硅棒切割机构

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By designing a detection device for the silicon rod cutting mechanism, the size of the cut part is detected by the displacement difference of the detection part, which solves the problem of difficulty in quickly and accurately obtaining the size of silicon rods in the existing technology, and realizes automated and accurate size measurement.

CN224510103UActive Publication Date: 2026-07-17QINGDAO GAOCE TECH CO LTD

Patent Information

Authority / Receiving Office: CN · China
Patent Type: Utility models(China)
Current Assignee / Owner: QINGDAO GAOCE TECH CO LTD
Filing Date: 2025-05-20
Publication Date: 2026-07-17

AI Technical Summary

Technical Problem

In existing technologies, it is difficult to obtain the dimensions of silicon rods quickly and accurately after cutting, requiring manual measurement, which consumes a lot of manpower.

Method used

A silicon rod cutting mechanism was designed, including a cutting head and a detection device. The size of the cut part is detected by the displacement difference between the first detection part and the second detection part. The size of the cut part is recorded, calculated and displayed by the displacement detection structure and the drive cylinder.

Benefits of technology

It enables the rapid and accurate acquisition of the dimensions of the cut parts, reducing the need for manual measurement and improving the automation and accuracy of measurement.

✦ Generated by Eureka AI based on patent content.

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Figure CN224510103U_ABST

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Abstract

本实用新型提供了一种硅棒切割机构，包括：切割机头包括间隔设置的第一切割部和第二切割部；检测装置包括位移检测结构、间隔设置的第一检测部和第二检测部；当检测装置处于检测位置时，第一检测部和第二检测部夹设在位于切割空间内的切割完成件上；当检测装置处于避让位置时，第一检测部和第二检测部分别设置在切割空间的两侧；其中，第一检测部和第二检测部中的至少一个向靠近或远离另一个的方向移动以切换至检测位置或避让位置，位移检测结构用于对第一检测部和第二检测部分别在检测位置和避让位置之间的位移差进行检测。通过本实用新型提供的技术方案，能够解决现有技术中不便于快速获取切割后的硅棒的尺寸的技术问题。

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Claims

1. A silicon rod cutting mechanism, characterized by, The cutting machine head (10) is movably arranged, and the cutting machine head (10) comprises a first cutting part (11) and a second cutting part (12) arranged at intervals, and a cutting space (13) is formed between the first cutting part (11) and the second cutting part (12). The detection device (20) comprises a displacement detection structure (21), a first detection part (22) and a second detection part (23) arranged at intervals; when the detection device (20) is in a detection position, the first detection part (22) and the second detection part (23) are clamped on a cutting completion piece located in the cutting space (13); when the detection device (20) is in a avoiding position, the first detection part (22) and the second detection part (23) are arranged on both sides of the cutting space (13) respectively. At least one of the first detection part (22) and the second detection part (23) moves towards or away from the other to switch to the detection position or the avoiding position, and the displacement detection structure (21) is used to detect the displacement difference between the first detection part (22) and the second detection part (23) in the detection position and the avoiding position respectively. The first detection part (22) and the second detection part (23) are arranged close to or away from each other, and the displacement detection structure (21) comprises:

2. The silicon-rod cutting mechanism according to claim 1, wherein A first displacement detection piece connected with the first detection part (22) or arranged towards the second detection part (23), and the first displacement detection piece is used to detect the displacement of the first detection part (22); A second displacement detection piece connected with the second detection part (23) or arranged towards the second detection part (23), and the second displacement detection piece is used to detect the displacement of the second detection part (23). The displacement detection structure (21) comprises: A first driving cylinder (211) drivingly connected with the first detection part (22) and driving the first detection part (22) to move, the first driving cylinder (211) is telescopically arranged, and the first driving cylinder (211) is used to record the driving parameters of the first detection part (22) in the detection position and the avoiding position, and obtain the displacement difference of the first detection part (22); 3. The silicon-rod cutting mechanism according to claim 1, wherein A second driving cylinder (212) drivingly connected with the second detection part (23) and driving the second detection part (23) to move, the second driving cylinder (212) is telescopically arranged, and the second driving cylinder (212) is used to record the driving parameters of the second detection part (23) in the detection position and the avoiding position, and obtain the displacement difference of the second detection part (23).

