撕膜装置
By coordinating the movement of the film-tearing rollers in the film-tearing device with the conveying unit, and utilizing the high adhesion of the tape, the protective film on the circuit board is quickly removed, solving the problem of residual adhesive caused by manual removal, improving process yield and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GRP UP IND CO LTD
- Filing Date
- 2025-05-29
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, manually removing the protective film can easily lead to residual adhesive, affecting the yield of the circuit board manufacturing process and incurring high costs.
The film-tearing device includes a conveying unit, a film-tearing roller, a tape roll, and a take-up roller. By moving the film-tearing roller relative to the conveying unit, the tape comes into contact with and adheres to the protective film. Then, it moves away to peel off the protective film. The adhesive force of the tape is higher than that of the protective film to the substrate, so that the film can be peeled off quickly.
It enables rapid and residue-free removal of the protective film, improving the yield of circuit board manufacturing processes and reducing labor costs.
Smart Images
Figure CN224511722U_ABST