Support shaft structure and wafer film pasting device

By employing a sliding connection between a first wedge shaft and a second wedge shaft in the wafer lamination device, the problems of material waste and low processing efficiency are solved, achieving higher material utilization and higher processing efficiency.

CN224511581UActive Publication Date: 2026-07-17ZHEJIANG ICSPROUT SEMICONDUCTOR CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ZHEJIANG ICSPROUT SEMICONDUCTOR CO LTD
Filing Date
2025-07-30
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing wafer lamination equipment suffers from significant material waste during use, impacting processing efficiency.

Method used

The structure employs a support shaft, including a first wedge-shaped shaft and several pairs of second wedge-shaped shafts. Through a sliding connection, the axis of the support shaft structure is made concentric with the center of the wafer film tube, preventing the wafer film tube from rotating during sliding and improving the accuracy of film thickness monitoring.

Benefits of technology

This improves the material utilization rate and processing efficiency in wafer lamination equipment, and reduces material waste.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224511581U_ABST
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Abstract

A support shaft structure and a wafer film pasting device, wherein the support shaft structure comprises a base, a first wedge-shaped shaft arranged on the surface of the base, the first wedge-shaped shaft having a first bearing slope, and a plurality of pairs of second wedge-shaped shafts arranged around the first wedge-shaped shaft, the second wedge-shaped shafts having a second bearing slope, the second bearing slope being parallel to the first bearing slope, and the second bearing slope being in sliding connection with the first bearing slope. By arranging the support shaft structure as the first wedge-shaped shaft and the plurality of pairs of second wedge-shaped shafts, the first bearing slope of the first wedge-shaped shaft and the second bearing slope of the second wedge-shaped shaft can be in sliding connection, and each pair of second wedge-shaped shafts is fixedly connected with the subsequent wafer film cylinder during the sliding process, thereby increasing the accuracy of monitoring the film thickness on the subsequent wafer film cylinder, and improving the material utilization rate and the processing efficiency of the wafer film pasting device.
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Claims

1. A support shaft structure characterized by, include: Base; A first wedge-shaped shaft is disposed on the surface of the base, and the first wedge-shaped shaft has a first bearing inclined surface; A plurality of second wedge shafts are arranged around the first wedge shaft. Each second wedge shaft has a second bearing inclined surface, which is parallel to the first bearing inclined surface and is slidably connected to the first bearing inclined surface.

2. The support shaft structure according to claim 1, wherein The connecting line between the centers of each pair of second wedge shafts passes through the axis of the first wedge shaft.

3. The support shaft structure according to claim 1, wherein The width between each pair of second wedge-shaped shafts ranges from 72 mm to 80 mm.

4. The support shaft structure according to claim 1, wherein The first bearing inclined surface has a first slider, and the second bearing inclined surface has a first sliding track. The first slider is engaged in the first sliding track and slides along the extension direction of the first sliding track.

5. The support shaft structure according to claim 4, wherein Also includes: A first movable shaft, the first end of which passes through the axis of the first wedge-shaped shaft and is fixed inside the first wedge-shaped shaft, and the second end of which passes through the base; a first handle, which is fixedly connected to the second end of the first movable shaft.

6. The support shaft structure according to claim 1, wherein The first bearing inclined surface has a second sliding track, and the second bearing inclined surface has a second slider. The second slider is engaged in the second sliding track and slides along the extension direction of the second sliding track.

7. The support shaft structure according to claim 6, wherein Also includes: The second movable shaft has a first end fixedly connected to the second wedge-shaped shaft, and a second end of the second movable shaft passing through the base. The second handle is fixedly connected to the second end of the second movable shaft.

8. The support shaft structure according to claim 1, wherein The first wedge-shaped shaft is a frustum, and the second wedge-shaped shaft is a partial frustum.

9. The support shaft structure as described in claim 1, characterized in that, The first wedge-shaped axis is a frustum, and the second wedge-shaped axis is a wedge.

10. The support shaft structure according to Claim 1, wherein The number of the second wedge-shaped shafts is one to four pairs.

11. A wafer film attaching apparatus characterized by comprising: include: The wafer film tube and the support shaft structure as described in any one of claims 1 to 10, wherein the wafer film tube is fixedly sleeved on the support shaft structure.

12. The wafer film attaching apparatus according to claim 11, wherein Also includes: A sensor for monitoring the thickness of the wafer film on the wafer film barrel.

13. The wafer film attaching apparatus according to claim 11, wherein The inner diameter of the wafer film tube ranges from 73 mm to 77 mm.