一种电子元件加工定位模具
By designing a positioning mold with movable slots, limiting blocks, upper clamping blocks, and lower clamping blocks, and combining it with an electric telescopic rod and a snap-fit structure, the problems of poor compatibility of existing positioning mold fixtures and inconvenient replacement of silicone sleeves are solved, achieving strong compatibility clamping and convenient replacement of various electronic components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-06
- Publication Date
- 2026-07-17
AI Technical Summary
Existing positioning molds for electronic component processing suffer from problems such as poor fixture compatibility, resource waste, and inconvenience in replacing silicone sleeves.
A positioning mold comprising a movable groove, a limiting block, an upper clamping block, and a lower clamping block was designed. Combined with an electric telescopic rod, a silicone sleeve, and a snap-fit structure, it enables adaptable clamping of different electronic components, and the silicone sleeve can be easily replaced through a plug-in rod and slider structure.
It achieves strong adaptability to positioning and clamping of various electronic components and convenient replacement of silicone sleeves, improving the adaptability and replacement efficiency of the clamp.
Smart Images

Figure CN224509454U_ABST
Abstract
Claims
1. An electronic component processing positioning mold comprising a base (1), characterized by: A movable frame (2) is provided on the upper part of the base (1). The movable frame (2) is fixedly connected to the movable end of an electric telescopic rod (3) at the rear. The fixed end of the electric telescopic rod (3) is connected to the base (1) through a fixed frame. A movable groove (12) is provided inside the movable frame (2). An upper clamping block (9) and a lower clamping block (16) are slidably connected inside the movable groove (12). The lower part of the upper clamping block (9) fits against the lower clamping block (16). The upper part of the ) is provided with a cover plate (6), and the inside of the cover plate (6) is provided with a top block (4). The lower part of the top block (4) abuts against the upper clamping block (9). The lower part of the upper clamping block (9) is fixedly connected with a plug rod (14). The lower part of the plug rod (14) is sleeved with a plug hole (15) opened by the slider (18). The outer side of the slider (18) is fixedly connected with a silicone sleeve (10). The inside of the silicone sleeve (10) fits against the upper clamping block (9) and the lower clamping block (16).
2. The positioning mold for processing electronic components according to claim 1, wherein: The movable groove (12) is fixedly connected to a limiting block (11), and the outer side of the limiting block (11) is slidably connected to the moving grooves of the upper clamping block (9) and the lower clamping block (16). The limiting block (11) is T-shaped.
3. The positioning mold for processing electronic components according to claim 1, wherein: The interior of the movable groove (12) fits closely with the rear of the clamping block. The movable groove (12) is arranged in a linear array. A supporting spring is provided inside the movable groove (12), and the spring supports the clamping block.
4. The positioning mold for processing electronic components according to claim 1, wherein: The top blocks (4) are arranged in a linear array. A connecting plate (5) is fixedly connected to the upper part of the top blocks (4). The lower part of the connecting plate (5) is attached to the cover plate (6). The cover plate (6) and the connecting plate (5) are connected to the movable frame (2) by connecting bolts (7).
5. The positioning mold for processing electronic components according to claim 1, wherein: The lower clamping block (16) is internally slidably connected with a buckle (8), and the upper clamping block (9) has a slot (13) in the middle, which is connected to the buckle (8).
6. The positioning mold for processing electronic components according to claim 1, wherein: The upper clamping block (9) and the lower clamping block (16) are respectively provided with a sliding groove (17), and a slider (18) is slidably connected inside the sliding groove (17). The slider (18) is T-shaped.