一种轻便型休闲鞋底加工生产用模具
By designing the guide cylinder and guide pillar and implementing a heat conduction and cooling system, the problems of offset and uneven force during the mold closing process of the shoe sole mold were solved, achieving more efficient production stability and product quality, extending the service life of the mold, and reducing maintenance costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JINJIANG SHIBANG SHOES CO LTD
- Filing Date
- 2025-10-04
- Publication Date
- 2026-07-17
AI Technical Summary
The lack of effective guidance during the mold closing process of shoe sole molds makes them prone to displacement or misalignment, resulting in uneven stress on the mold cavity, burrs, mold damage, and increased scrap rate and maintenance costs.
The design employs a guide cylinder and guide pillar, combined with a buffer base, contact plate, and damper, to ensure precise guidance and uniform pressure distribution during the mold closing process. At the same time, it utilizes a thermally conductive aluminum plate, heat dissipation fins, and a cooling fan for efficient cooling.
It improves the uniformity and flatness of mold closing, reduces the risk of burr generation and mold damage, reduces scrap rate, extends mold life and improves product quality stability, and reduces maintenance costs.
Smart Images
Figure CN224510171U_ABST
Abstract
Claims
1. A mold for processing and producing light casual shoe soles, comprising a mold (1), characterized in that: The mold (1) is fixedly connected to a fixed base plate (3) on both sides. A cover plate (2) is provided on the top of the mold (1). A pressing die head (9) is fixedly connected to the bottom of the cover plate (2). A top plate (4) is fixedly connected to both sides of the cover plate (2). An electric push rod (5) is fixedly connected to the center of the top of the fixed base plate (3). A guide cylinder (6) is fixedly connected to both sides of the top of the fixed base plate (3). A buffer pad (10) is fixedly connected to the bottom of the inner cavity of the guide cylinder (6). A sleeve plate (11) is fixedly connected to the upper surface of the guide cylinder (6). A receiving plate (12) is fixedly connected to the top of the sleeve plate (11) through several dampers (17). A contact plate (8) is fixedly connected to both sides of the bottom of the top plate (4). A guide column (7) is fixedly connected to the bottom of the contact plate (8).
2. The mold for processing and producing a light casual shoe sole according to claim 1, characterized in that: The output end of the electric push rod (5) is fixedly connected to the bottom of the corresponding top plate (4), and the bottom end of the guide column (7) extends through the inner cavity of the corresponding receiving plate (12) and sleeve plate (11) to the inner cavity of the adjacent guide cylinder (6).
3. The mold for processing and producing lightweight casual shoe soles according to claim 1, characterized in that: The bottom of the contact plate (8) abuts against the top of the corresponding receiving plate (12), and the bottom of the guide post (7) abuts against the top of the corresponding buffer pad (10).
4. The mold for processing and producing a light casual shoe sole according to claim 1, characterized in that: The mold (1) has an installation groove (13) on one side, and multiple cooling fans (16) are fixedly installed at the bottom of the inner cavity of the installation groove (13).
5. The mold for processing and producing a light casual shoe sole according to claim 4, characterized in that: The inner cavity of the mounting groove (13) is provided with a heat-conducting aluminum plate (14), and heat dissipation fins (15) are provided below the heat-conducting aluminum plate (14).
6. The mold for processing and producing a light casual shoe sole according to claim 5, characterized in that: The top of the thermally conductive aluminum plate (14) is attached to the top of the inner cavity of the mounting groove (13), and the two sides of the thermally conductive aluminum plate (14) are respectively fixedly connected to the inner wall of the corresponding mounting groove (13).
7. The mold for processing and producing a light casual shoe sole according to claim 6, characterized in that: The top of the heat dissipation fin (15) is attached to the bottom of the heat-conducting aluminum plate (14), and the two sides of the heat dissipation fin (15) are respectively fixedly connected to the inner wall of the corresponding mounting groove (13).