4. The silicon rod cutting mechanism according to claim 3, wherein The displacement detection structure (21) further comprises a display part, the first driving cylinder (211) and the second driving cylinder (212) are connected with the display part, and the display part is used for displaying the displacement difference between the detection position and the avoidance position of the first detection part (22) and the displacement difference between the detection position and the avoidance position of the second detection part (23); or, the first detection part (22) and the second detection part (23) have a preset distance when the detection device (20) is in the avoidance position; the displacement detection structure (21) further comprises: A calculation module, the first driving cylinder (211) and the second driving cylinder (212) are electrically connected with the calculation module, and the calculation module determines the size of the cutting finished piece according to the preset distance and the driving parameters of the first driving cylinder (211) and the second driving cylinder (212); A display module electrically connected with the calculation module, the display module is used for displaying the size of the cutting finished piece calculated by the calculation module.

5. The silicon-rod cutting mechanism according to claim 1, wherein The displacement detection structure (21) comprises: A first scale is arranged on the first detection part (22) and extends along the moving direction of the first detection part (22); and / or, A second scale is arranged on the second detection part (23) and extends along the moving direction of the second detection part (23).

6. The silicon-rod cutting mechanism according to claim 1, wherein The cutting head (10) further comprises: A first cutting seat (14), the first cutting part (11) is installed on the first cutting seat (14), the first detection part (22) is movably arranged on the first cutting seat (14), and the first cutting seat (14) is movably arranged along the cutting direction; A second cutting seat (15) is arranged at intervals with the second cutting seat (15), the second cutting part (12) is installed on the second cutting seat (15), the first detection part (22) is movably arranged on the second cutting seat (15), and the second cutting seat (15) is movably arranged along the cutting direction.

7. The silicon-rod cutting mechanism according to claim 6, wherein The first cutting seat (14) is provided with a first avoidance hole (141); when the detection device (20) is in the detection position, the contact end of the first detection part (22) is arranged on the side of the first avoidance hole (141) close to the cutting space (13); when the detection device (20) is in the avoidance position, the contact end of the first detection part (22) is flush with the end of the side of the first avoidance hole (141) close to the cutting space (13), or is located on the side of the end of the side of the first avoidance hole (141) close to the cutting space (13) away from the cutting space (13); The second cutting seat (15) is provided with a second avoiding hole (151); when the detection device (20) is in the detection position, the contact end of the second detection part (23) is arranged on the side of the second avoiding hole (151) close to the cutting space (13); when the detection device (20) is in the avoiding position, the contact end of the second detection part (23) is flush with the end of the second avoiding hole (151) close to the cutting space (13), or is located on the side of the end of the second avoiding hole (151) close to the cutting space (13) away from the cutting space (13).

8. The silicon rod cutting mechanism according to claim 7, characterized in that, the first avoiding hole (141) is a through hole, the displacement detection structure (21) comprises a first driving structure, the first driving structure is drivingly connected with the first detection part (22), at least part of the first driving structure is arranged on the side of the first avoiding hole (141) away from the cutting space (13), and the first detection part (22) is movably arranged at the first avoiding hole (141); and / or, the second avoiding hole (151) is a through hole, the displacement detection structure (21) comprises a second driving structure, the second driving structure is drivingly connected with the second detection part (23), at least part of the second driving structure is arranged on the side of the first avoiding hole (141) away from the cutting space (13), and the first detection part (22) is movably arranged at the first avoiding hole (141).

9. The silicon-rod cutting mechanism according to claim 3, wherein The silicon rod cutting mechanism further comprises: a first protective cover (31), one end of the first protective cover (31) is connected with the first detection part (22), the other end of the first protective cover (31) is fixedly connected with the shell of the first driving cylinder (211), the first protective cover (31) covers at least part of the first detection part (22) and the first driving cylinder (211), and the first protective cover (31) is telescopically arranged along the moving direction of the first detection part (22); and / or, a second protective cover (32), one end of the second protective cover (32) is connected with the second detection part (23), the other end of the second protective cover (32) is fixedly connected with the shell of the second driving cylinder (212), the second protective cover (32) covers at least part of the second detection part (23) and the second driving cylinder (212), and the second protective cover (32) is telescopically arranged along the moving direction of the second detection part (23).

10. The silicon-rod cutting mechanism according to claim 3, wherein The silicon rod cutting mechanism further comprises: a first protective shell (41) sleeved on the first driving cylinder (211), the first protective shell (41) is provided with a first wiring hole (411); and / or, A second protective shell (42) is sleeved on the second driving cylinder (212), and a second wire hole (421) is arranged on the second protective shell (42).