manifold (206) is formed in a cross shape at the bottom of the rubber pad (205).
8. A wax-free adsorptive pad for wafer polishing according to claim 7, wherein: The rubber pad (205) has an adsorption hole (207) on the manifold (206).
9. A waxless adsorptive pad for wafer polishing according to claim 8, wherein: A drain hole (302) is provided at the bottom side of the waste liquid chamber (301).
10. A waxless adsorptive pad for wafer polishing according to claim 9, wherein: A through hole (303) is provided at the geometric center of the bottom of the waste liquid chamber (301), and the vacuum tube (203) is fixedly installed at the bottom of the waste liquid chamber (301) through the through hole (303).