一种锡膏印刷机用量调节机构

By designing components such as a solder paste reservoir, top plate, and servo motor on the solder paste printer, precise adjustment of solder paste usage is achieved, solving the error problem caused by manual operation in existing technologies and improving printing quality and efficiency.

CN224510633UActive Publication Date: 2026-07-17

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Filing Date
2025-07-31
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

The adjustment process of existing solder paste printing machines is mostly manual, relying on the operator's experience, which is prone to human error, resulting in inaccurate control of solder paste usage and affecting printing quality.

Method used

A solder paste printing machine dosage adjustment mechanism was designed, including components such as a paste reservoir, a top plate, and a servo motor. The precise control of the solder paste delivery amount is achieved through the meshing of gears and toothed plates. Combined with a transparent observation window and scale lines, the remaining solder paste can be intuitively monitored and replenished in a timely manner.

Benefits of technology

It enables precise control of solder paste delivery, meets the differentiated needs of different PCB boards, reduces human error, and improves printing quality and efficiency.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224510633U_ABST
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Abstract

本实用新型涉及锡膏印刷机技术领域,具体为一种锡膏印刷机用量调节机构,包括固定架和升降板,所述固定架的表面固定安装有储膏筒,所述储膏筒的表面开设有凹孔,所述储膏筒的内壁滑动连接有密封垫,所述密封垫的表面固定安装有顶板,所述顶板的内部固定插设有推架,所述推架的表面固定安装有齿板,所述齿板的表面与固定架滑动连接,所述齿板的表面开设有限位孔,所述限位孔的内壁滑动连接有两个旋转筒,所述旋转筒的内壁转动连接有固定杆,所述固定杆的表面与固定架固定连接,所述固定架的表面固定安装有驱动件。本实用新型,可以在使用锡膏印刷机时,对锡膏推送量进行精确控制,可满足不同PCB板对锡膏用量的差异化需求。
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Claims

1. A quantity adjusting mechanism for a solder paste printer, comprising a fixing frame (1) and a lifting plate (13), characterized in that: A paste storage cylinder (3) is fixedly mounted on the surface of the fixing frame (1). A recessed hole (5) is provided on the surface of the paste storage cylinder (3). A sealing gasket (20) is slidably connected to the inner wall of the paste storage cylinder (3). A top plate (21) is fixedly mounted on the surface of the sealing gasket (20). A pusher (2) is fixedly inserted inside the top plate (21). A toothed plate (19) is fixedly mounted on the surface of the pusher (2). The surface of the toothed plate (19) is slidably connected to the fixing frame (1). A limit hole (12) is provided on the surface of the toothed plate (19). Two rotating cylinders (11) are slidably connected to the inner wall of the limiting hole (12). A fixed rod (10) is rotatably connected to the inner wall of the rotating cylinder (11). The surface of the fixed rod (10) is fixedly connected to the fixed frame (1). A driving component (8) is fixedly installed on the surface of the fixed frame (1). A gear (9) is fixedly installed on the rotating shaft of the driving component (8). The gear (9) meshes with the toothed plate (19). An adjusting frame (15) is fixedly installed on the surface of the lifting plate (13). The cross section of the adjusting frame (15) is U-shaped.

2. The amount adjusting mechanism for a solder paste printer according to claim 1, characterized in that: A baffle (6) is slidably connected to the inner wall of the concave hole (5), and a lifting plate (13) is fixedly installed on the surface of the baffle (6). A fixing block (14) is slidably connected inside the lifting plate (13), and the surface of the fixing block (14) is fixedly connected to the fixing frame (1).

3. The amount adjusting mechanism for a solder paste printer according to claim 1, wherein: Two guide plates (4) are fixedly installed on the surface of the paste storage cylinder (3).

4. The amount adjusting mechanism for a solder paste printer according to claim 2, wherein: A transparent observation window (7) is fixedly installed inside the baffle (6), and scale lines are provided on the transparent observation window (7).

5. The amount adjusting mechanism for a solder paste printer according to claim 3, wherein: Both guide plates (4) are fixedly inserted with round rods (17), which slide through the lifting plate (13). A round plate (16) is fixedly installed on the upper surface of the round rod (17). A spring (18) is sleeved on the arc surface of the round rod (17). The two ends of the spring (18) are fixedly connected to the round plate (16) and the lifting plate (13) respectively.

6. The amount adjusting mechanism for a solder paste printer according to claim 5, wherein: The driving component (8) is a servo motor.

7. The amount adjusting mechanism for a solder paste printer according to claim 5, wherein: The inner wall of the paste storage cylinder (3) is provided with an anti-stick coating.