一种吹塑机下包封装置

By introducing a synchronization component consisting of a synchronizing gear and a synchronizing rod into the encapsulation device of the blow molding machine, the problem of poor synchronization of the encapsulation plate was solved, achieving highly reliable and low-cost synchronous movement, and improving the stability and ease of operation of the equipment.

CN224510386UActive Publication Date: 2026-07-17NINGBO JINGE INTELLIGENT EQUIP CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
NINGBO JINGE INTELLIGENT EQUIP CO LTD
Filing Date
2025-08-22
Publication Date
2026-07-17

Smart Images

  • Figure CN224510386U_ABST
    Figure CN224510386U_ABST
Patent Text Reader

Abstract

本实用新型公开了一种吹塑机下包封装置,包括驱动器和包封板,所述驱动器设置在安装台上,两包封板相对设置,且与安装台滑动配合,所述驱动器用于驱动任一所述包封板移动,两所述包封板之间设置有同步组件,所述同步组件包括同步齿轮,所述同步齿轮两侧均啮合有具有齿槽的同步杆,两所述同步杆的端部分别与对应的包封板相固定。通过同步组件可保障两相对的包封板在移动过程中的同步性,从而提高封包时的可靠性。且本实用新型仅采用单一驱动器即可实现两包封板的同步移动,结构简单操作方便且有效降低成本。
Need to check novelty before this filing date? Find Prior Art

Claims

1. A sealing device for a blow molding machine, comprising a driver and sealing plates, wherein the driver is mounted on a mounting platform, and two sealing plates are disposed opposite to each other and slidably engaged with the mounting platform, characterized in that... The driver is used to drive either of the encapsulation plates to move. A synchronization component is provided between the two encapsulation plates. The synchronization component includes a synchronization gear. Both sides of the synchronization gear are meshed with a synchronizing rod with toothed grooves. The ends of the two synchronizing rods are respectively fixed to the corresponding encapsulation plates.

2. A blow-molded lower package enclosing apparatus according to claim 1, characterized by The mounting platform is fixedly provided with an assembly base, the synchronous gear is rotatably disposed in the assembly base, and the two synchronous rods movably pass through the assembly base.

3. A blow-molded lower package enclosing apparatus according to claim 2, characterized by The synchronous gear is provided with a coaxial rotating shaft, and the two ends of the rotating shaft are rotatably engaged with the mounting base through bearings.

4. A blow-molded lower package enclosing apparatus according to claim 1, characterized by The actuator is a cylinder, and the cylinder's telescopic shaft is equipped with a universal joint, which connects the telescopic shaft to the encapsulation plate.

5. A blow-molded lower package enclosing apparatus according to claim 4, characterized by The mounting platform is equipped with a rotating base, and the driver is hinged to the rotating base.

6. A blow-molded lower package enclosing apparatus according to claim 1, characterized by The mounting platform is provided with two slide rails located on both sides of the sealing plate. Each side of the sealing plate is provided with a slide table, and the slide table slides in cooperation with the corresponding slide rail.

7. A blow-molded lower package enclosing apparatus according to claim 6, characterized by A connecting plate is provided on the lower side of the encapsulation plate, and the slide is fixedly arranged on both sides of the lower part of the connecting plate.

8. A blow-molded lower package enclosing apparatus according to claim 7, characterized by The encapsulation plate is fixed with two connecting rods arranged side by side. The connecting rods have adjustment holes along their length. The connecting plate is screwed with adjusting bolts, and the connecting rods are fixed to the connecting plate by corresponding adjusting bolts.

9. A blow-molded lower package enclosing apparatus according to claim 7, characterized by The connecting plate is equipped with a buffer. When the two sealing plates are closed, the buffer abuts against the buffer on the other connecting plate.

10. A blow-molded lower package enclosing apparatus according to claim 8, characterized by The mounting platform is fixed with a pedal, and the height of the pedal is lower than the height of the encapsulation plate.