A laser chip tray

Abstract

This utility model discloses a laser chip tray, comprising: a tray base and an adhesive layer. The top surface of the tray base has a recessed arrangement of several dividing grooves, which are spaced apart along the length of the tray base and extend along its width. The adhesive layer is disposed on the top surface of the tray base, avoiding or covering the areas where the dividing grooves are located. A laser chip bar is placed on the adhesive layer and spans the dividing grooves. Through this method, the laser chip bar of this utility model can be firmly adhered to the adhesive layer, improving stability during transport. The design of the dividing grooves facilitates image acquisition by visual inspection equipment, enabling positioning of the laser chip bar during loading. It also helps reduce the contact area between the laser chip bar and the adhesive layer, facilitating unloading and reducing production costs.

Description

Technical Field

[0001] This utility model relates to the field of laser chip packaging and conveying technology, and in particular to a laser chip tray. Background Technology

[0002] A laser chip bar is a linear array structure formed by arranging multiple laser chips side by side. Laser chip bars facilitate uniform end-face processing, such as cleaving, polishing, and coating, to ensure the optical performance of the laser.

[0003] Laser chip bars require pallets for transport during processing or conveying. Existing chip pallets are typically designed for individual chips. Due to the small size of a single chip, a grid pattern needs to be designed on the pallet to position each chip individually at the intersections of the grid. However, this is not suitable for placing laser chip bars, making it difficult to position them and affecting the smoothness of loading and unloading.

[0004] In addition, existing technologies often use vacuum release membrane boxes to fix the chip. The entire chip is attached to the membrane. The process of removing the chip requires first drawing a vacuum to partially suck the membrane into the mesh below. The uneven structure on the membrane changes the surface contact between the chip and the membrane to point contact, so that the chip can be removed. The process is complex, requires a vacuum platform pick-and-place machine and a mesh, and is costly. Utility Model Content

[0005] The main technical problem solved by this utility model is to provide a laser chip tray suitable for carrying laser chip bars, which improves the positioning effect and material unloading convenience of laser chip bars and reduces costs.

[0006] To solve the above-mentioned technical problems, the present invention provides a laser chip tray, comprising: a tray substrate and an adhesive layer. The top surface of the tray substrate is recessed with a plurality of dividing grooves, which are spaced apart along the length of the tray substrate and extend along the width of the tray substrate. The adhesive layer is disposed on the top surface of the tray substrate, and avoids or covers the area where the dividing grooves are located on the tray substrate. The laser chip bar is placed on the adhesive layer and spans the dividing grooves.

[0007] In a preferred embodiment of the present invention, a gap is left between the two ends of the dividing groove and the corresponding edge of the tray base.

[0008] In a preferred embodiment of the present invention, a step is provided at the bottom edge of the tray base.

[0009] In a preferred embodiment of the present invention, a weight-reducing groove is provided in the recessed bottom of the tray base.

[0010] In a preferred embodiment of this utility model, the adhesive layer is a layer of silicone.

[0011] In a preferred embodiment of the present invention, the top surface of the tray base is recessed and provided with limiting holes located on both sides of the dividing groove, and the bottom of the adhesive layer extends into the limiting holes.

[0012] In a preferred embodiment of this utility model, the limiting hole is a blind hole and is distributed at intervals along the length direction of the dividing groove.

[0013] The beneficial effects of this utility model are as follows: The laser chip tray disclosed in this utility model allows the laser chip bar to be placed on the adhesive layer and bonded together. It has high stability during transportation, and the design of the dividing groove facilitates image acquisition by vision inspection equipment, enabling positioning of the laser chip bar during automatic feeding. It also helps to reduce the contact area between the laser chip bar and the adhesive layer, improving the convenience of unloading. Traditional pick-and-place machines can complete the process, eliminating the need for pick-and-place machines with vacuum platforms and grids, thus reducing production costs. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein: Figure 1 This is a schematic diagram of a preferred embodiment of a laser chip tray according to the present invention; Figure 2 yes Figure 1 A sectional view along line AA. Detailed Implementation

[0015] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0016] Please see Figures 1-2 The embodiments of this utility model include: like Figure 1 and Figure 2The laser chip tray shown is used to carry laser chip bars and includes a tray base 1 and an adhesive layer 2. The top surface of the tray base 1 is recessed with several dividing grooves 11. In this embodiment, the dividing grooves 11 are rectangular blind grooves, and there are gaps between the two ends of the dividing grooves 11 and the corresponding edges of the tray base 1, which is beneficial for the visual inspection equipment to acquire images of the dividing grooves 11 and realize positioning in the system.

