一种晶圆切割装置
By using multiple sets of fixing mechanisms and a hydraulically driven cutting device to firmly fix the wafer, the problems of clamping deformation and low cutting efficiency are solved, achieving efficient and safe wafer cutting.
CN224510105UActive Publication Date: 2026-07-17JIANGXI AISIKAI ELECTRONIC TECHNOLOGY CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGXI AISIKAI ELECTRONIC TECHNOLOGY CO LTD
- Filing Date
- 2025-08-23
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
Existing wafer dicing equipment is prone to product deformation or damage during clamping and fixing, and has low dicing efficiency.
Method used
The wafer is securely fixed by a combination of multiple fixing mechanisms and a hydraulically driven cutting mechanism. The wafer is then circumferentially cut using a rotating cutter, and a locking plate and elastic elements are used to prevent damage to the product.
Benefits of technology
It improves the stability and safety of wafer dicing, increases dicing efficiency, and prevents products from being damaged by the cutting tool during the dicing process.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224510105U_ABST
Abstract
本发明涉及一种晶圆切割装置，包括机台，所述机台顶部设置有凹槽，所述凹槽外侧的机台顶部设置有固定机构，所述机台上方还设置有由液压杆驱动的切割机构；所述固定机构包括电动推杆，所述电动推杆上设置有延伸至机台上方的螺杆，所述螺杆上螺接有螺管，所述螺管上设置有一端延伸至凹槽开口内正上方的固定板；所述切割机构包括由电机驱动的条形座，所述条形座底部两侧设置有滑槽，所述滑槽内设置有用于安装刀具的滑座，所述条形座上设置有穿过滑座的正反丝杆，所述条形座底部还设置有竖管，所述竖管内设置有竖杆，所述竖杆底端通轴承与锁紧板连接，所述竖杆与竖管内顶部之间通过弹性件连接。本发明在对晶圆进行切割时可有效保证其安全性。
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