热流道系统
By using a combination of ceramic rings and thermally conductive materials in the hot runner system, the problem of poor sealing was solved, achieving effective sealing of the rubber compound and high-quality molding of injection molded parts, and extending the service life of the hot nozzle.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HAOTES (NANTONG) PRECISION TECH CO LTD
- Filing Date
- 2025-08-21
- Publication Date
- 2026-07-17
AI Technical Summary
In existing hot runner systems, the direct contact sealing method has poor sealing performance, which causes the adhesive to seep into the mold cavity, contaminate the mold and damage the heating element, thus affecting the molding quality of the injection molded parts.
Introducing ceramic rings into the hot runner system utilizes their low coefficient of thermal expansion to ensure a tight fit with the mold hole wall, preventing adhesive from seeping in. The combination of a high thermal conductivity core and a low thermal conductivity shell reduces heat loss and mechanical interference, ensuring sealing and stability.
It effectively prevents the rubber material from seeping into the mold, protects the heating elements, and improves the molding quality of injection molded parts and the stability and energy efficiency of the hot runner system.
Smart Images
Figure CN224510296U_ABST