[0017] In this embodiment, five dividing grooves 11 are distributed at intervals along the length of the pallet base 1, and the length of the dividing grooves 11 extends along the width of the pallet base 1, making full use of the area on the top surface of the pallet base 1.

[0018] like Figure 1 As shown, a step 13 is provided at the bottom edge of the pallet base 1. The step 13 and the pallet base 1 are made of an integrated plastic structure, which is structurally stable and protects the edge of the pallet base 1 through the step 13.

[0019] like Figure 2 As shown, a weight-reducing groove 14 is recessed at the bottom of the pallet base 1. The weight-reducing groove 14 can reduce the weight of the pallet base 1 and cooperate with the positioning block in the packaging box to position the pallet base 1 in the packaging box, thereby improving the stability of the packaging structure.

[0020] The adhesive layer 2 is placed on the top surface of the tray base 1. The adhesive layer 2 avoids or covers the area where the dividing groove 11 is located on the tray base 1. In order to facilitate the loading and unloading of the laser chip bar, in this embodiment, the adhesive layer 2 avoids the area where the dividing groove 11 is located on the tray base 1. That is to say, the area where the dividing groove 11 is located is not coated with adhesive.

[0021] The laser chip bar strip is placed on the adhesive layer 2 and spans the dividing groove 11. This means the laser chip bar strips can be spaced out along the length of the dividing groove 11, improving space utilization. Furthermore, the laser chip bar strip contacts the adhesive layer 2 at both ends, with the middle suspended above the dividing groove 11, reducing the contact area and adhesion strength. A single contact point length of 0.5~1mm is sufficient to hold the laser chip bar strip in place. Because there are only two contact points, the laser chip bar strip can be removed more easily.

[0022] In this embodiment, the adhesive layer 2 is a layer of silicone. Low-viscosity silicone can be used, which can not only fix the laser chip bar strip, but also avoid the problem of excessive viscosity, ensuring that the laser chip bar strip can be smoothly fed.

[0023] like Figure 2As shown, limiting holes 12 are recessed on the top surface of the tray base 1, located on both sides of the dividing groove 11. The bottom of the adhesive layer 2 extends into the limiting holes 12, and the limiting holes 12 are used to anchor the adhesive layer 2, preventing separation between the adhesive layer 2 and the top surface of the tray base 1. In this embodiment, the limiting holes 12 are blind holes, and are spaced apart along the length of the dividing groove 11, forming multiple anchoring points corresponding to the adhesive layer 2, which helps to improve structural stability.

[0024] In summary, the laser chip tray disclosed in this utility model can be used for carrying laser chip bars, which strengthens the protection of the laser chip bars and facilitates the insertion and removal of the laser chip bars.

[0025] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A laser chip tray for carrying of a bar of laser chips, characterized in that include: The pallet base and the adhesive layer are provided. The top surface of the pallet base is recessed with several dividing grooves. The dividing grooves are distributed at intervals along the length direction of the pallet base and extend along the width direction of the pallet base. The adhesive layer is provided on the top surface of the pallet base. The adhesive layer avoids or covers the area where the dividing grooves are located on the pallet base. The laser chip bar is placed on the adhesive layer and spans the dividing grooves.

2. The laser chip tray according to claim 1, characterized in that There is a gap between the two ends of the dividing groove and the corresponding edge of the tray base.

3. The laser chip tray of claim 1, wherein, A step is provided at the bottom edge of the tray base.

4. The laser chip tray of claim 1, wherein, The bottom of the tray base is recessed and has a weight-reducing groove.

5. The laser chip tray of claim 1, wherein, The adhesive layer is made of a layer of silicone.

6. The laser chip tray of claim 1, wherein, The tray base has recessed limiting holes on both sides of the dividing groove on its top surface, and the bottom of the adhesive layer extends into the limiting holes.

7. The laser chip tray according to claim 6, characterized in that The limiting holes are blind holes and are spaced apart along the length of the dividing groove.

Images