一种多层复合板材专用压花模具
By introducing buffer components and quick-release components into the embossing mold, the problems of insufficient impact force control and inconvenient lower mold replacement when pressing multi-layer composite boards by traditional molds are solved, thereby improving the stability and efficiency of the embossing process.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHENGDU MANGO TREE DECORATION MATERIAL CO LTD
- Filing Date
- 2025-07-24
- Publication Date
- 2026-07-17
AI Technical Summary
Traditional embossing molds have insufficient impact control when pressing multi-layer composite boards, which leads to easy cracking of the boards, excessively deep indentations, easy wear of the molds, and cumbersome operation of changing the lower mold, affecting the embossing quality and production efficiency.
The design incorporates a buffer assembly and a quick-release assembly. The buffer assembly provides multi-stage cushioning through rubber blocks and springs, while the quick-release assembly enables rapid disassembly of the lower mold through sliding rods and locking pins, thus mitigating impact forces and improving the stability and flexibility of the mold.
It effectively reduces the impact force during pressing, avoids cracking of the sheet and damage to the mold, improves the stability and safety of the embossing process, and simplifies the process of changing the lower mold, thereby improving production efficiency.
Smart Images
Figure CN224510412U_ABST
Abstract
Claims
1. A special embossing die for multi-layer composite panels comprising a base (1), characterized in that: The base (1) is fixedly connected to the top of a fixing block (2), the fixing block (2) is provided with a lower mold (3), the fixing block (2) is fixedly connected to the top of a fixing rod (4), the outer wall of the fixing rod (4) is slidably connected to a pressure plate (5), the fixing rod (4) is fixedly connected to the top of a fixing plate (6), the fixing plate (6) is fixedly connected to the top of a hydraulic cylinder (7), the output end of the hydraulic cylinder (7) is fixedly connected to the top of the pressure plate (5), the bottom of the pressure plate (5) is provided with an upper mold (8), and the bottom of the pressure plate (5) is provided with a buffer assembly. The buffer assembly includes a rubber block one (10), a rubber block two (12), and a spring one (9) sleeved on the outer wall of the fixing rod (4). The top of the rubber block one (10) is fixedly connected to the bottom of the pressure plate (5), the bottom of the rubber block two (12) is fixedly connected to the top of the fixing block (2), the bottom of the rubber block one (10) is fixedly connected to a connecting rod (11), the outer wall of the connecting rod (11) is slidably connected to the inside of the rubber block two (12), and the top of the fixing block (2) is provided with a quick-release assembly.
2. The embossing die for a multi-layer composite panel according to claim 1, characterized in that: One end of the spring (9) is fixedly connected to the top of the fixed block (2), and the other end of the spring (9) is fixedly connected to the bottom of the pressure plate (5).
3. The embossing die for a multi-layer composite panel according to claim 1, characterized in that: The quick-release assembly includes a support frame (14) and a hollow column (15). The bottom of the support frame (14) is fixedly connected to the top of the fixing block (2), and the outer wall of the hollow column (15) is fixedly connected to the side wall of the support frame (14).
4. The embossing die for a multi-layer composite panel according to claim 3, characterized in that: The hollow column (15) is slidably connected to a sliding rod (16), and a rotating block (17) is fixedly connected to the top of the sliding rod (16).
5. The embossing die for a multi-layer composite panel according to claim 4, characterized in that: The outer wall of the sliding rod (16) is fixedly connected to a connecting column (18), and the outer wall of the connecting column (18) is slidably connected inside the hollow column (15). A groove (19) is provided on the top of the hollow column (15).
6. The embossing die for a multi-layer composite panel according to claim 4, characterized in that: The outer wall of the sliding rod (16) is fixedly connected to a limiting ring (21), and the outer wall of the limiting ring (21) is slidably connected inside the hollow column (15).
7. The embossing die for a multi-layer composite panel according to claim 6, characterized in that: A second spring (20) is provided at the top of the limiting ring (21). One end of the second spring (20) is fixedly connected to the top of the limiting ring (21), and the other end of the second spring (20) is in contact with the inner wall of the hollow column (15).
8. The embossing die for a multi-layer composite panel according to claim 7, characterized in that: The bottom of the limiting ring (21) is fixedly connected to a locking post (22), the outer wall of the locking post (22) is slidably connected to the inside of the hollow column (15), and a locking hole (13) is opened inside the lower mold (3), and the locking post (22) and the locking hole (13) are engaged.